Liqun Du, Ce Zhang, Dong Li, Xiao-Long Han, Ming-Xin Yu, Pan Sun (2026). Laser-electrolyte jet hybrid machining of macro–micro cross-scale V-grooves: methods, mechanisms and application. Optics & Laser Technology.DOI
Liqun Du, Dong Li, Ce Zhang, Ming-Xin Yu, Xiao-Long Han, Jianfeng Cui (2026). Advanced laser differential scanning-assisted electrolyte jet machining method improves macroscopic surface flatness. Optics & Laser Technology.DOI
Bingze Shang, Meng Li, Xiaochen Yang, Bingnan Liu, Huifeng Qiu, Yan Cui, Liqun Du (2026). A Nonlinear MEMS Inertial Switch Fabricated by Induction-Electrode Through-Mask Electrochemical Micromachining. Micromachines.DOI
Jiajia YU, Feier Li, Hao Sun, Yike Zhu, Yukun Shi, Renxin Wang, Liqun Du, Yi Li, Mengxi Wu, Junshan Liu (2026). Quasi-anisotropic wet etching of glass creates inclined microstructures for advanced optical and MEMS devices. Microsystems & Nanoengineering.DOI
Meng Li, Huifeng Qiu, Xiaochen Yang, Bingze Shang, Bingnan Liu, Liqun Du (2026). Leveraging the microscale effect to enhance the overload capacity of a piezoresistive differential pressure sensor. Microsystems & Nanoengineering.DOI
Xiaochen Yang, Meng Li, Bingze Shang, Huifeng Qiu, Bingnan Liu, Liqun Du (2026). Overcoming electric field non-uniformity in through-mask electrochemical micromachining using regulating electrode. Journal of Materials Processing Technology.DOI
Ming-Xin Yu, Ce Zhang, Dong Li, Feng-Lai Wang, Pan Sun, Jianfeng Cui, Liqun Du (2025). Mechanism of surface hardness enhancement of aluminum alloy 2024-T3 by laser-induced plasma electrolyte jet machining. Surface & Coatings Technology.DOI
Changhao Wu, Xiaochen Yang, Meng Li, Bingze Shang, Bingnan Liu, Liqun Du (2025). Design, fabrication and test of electrothermal microgripper based on 304 stainless steel. Journal of Micromechanics and Microengineering.DOI
Xiaochen Yang, Changhao Wu, Meng Li, Hongkai Xi, Liqun Du, Jingmin Li (2025). Surface acoustic wave-assisted induction electrode through-mask electrochemical micromachining for bubble removal in complex microstructure fabrication. Journal of Materials Processing Technology.DOI
Ming-Xin Yu, Liqun Du, Feng-Lai Wang, Ce Zhang, Aoqi Li, Zhongmin Wang (2024). Mechanism of jet velocity affecting surface quality based on electrode dynamics under temperature field. International journal of thermal sciences.DOI
Bing-Jiang Guo, Liqun Du, Shuai Wang, Zhongmin Wang, Dong Li, Junshan Liu (2024). Enhancement mechanism of megasonic field on bubble removal in nickel micro electroforming. Colloids and Surfaces A: Physicochemical and Engineering Aspects.DOI
Bing-Jiang Guo, Liqun Du, Shuai Wang, Chang-Hao Wu, Zhongmin Wang, Ming-Xin Yu (2024). Fabrication of high-density micro column chip mould using micro electroforming technology assisted by megasonic field and electrochemical etching. Chemical Engineering Journal.DOI
Ming-Xin Yu, Liqun Du, Feng-Lai Wang, Aoqi Li, Zhongmin Wang, Haohao Cheng (2024). Etching uniformity study of mask electrolyte jet machining based on mass transfer coefficient: 3D simulation and experimental validation. Journal of Manufacturing Processes.DOI
Feng-Lai Wang, Ming-Xin Yu, Dong Li, Ce Zhang, Liqun Du (2024). Workpiece surface laser regulation in laser-induced plasma electrolyte jet machining: Position, shape, and energy. Optics and lasers in engineering.DOI
Ming-Xin Yu, Liqun Du, Baoguo Du, Feng-Lai Wang, Ce Zhang, Dong Li (2024). Efficient evolution mechanism of electrolytic gas products from laser-assisted electrolyte jet machining. Journal of Materials Processing Technology.DOI
