陈妤姗｜集美大学｜学者主页

期刊论文

2026

CAFM-based electrical characterization of tribologically-induced damage and its role in electrochemical mechanical polishing of silicon

Wang He, Wen Hua, Yushan Chen, Yuan Wu, Yi-Long Jiang, Bing-Jun Yu, Lin-Mao Qian

Materials Science in Semiconductor Processing

DOI

2026

A Review on Micromixers, Microdroplet Generators and Their Integration

Wang He, Ling Zhang, Lei Wu, Yushan Chen, Tingting Chen

Micromachines

DOI

2025

Directly Comparing the Effects of Amino and Carboxyl Groups on Chemical Mechanical Polishing of Steel from the Perspective of Corrosive Wear

Liang Jiang, Xinzhu Li, Rongpei Wang, Yong-Shun Zhang, Xia Zhong, Yushan Chen, Yuan Wu, Yan-Jun Han, Lin-Mao Qian

ECS Journal of Solid State Science and Technology

DOI

2025

Material removal model associated with chemical bonding in tantalum chemical mechanical polishing

Jia-Xin Zheng, Liang Jiang, Yushan Chen, Yuan Wu, Yong-Shun Zhang, Xia Zhong, Lin-Mao Qian

Tribology International

DOI

2025

Unexpected decreased material removal rate in copper chemical mechanical polishing due to reduced electrostatic attraction caused by dicarboxylic acid

Liang Jiang, Wenhui Li, Xia Zhong, Rui Lei, Yushan Chen, Xin Li, Lin-Mao Qian

Wear

DOI

2025

A distinctive material removal mode in chemical mechanical polishing besides chemical bonding and mechanical plowing: Shear slipping

Yushan Chen, Liuyue Xu, Yuan Wu, Liao Zhou, Yu-Ting Wei, Zihan Zheng, Hui Li, Liang Jiang, Lin-Mao Qian

Friction

DOI

2024

Silver Chemical Mechanical Polishing with the Synergy of Hydrogen Peroxide and 5-methyl-1H-benzotriazole

Liang Jiang, Y. Chen, Yong-Shun Zhang, Yushan Chen, Rui Lei, Lin-Mao Qian

ECS Journal of Solid State Science and Technology

DOI

2024

Interaction mechanism of Al2O3 abrasive in tantalum chemical mechanical polishing

Rui Lei, Liang Jiang, Honglin Zhang, Yushan Chen, Jia-Xin Zheng, Jun-Hui Sun, Qijian Zhao, Lin-Mao Qian

RSC Advances

DOI

2024

AFM probe with the U-shaped cross-sectional cantilever for measuring the ultra-low coefficient of friction of 10−6

Yushan Chen, Liang Jiang, Lin-Mao Qian

Friction

DOI

2024

Micro-scratches generation mechanism by copper oxides adhered on silica abrasive in copper chemical mechanical polishing

Yushan Chen, Liang Jiang, Lin-Mao Qian

Tribology International

DOI

2023

Effect of potassium persulfate on chemical mechanical planarization of Cu/Ni microstructures for MEMS

Mao Sun, Liang Jiang, Yuan Wu, Yushan Chen, Qiu-Tian Li, L. Qian

Microelectronic Engineering

DOI

2023

Synergistic effect of oxidation and complexation on the material removal of pure iron at the nanoscale

Xia Zhong, Yushan Chen, Liang Jiang, Wen-Hui Li, L. Qian

Wear

DOI

2023

Two material removal modes in chemical mechanical polishing: mechanical plowing vs. chemical bonding

Yuan Wu, Liang Jiang, Wenhui Li, Jia-Xin Zheng, Yushan Chen, Lin-Mao Qian

Friction

DOI

2023

AFM probe for measuring ∼10^−5 ultra-low friction coefficient: Design and application

Yushan Chen, Liang Jiang, L. Qian

Friction

DOI

2023

Polyacrylic Acid as a Lubricant and a Complement to 1,2,4-Triazole for Copper Chemical Mechanical Polishing

Liang Jiang, Qiu-Tian Li, Yushan Chen, Yuan Wu, Mao Sun, Li Qian

Tribology letter

DOI

2022

Scanning probe microscope probe switching unit with electrical measurement for in situ multifunctional characterization: Design and preliminary application in tribocorrosion investigation

Yushan Chen, Wenbin Xu, Liang Jiang, Li Qian

Journal of Applied Physics

DOI

2019

A high-precision eight-AFM probe rotary exchange module.

Bin Lin, Liang Jiang, Yushan Chen, Jin-Wei Liu, Changbang Deng, L. Qian

Review of Scientific Instruments

DOI

2017

基于Hadamard编码的磁共振谱技术

陈妤姗，刘璟

《生物化工》

2014

Hadamard技术在不均匀场中获取高分辨核磁共振谱的应用

高凤连，蔡聪波，陈妤姗，黄悦，黄联芬

《现代电子技术》

会议论文

2012

不均匀场下利用Hadamard技术获取高分辨COSY谱

陈妤姗，蔡聪波，蔡淑惠，陈忠

《第十七届全国波谱学学术会议》

2010

利用分子间多量子相干和Hadamard技术在不均匀场下超快速获得高分辨COSY谱

高凤连，陈妤姗，蔡聪波，蔡淑惠，陈忠

《第十六届全国波谱学学术会议》

陈妤姗

精选作品

期刊论文

CAFM-based electrical characterization of tribologically-induced damage and its role in electrochemical mechanical polishing of silicon

A Review on Micromixers, Microdroplet Generators and Their Integration

Directly Comparing the Effects of Amino and Carboxyl Groups on Chemical Mechanical Polishing of Steel from the Perspective of Corrosive Wear

Material removal model associated with chemical bonding in tantalum chemical mechanical polishing

Unexpected decreased material removal rate in copper chemical mechanical polishing due to reduced electrostatic attraction caused by dicarboxylic acid

A distinctive material removal mode in chemical mechanical polishing besides chemical bonding and mechanical plowing: Shear slipping

Silver Chemical Mechanical Polishing with the Synergy of Hydrogen Peroxide and 5-methyl-1H-benzotriazole

Interaction mechanism of Al2O3 abrasive in tantalum chemical mechanical polishing

AFM probe with the U-shaped cross-sectional cantilever for measuring the ultra-low coefficient of friction of 10−6

Micro-scratches generation mechanism by copper oxides adhered on silica abrasive in copper chemical mechanical polishing

Effect of potassium persulfate on chemical mechanical planarization of Cu/Ni microstructures for MEMS

Synergistic effect of oxidation and complexation on the material removal of pure iron at the nanoscale

Two material removal modes in chemical mechanical polishing: mechanical plowing vs. chemical bonding

AFM probe for measuring ∼10^−5 ultra-low friction coefficient: Design and application

Polyacrylic Acid as a Lubricant and a Complement to 1,2,4-Triazole for Copper Chemical Mechanical Polishing

Scanning probe microscope probe switching unit with electrical measurement for in situ multifunctional characterization: Design and preliminary application in tribocorrosion investigation

A high-precision eight-AFM probe rotary exchange module.

基于Hadamard编码的磁共振谱技术

Hadamard技术在不均匀场中获取高分辨核磁共振谱的应用

会议论文

不均匀场下利用Hadamard技术获取高分辨COSY谱

利用分子间多量子相干和Hadamard技术在不均匀场下超快速获得高分辨COSY谱

研究方向