王喆垚｜清华大学｜学者主页

2026

Low-Temperature Bonding of Porous Cu Bumps With a 1.5- μ m Fine Pitch

Zilin Wang, Wenjie Zhao, Dajie Luo, Peng Sun, Dejing Jiang, Boya Feng, Fei Wang, Zheyao Wang

IEEE Transactions on Electron Devices

DOI

2026

Flip-Chip Bonded HTS MEMS Contact Switch with SOI Cantilever

Liwei Jiang, Zirui Liu, Boyu Lu, Zheyao Wang

Proceedings, IEEE micro electro mechanical systems

DOI

2025

三维集成压电与声光器件

王梓霖，王喆垚

《压电与声光》

2025

Finite Element Analysis of the Impact of Cu Density on Hybrid Bonding Interfacial Stress

Zhiyu He, Zheyao Wang, Kai Zheng

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Flip-Chip Bonded Dual-Substrate RF MEMS Switch with SOI Cantilever

Liwei Jiang, Zirui Liu, Zheyao Wang

Proceedings of IEEE Sensors/Proceedings of IEEE Sensors ...

DOI

2025

Low-Resistance Interconnects by Bonding Porous Cu Bumps and Ultrathin Cu/Sn Pads

Zilin Wang, Wenjie Zhao, Zheyao Wang

IEEE Transactions on Electron Devices

DOI

2024

Finite Element Analysis of the Effect of Structural Parameters and Misalignment on Bonding Strength in Fine-Pitch Hybrid Bonding

Jingyu Shi, Lin Tan, Yang Hu, Junpeng Fang, Jian Cai, Zheyao Wang, Qian Wang

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2024

Fabrication and Formation Principle of Porous Cu–Sn Bumps for Metal Bonding in Chiplet Integration

Zilin Wang, Ziqing Wang, Yunfan Shi, Qian Wang, Zheyao Wang

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2024

Cu–Cu Bonded Microbump Interconnects With a 10-μm Pitch for 3-D-Stacked Chiplets

Zilin Wang, Ziqing Wang, Zheyao Wang

IEEE Transactions on Electron Devices

DOI

2024

Fabrication of Fine-Pitch Cu-Sn Microbumps Using Electroplating and Wet Seed Layer Etching

Yunfan Shi, Zilin Wang, Qian Wang, Zheyao Wang

Electronics System-Integration Technology Conference (ESTC)

DOI

2024

Low-Temperature and CMP-Free Direct Bonding of Porous Cu Bumps

Zilin Wang, Wenjie Zhao, Zheyao Wang

IEEE Electron Device Letters

DOI

2024

Fabrication of High‐Density Micro‐Bump Arrays for 3D Integration of MEMS and CMOS

Yunfan Shi, Zilin Wang, Zilin Wang, Rutian Huang, Jin Kang, Kai Zheng, Weihai Bu, Zheyao Wang, Zheyao Wang

IEEJ Transactions on Electrical and Electronic Engineering

DOI

2023

Through-silicon-via Architecture of 3D Integration for Superconducting Quantum Computing Application

J. Y. Yu, Qian Wang, Yao Rui Zheng, Changming Song, Junpeng Fang, Tiefu Li, Haihua Wu, Zheyao Wang, Jian Cai

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2023

Seed Layer Etching, Thermal Reflow and Bonding of Cu-Sn Micro Bumps with $5\ \mu \mathrm{m}$ Diameters

Yunfan Shi, Zilin Wang, Rutian Huang, Jin Kang, Kai Zheng, Weihai Bu, Zheyao Wang

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2022

Transient-Liquid-Phase Bonding of Granulated Cu–Sn Bumps With a 4- μ m Fine Pitch

Yunfan Shi, Zilin Wang, Huawei Zhang, Jin Kang, Kai Zheng, Weihai Bu, Zheyao Wang

IEEE Transactions on Electron Devices

DOI

2022

Low Temperature Cu-Cu Bonding Using an Intermediate Sacrificial Sn Layer

Zilin Wang, Yunfan Shi, Zheyao Wang

IEEE Electron Device Letters

DOI

2022

Bonding of 5 μm Cu-Sn Micro Bumps Using Thermal Reflow and Solid-State Pre-Bonding

Yunfan Shi, Zilin Wang, Jin Kang, Kai Zheng, Weihai Bu, Zheyao Wang

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2019

Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications

Zheyao Wang

Microelectronic Engineering

DOI

2017

High-Frequency Characterization of Through-Silicon-Vias With Benzocyclobutene Liners

Ke Wu, Zheyao Wang

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2016

Thermal Stresses of TSVs With Silicon Post Conductors and Polymer Insulators

Qing Ma, Ke Wu, Zheyao Wang

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2016

Thermal Reliability Tests of Air-Gap TSVs With Combined Air-SiO2Liners

Cui Huang, Dong Min Wu, Zheyao Wang

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2016

Delamination of bonding Interface between benzocyclobutene (BCB) and silicon dioxide/silicon nitride