Bing-Jiang Guo, Liqun Du, Shuai Wang, Xiaoke Cai, Aoqi Li, Zhongmin Wang (2024). Enhancement of micro hole wetting and hydrogen bubble release in the process of Ni micro electroforming under megasonic field. Surfaces and Interfaces.DOI
Ke Zhai, Feng Zhou, Yifan Wang, Shihao Ma, Lide Fang, Liqun Du (2024). Study of liquid-phase mass transfer and residual stress in jet electrodeposition process with coaxial megasonic agitation. Ultrasonics sonochemistry.DOI
Ke Zhai, Yongkang Liang, Tengnan Li, Shihao Ma, Liqun Du (2024). Research on jet electrochemical machining with coaxial megasonic assistance. Ultrasonics sonochemistry.DOI
Xiaochen Yang, Liqun Du, Aoqi Li, Mengxi Wu, Changhao Wu, Jingmin Li (2024). A novel method of induction electrode through-mask electrochemical micromachining. International Journal of Machine Tools and Manufacture.DOI
Mingxin Yu, Liqun Du, Fenglai Wang, Aoqi Li, Ce Zhang (2024). A new laser-induced plasma electrolyte jet machining method: Efficient material removal mechanism and synergistic effects. Journal of Materials Processing Technology.DOI
Feier LI, Jiajia YU, Liqun Du, Mengxi WU, J. B. Liu (2024). Fabrication of glass microprism via interfacial erosion induced quasi-anisotropic wet etching. Optics and Precision Engineering.DOI
Liqun Du, Bowen Yuan, Bingjiang Guo, Shuai Wang, Xiaoke Cai (2023). Fabrication of high-aspect-ratio stepped Cu microcolumn array using UV-LIGA technology. Microsystem Technologies.DOI
Mingxin Yu, Liqun Du, Ke Zhai, Haohao Cheng, Fenglai Wang, Aoqi Li, Zhongmin Wang (2023). Towards understanding uniformity of megasonic-assisted through-mask electrochemical micromachining based on bubble dynamics. Journal of Manufacturing Processes.DOI
Liqun Du, Dejian Kong, Shuai Wang, Xiaoke CAI, Bingjiang GUO (2023). Study on interfacial bonding strength during fabrication of micro inertial switch. Optics and Precision Engineering.DOI
Liqun Du, Xiaochen Yang, Bingjiang Guo, Yakun Dong, Bowen Yuan, Jian Kui Zhao, Junshan Liu (2022). A novel MEMS inertial switch with frictional electrode. Journal of Micromechanics and Microengineering.DOI
Liqun Du, Bingjiang Guo, Linsong Gao, Bowen Yuan, Xuechao Ji, Jingmin Li (2022). Fabrication and test of enhanced boiling heat transfer copper surface with micro-structure. Heat and Mass Transfer.DOI
Liqun Du, Mingxin Yu, Ke Zhai, Kunming Zheng, Haohao Cheng, Shuxuan Wang, Junshan Liu (2022). Investigation on particle assisted through-mask electrochemical etching of micro pit array. The International Journal of Advanced Manufacturing Technology.DOI
Zehan Liu, Mengxi Wu, Zheng Xu, Xiaoyu Xiang, Haoran Li, Liqun Du, Junshan Liu (2022). A Reusable Pseudo-Liquid-to-Solid Inertial Switch Based on Hetero-Coated Galinstan Droplets. Journal of Microelectromechanical Systems.DOI
Liqun Du, Bingjiang Guo, Yakun Dong, Dejian Kong, Jian Kui Zhao, Xuqiang Liu, Junshan Liu (2022). A wearable omnidirectional inertial switch of security detection for the elderly. Microsystem Technologies.DOI
Liqun Du, Yang Yu, Bowen Yuan, Bingjiang Guo, Chao Wang, Chengquan Du, Junshan Liu (2021). A low-g omnidirectional MEMS inertial switch with load direction identification. Microelectronic Engineering.DOI
Liqun Du, Ke Zhai, Shuxuan Wang, Xi Zhang, Qiang Cao, Yikui Wen, Wenjun Zhao, Junshan Liu (2020). Evaluation of residual stress of metal micro structure electroformed with megasonic agitation. Journal of Manufacturing Processes.DOI
