辛国庆｜华中科技大学｜学者主页

2026

Ammonia-Activated High-Pressure laser ablation with Cu mesh assistance enables High-Yield BNNT synthesis for chip thermal management

Wen Si, Bingyang Ma, Lin-Lin Hou, Shutong Tian, Guang-Lan Liao, Li Fang, Guoqing Xin, Hu Long, Tie-Lin Shi

Composites. Part A, Applied science and manufacturing

2026

Diamond/Cu composites microchannel heat sink for effective thermal management of SiC power devices

Kangyong Li, Rong Zhang, Kai Yang, Haoran Shen, Jialiang Chen, Fan-Fan Wang, Jian Huang, Zexin Liu, Yue Yue, Zhiqiang Wang, Guoqing Xin

Applied Thermal Engineering

DOI

2026

A Double-Side Cooled SiC MOSFET Power Module Based on Hermetic Conformal Coating for 250 °C High Temperature Applications

Yun-Chan Wu, Jun Zhao, Han Cao, Peng Li, Bei Zhang, Da Zhou, Rong Zhang, Xingyuan Yan, Guoqing Xin, Zhiqiang Wang

IEEE transactions on power electronics

DOI

2026

A High-Density 3.3 kV/2000 a SiC MOSFET Power Module: Design, Fabrication, and Experimental Evaluation

Yi-Min Zhou, Zhi-Qiang Wang, Lingqi Tan, Chunyang Man, Jia-Long Dou, De-Ao Shen, Yun-Chan Wu, Kai Ma, Yu Liao, Liu Yang, Guoqing Xin, Xiaojie Shi

IEEE transactions on power electronics

DOI

2025

An Efficient Electrothermal Coupling Simulation Method Based on Neural Network-Aided Power Loss Model for Power Module Thermal Optimization

Yayong Yang, Zhi-Qiang Wang, Lingqi Tan, Guoqing Xin, Wu-Bin Kong, Xiaojie Shi

IEEE transactions on power electronics

DOI

2025

A Hermetic Conformal Coating Based High-Temperature Encapsulation Method for 250 °C SiC Power Module

Yun-Chan Wu, Zhi-Qiang Wang, Rong Zhang, Guoqing Xin, Haoran Hu, Xingyuan Yan, Xiaojie Shi

IEEE transactions on power electronics

DOI

2025

Maximizing Power Density in SiC Inverters: Copper-Diamond Composite Embedded Power Modules with Advanced Local Cooling Strategy

Da Zhou, Zhi-Qiang Wang, Kangyong Li, Yu Liao, Chengjin Qian, Neng Wang, Guoqing Xin, Xiaojie Shi

European Conference on Cognitive Ergonomics

DOI

2025

Thin-Film Encapsulation Solution for High-Temperature SiC Power Devices

Rong Zhang, Zexin Liu, Kangyong Li, Li Fang, Yun-Chan Wu, Zhiqiang Wang, Kai Yang, Guoqing Xin

IEEE transactions on power electronics

DOI

2025

An NSGA-II Optimized Manifold Microchannel Heat Sink With Better Heat Dissipation and Superior Thermal Uniformity for SiC Power Modules

Chunyang Man, Zhi-Qiang Wang, Yu Liao, Xiaojie Shi, Guoqing Xin, Yong-Gang Yao, Run Hu

IEEE transactions on power electronics

DOI

2025

Interface-engineered diamond/Cu composites heat sink with skirt-shaped fins for advanced thermal management

Kangyong Li, Shuai Pang, Kai Yang, Xiaoran Yang, Rong Zhang, Haoran Shen, Jialiang Chen, Hao Zhang, Yawei Jiang, X. Hou, Yue Yue, Zexin Liu, Zhi-Qiang Wang, Guoqing Xin

Materials today physics

DOI

2024

新型多级沟槽结势垒肖特基二极管

袁俊，陈伟，郭飞，成志杰，王宽，吴阳阳，辛国庆，王智强

《华中科技大学学报(自然科学版)》

2024

基于栅极参考电压的SiC MOSFET栅极氧化物健康状态在线监测方法

于圣旭，王智强，辛国庆，时晓洁，谭令其，马凯

《电源学报》

2024

Enhancing Thermal Management of Graphene Devices by Self-Assembled Monolayers.

Zexin Liu, Fan-Fan Wang, Xiaofeng Wang, Jian Huang, Yue Yue, Rui-Wen Dai, Kangyong Li, Zhiqiang Wang, Kai Yang, Dongdong Chen, Guoqing Xin

ACS Applied Materials and Interfaces

DOI

2023

Microchannel Cold Plate with GA Optimized Manifold for Enhanced Local Cooling of SiC Power Modules

Yu Liao, Zhi-Qiang Wang, Yayong Yang, Guoqing Xin, Xiaojie Shi

European Conference on Cognitive Ergonomics

DOI

2016

Scalable assembly of graphene nanosheets into 3D macroscopic structures for effective thermal management

Guoqing Xin, J. Lian

DOI

2014

Large‐Area Freestanding Graphene Paper for Superior Thermal Management

Guoqing Xin, Hongtao Sun, Tao Hu, Hafez Raeisi Fard, Xiang Sun, N. Koratkar, T. Borca-Tasciuc, J. Lian

Advances in Materials

DOI

辛国庆

精选作品

期刊论文

Ammonia-Activated High-Pressure laser ablation with Cu mesh assistance enables High-Yield BNNT synthesis for chip thermal management

Diamond/Cu composites microchannel heat sink for effective thermal management of SiC power devices

A Double-Side Cooled SiC MOSFET Power Module Based on Hermetic Conformal Coating for 250 °C High Temperature Applications

A High-Density 3.3 kV/2000 a SiC MOSFET Power Module: Design, Fabrication, and Experimental Evaluation

An Efficient Electrothermal Coupling Simulation Method Based on Neural Network-Aided Power Loss Model for Power Module Thermal Optimization

A Hermetic Conformal Coating Based High-Temperature Encapsulation Method for 250 °C SiC Power Module

Maximizing Power Density in SiC Inverters: Copper-Diamond Composite Embedded Power Modules with Advanced Local Cooling Strategy

Thin-Film Encapsulation Solution for High-Temperature SiC Power Devices

An NSGA-II Optimized Manifold Microchannel Heat Sink With Better Heat Dissipation and Superior Thermal Uniformity for SiC Power Modules

Interface-engineered diamond/Cu composites heat sink with skirt-shaped fins for advanced thermal management

新型多级沟槽结势垒肖特基二极管

基于栅极参考电压的SiC MOSFET栅极氧化物健康状态在线监测方法

Enhancing Thermal Management of Graphene Devices by Self-Assembled Monolayers.

Microchannel Cold Plate with GA Optimized Manifold for Enhanced Local Cooling of SiC Power Modules

Scalable assembly of graphene nanosheets into 3D macroscopic structures for effective thermal management

Large‐Area Freestanding Graphene Paper for Superior Thermal Management

研究方向