Ke Zhai, Liqun Du, Shuxuan Wang, Yikui Wen, Junshan Liu (2020). Research on the synergistic effect of megasonic and particles in through mask electrochemical etching process. Electrochimica Acta.DOI
Liqun Du, Shuxuan Wang, Xi Zhang, Chengquan Du, Ming Long Zhao, Yuanqi Li (2020). Fabrication method of micro RF coaxial transmitter on metal substrate combining positive and negative photoresist processes. Microelectronic Engineering.DOI
Ming Long Zhao, Liqun Du, Zheng Xu, Xi Zhang, Qiang Cao, Xuechao Ji, Zhuangzhuang Wei, Junshan Liu (2019). Improving the thickness uniformity of micro electroforming layer by megasonic agitation and the application. Materials Chemistry and Physics.DOI
Ke Zhai, Liqun Du, Yikui Wen, Shuxuan Wang, Qiang Cao, Xi Zhang, Junshan Liu (2019). Fabrication of micro pits based on megasonic assisted through-mask electrochemical micromachining. Ultrasonics.DOI
Linsong Gao, Jizu Lv, Minli Bai, Chengzhi Hu, Liqun Du, Yubai Li (2019). Experiment of Enhanced Pool Boiling Heat Transfer on Coupling Effects of Nano-Structure and Synergistic Micro-Channel. ASME International Conference on Micro/Nanoscale Heat and Mass Transfer (MNHMT).DOI
Liqun Du, Weitai Wang, Chengquan Du, Jian Kui Zhao, Ming Long Zhao, Xuqiang Liu (2019). A novel contact-enhanced low-g inertial switch with low-stiffness fixed electrode. Microsystem Technologies.DOI
Ming Long Zhao, Liqun Du, Zhuangzhuang Wei, Chengquan Du, Xuqiang Liu, Xuechao Ji (2018). Fabrication of metal microfluidic chip mold with coplanar auxiliary cathode in the electroforming process. Journal of Micromechanics and Microengineering.DOI
Ming Long Zhao, Liqun Du, Chengquan Du, Zhuangzhuang Wei, Xuechao Ji, Zhipeng Bai, Xuqiang Liu (2018). Quantitative study of mass transfer in megasonic micro electroforming based on mass transfer coefficient: Simulation and experimental validation. Electrochimica Acta.DOI
Chang Seop Song, Liqun Du, Xuechao Ji (2018). Reducing the residual stress in micro electroforming layer by megasonic agitation. Ultrasonics Sonochemistry.DOI
Ming Long Zhao, Liqun Du, Leijie Qi, Yuanqi Li, Li Jian Yu, Xiaojun Li (2018). Numerical simulations and electrochemical experiments of the mass transfer of microvias electroforming under ultrasonic agitation. Ultrasonics Sonochemistry.DOI
Liqun Du, Wenjun Zhao, Ke Zhai, Chang Seop Song, Qingfeng Li (2018). Fabrication of microfluidic chip mold based on through-mask electrochemical etching and micro electroforming process. Journal of Micromechanics and Microengineering.DOI
Chang Seop Song, Liqun Du, Wenjun Zhao, Heqing Zhu, Wen Jing Zhao, Weitai Wang (2018). Effectiveness of stress release geometries on reducing residual stress in electroforming metal microstructure. Journal of Micromechanics and Microengineering.DOI
Ke Zhai, Liqun Du, Weitai Wang, Heqing Zhu, Wenjun Zhao, Wen Jing Zhao (2017). Research of megasonic electroforming equipment based on the uniformity of electroforming process. Ultrasonics Sonochemistry.DOI
Liqun Du, S. L. Chen, Ming Zhao, Yousheng Tao, Lei Luo, Tinghong Yang, S. J. Liu, Yanpeng Hao (2017). Research on Fabrication of a Multi-Scale Inertial Switch with Ultra-High Aspect Ratio.DOI
Chang Seop Song, Liqun Du, Leijie Qi, Yu Li, Xiaojun Li, Yuanqi Li (2017). Residual stress measurement in a metal microdevice by micro Raman spectroscopy. Journal of Micromechanics and Microengineering.DOI
Chunfang Guo, Qianqian Tian, Hairui Wang, Jianxing Sun, Liqun Du, Minjie Wang, Danyang Zhao (2017). Roller embossing process for the replication of shark‐skin‐inspired micro‐riblets. Micro & Nano Letters.DOI
Chang Seop Song, Liqun Du, Xiaojun Li, Yuanqi Li, Leijie Qi, Yu Li (2017). Residual stress modeling and analysis for micro electroforming layer. Microsystem Technologies.DOI
Liqun Du, Shengli Chen, Yousheng Tao, Lei Luo, Ming Long Zhao, Tong Yang, Shuangjie Liu, Yongping Hao (2016). Stress reduction method in fabrication of a multi-scale inertial switch with ultra-high aspect ratio. Microsystem Technologies.DOI
Zhong Chao Zhao, Liqun Du, Yousheng Tao, Qingfeng Li, Lei Luo (2016). Enhancing the adhesion strength of micro electroforming layer by ultrasonic agitation method and the application. Ultrasonics Sonochemistry.DOI
Ligeng Shao, Liding Wang, Liqun Du (2016). Influence of initial current density on bonding strength between Ni layer and Cu substrate in microelectroforming. Journal of Adhesion Science and Technology.DOI
Liqun Du, Tong Yang, Ming Long Zhao, Yousheng Tao, Lei Luo, Lei Wang, Chong Liu (2016). Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process. Micromachines.DOI
Zhong Chao Zhao, Liqun Du, Zheng Xu, Ligeng Shao (2015). Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate. Ultrasonics Sonochemistry.DOI
Xiaolei Zhang, Liqun Du, Ming Long Zhao, Chang Seop Song (2015). Investigation in the interface adhesion strength between SU-8 photoresist and metal substrate by ultrasonic treatment. Microsystem Technologies.DOI
Zhong Chao Zhao, Liqun Du (2015). Quantitative relationship between crystallite size and adhesion strength of the electroforming layer during microelectroforming process. Micro & Nano Letters.DOI
Liqun Du, Ming Long Zhao, Aoan Wang, Shengli Chen, Weirong Nie (2014). Fabrication of novel MEMS inertial switch with six layers on a metal substrate. Microsystem Technologies.DOI
Xiaolei Zhang, Liqun Du, Ming Long Zhao (2014). Quantitative investigation of the adhesion strength between an SU ‐8 photoresist and a metal substrate by scratch tests. Journal of Applied Polymer Science.DOI
Ligeng Shao, Liqun Du, Liding Wang (2014). Enhancing the Adhesion Strength Between Cu Substrate and Ni Layer in Microelectroforming. Materials and Manufacturing Processes.DOI
Junshan Liu, Donglai Song, Guoge Zong, Penghe Yin, Xiaolei Zhang, Zheng Xu, Liqun Du, Chong Liu, Liding Wang (2014). Fabrication of SU-8 moulds on glass substrates by using a common thin negative photoresist as an adhesive layer. Journal of Micromechanics and Microengineering.DOI
Zhong Chao Zhao, Liqun Du, Zhi‐Cheng Tan (2014). Influence of electrodeposited crystallite size on interfacial adhesion strength of electroformed layers. Micro & Nano Letters.DOI
Ligeng Shao, Liqun Du, Liding Wang (2013). Electrochemical activation of substrate surfaces in microelectroforming. Micro & Nano Letters.DOI
Junyao Wang, Xu Zheng, Yong-kui Li, Chong Liu, Junshan Liu, Li Chen, Liqun Du, Liding Wang (2013). Nanopore density effect of polyacrylamide gel plug on electrokinetic ion enrichment in a micro-nanofluidic chip. Applied Physics Letters.DOI
Junshan Liu, Jun Qin, Jing Li, Dongyue Li, Zheng Xu, Xiaowei Zhang, Liqun Du, Chong Liu (2013). Monolithic integration of three-material microelectrodes for electrochemical detection on PMMA substrates. Electrochemistry Communications.DOI
Junshan Liu, Liangkun An, Zheng Xu, Ning Wang, Xiao-Chong YAN, Liqun Du, Chong Liu, Liding Wang (2013). Modeling of capacitively coupled contactless conductivity detection on microfluidic chips. Microsystem Technologies.DOI
Liqun Du (2013). Proteus and Keil Based Simulation Design of Nanoseconds Pulse Power. Machinery Design and Manufacture.
Xueye Chen, Chong Liu, Zheng Xu, Yuzhen Pan, Junshan Liu, Liqun Du (2012). An effective PDMS microfluidic chip for chemiluminescence detection of cobalt (II) in water. Microsystem Technologies.DOI
Xiaolei Zhang, Liqun Du, Zheng Xu (2012). The effect of soft bake on adhesion property between SU‐8 photoresist and Ni substrate by molecular dynamics simulation. Journal of Applied Polymer Science.DOI
Liqun Du, Yonghui Li, Jianfei Liu (2012). Influence of current density on the interfacial bond strength of electroformed layers. Micro & Nano Letters.DOI
Ligeng Shao, Liqun Du, Chong Liu, Liding Wang (2012). Microstructure and mechanical properties of nanocrystalline nickel prepared by pulse reverse microelectroforming. Journal of Experimental Nanoscience.DOI
Liqun Du, H.W. Chang, Mancang Song, Chong Liu (2012). The effect of injection molding PMMA microfluidic chips thickness uniformity on the thermal bonding ratio of chips. Microsystem Technologies.DOI
Liqun Du, H.W. Chang, Mancang Song, Chong Liu (2012). A method of water pretreatment to improve the thermal bonding rate of PMMA microfluidic chip. Microsystem Technologies.DOI
Junshan Liu, Hongchao Qiao, Xu Zheng, Chong Liu, Junyao Wang, Liqun Du, Xi Zhang, Liding Wang (2012). Fabrication of planar nanofluidic channels in thermoplastic polymers by O 2 plasma etching. Micro & Nano Letters.DOI
宋满仓，刘莹，祝铁丽，杜立群，王敏杰，刘冲（2011）. 塑料微流控芯片的注塑成型. Nanotechnology and Precision Engineering.
Liqun Du, Yaping Liu, Chengbin Li (2011). Mechanism analysis of ultrasonic treatment on SU-8 swelling in UV-LIGA technology. Micro & Nano Letters.DOI
Xiaolei Zhang, Liqun Du, Yingli Zhu, Chong Liu (2011). Investigation of adhesion properties between SU-8 photoresist and stainless steel substrate. Micro & Nano Letters.DOI
Liqun Du, Qijia Wang, Xiaolei Zhang (2010). Optimization of ultrasonic stress relief process parameters based on fuzzy neural network. Journal of Micro-Nano Mechatronics.DOI
Liqun Du, Benzhuang Zhang, Liu Yaping (2010). Reducing SU-8 hygroscopic swelling by ultrasonic treatment. Nano-Micro Letters.DOI
Liqun Du, Qijia Wang, Xiaolei Zhang (2010). Reduction of internal stress in SU-8 photoresist layer by ultrasonic treatment. Science China Technological Sciences.DOI
Liqun Du, Qijia Wang (2010). Experimental study on ultrasonic stress relief for cured SU-8 photoresist layer. Microelectronic Engineering.DOI
Ligeng Shao, Liqun Du, Liding Wang (2010). Development of nanocrystalline nickel by pulse reverse microelectroforming. Micro & Nano Letters.DOI
Zheng Xu, Jin-kai Wen, Chong Liu, Junshan Liu, Liqun Du, Liding Wang (2009). Research on forming and application of U-form glass micro-nanofluidic chip with long nanochannels. Microfluidics and Nanofluidics.DOI
Liqun Du, Shenmiao Zhu, Jiang Qin, Chong Liu (2007). Numerical and experimental study on SU-8 UV photolithography. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE.DOI
Liqun Du, C. Liu, H.J. Liu, J. Qin, N. Li, Rui Yang (2007). Design and Fabrication of Micro Hot Embossing Mold for Microfluidic Chip Used in Flow Cytometry. Key engineering materials.DOI
Liqun Du, Yiqiang Lv, Wei Jie Dong, Xu Gao (2007). Preparation and Properties of PZT Bimorph on Metal Substrate by Hydrothermal Method. Key engineering materials.DOI
Liqun Du, Haijun Liu, Chong Liu, Shenmiao Zhu, Jiang Qin (2007). Study on the Uniformity of Micro Electroforming Mold Insert Used in Micro Fluidic-Chip Fabrication. First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B.DOI
Liqun Du, Chong Liu, Haijun Liu, Jiang Qin, Yuanjie Wei (2006). Micro Hot Embossing Metal Mold For Microfluidic Chip Based On No Back Plate Growing Method. IEEE International Conference on Nano/Micro Engineered and Molecular Systems.DOI