Fan Bu, Qing Ma, Zheyao Wang

Microelectronics Reliability

DOI

2016

3-D Integration of MEMS and CMOS Using Electroless Plated Nickel Through-MEMS-Vias

Yuxin Du, Dong Min Wu, Zhen Song, Miao Liu, Sujie Yang, Zheyao Wang

Journal of Microelectromechanical Systems

DOI

2016

Mechanical Reliability Testing of Air-Gap Through-Silicon Vias

Cui Huang, Ke Wu, Zheyao Wang

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2015

Air-gap/SiO2 liner TSVs with improved electrical performance

Cui Huang, Dong Min Wu, Liyang Pan, Zheyao Wang

International 3D Systems Integration Conference (3DIC)

DOI

2015

Fabrication of Ni Microbumps With Small Feature Size on Au Using Electroless Ni Plating With Noncontact Induction

Yuxin Du, Zhen Song, Huizhong Zhu, Zheyao Wang

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2015

Low-Capacitance Through-Silicon-Vias With Combined Air/SiO2Liners

Cui Huang, Ke Wu, Zheyao Wang

IEEE Transactions on Electron Devices

DOI

2015

3-D Integration and Through-Silicon Vias in MEMS and Microsensors

Zheyao Wang

Journal of Microelectromechanical Systems

DOI

2015

Three-dimensional integration of suspended single-crystalline silicon MEMS arrays with CMOS

Zhen Song, Yuxin Du, Miao Liu, Shujie Yang, Dong Min Wu, Zheyao Wang

Proceedings, IEEE micro electro mechanical systems

DOI

2014

Thermal and Electrical Reliability Tests of Air-Gap Through-Silicon Vias

Cui Huang, Ran Liu, Zheyao Wang

IEEE Transactions on Device and Materials Reliability

DOI

2014

Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias

Cui Huang, Liyang Pan, Ran Liu, Zheyao Wang

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2014

Void-formation in uncured and partially-cured BCB bonding adhesive on patterned surfaces

Zhen Song, Dong Min Wu, Huizhong Zhu, Litian Liu, Zheyao Wang

Microelectronic Engineering

DOI

2014

Void-free BCB adhesive wafer bonding with high alignment accuracy

Zhen Song, Zhimin Tan, Litian Liu, Zheyao Wang

Microsystem Technologies

DOI

2014

Reliability of Au-Si eutectic bonding

Tianxiang Ye, Zhen Song, Yuxin Du, Zheyao Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

Reactive ion etching characteristics of partially-cured benzocyclobutene

Yang Yang, Zhen Song, Yuxin Du, Zheyao Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2013

Implementation of Air-Gap Through-Silicon-Vias (TSVs) Using Sacrificial Technology

Cui Huang, Qianwen Chen, Dong Min Wu, Zheyao Wang

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2013

Development of ultra-low capacitance through-silicon-vias (TSVs) with air-gap liner

Qianwen Chen, Cui Huang, Zheyao Wang

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2013

Low Capacitance Through-Silicon-Vias With Uniform Benzocyclobutene Insulation Layers

Qianwen Chen, Cui Huang, Zhimin Tan, Zheyao Wang

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2013

Ultralow-Capacitance Through-Silicon Vias With Annular Air-Gap Insulation Layers

Qianwen Chen, Cui Huang, Dong Min Wu, Zhimin Tan, Zheyao Wang

IEEE Transactions on Electron Devices

DOI

2013

Air-Gap Through-Silicon Vias

Cui Huang, Qianwen Chen, Zheyao Wang

IEEE Electron Device Letters

DOI

2012

High aspect ratio and low capacitance through-silicon-vias (TSVs) with polymer insulation layers

Cui Huang, Qianwen Chen, Dong Min Wu, Zheyao Wang

Microelectronic Engineering

DOI

2012

Measurement and Simulation of Thermal-Induced Stress in C2W 3D Integration with Template Alignment

Qianwen Chen, Dong Wu, Dingyou Zhang, James Jian-Qiang Lu, Zheyao Wang

ECS Transactions

DOI

2011

Design and realize of 3D integration of a pressure sensor system with through silicon via (TSV) approach

Tao Wang, Jian Cap, Qian Wang, Hao Zhang, Zheyao Wang

DOI

2011

Design and Fabrication of WLP Compatible Miniaturized Pressure Sensor System with Through Silicon Via (TSV) Interconnects

Tao Wang, Jian Cai, Qian Wang, Hao Zhang, Zheyao Wang

IMAPSource Proceedings

DOI

2011

Thermal Conductivity Enhancement of Benzocyclobutene With Carbon Nanotubes for Adhesive Bonding in 3-D Integration

Xiangming Xu, Zheyao Wang

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2011

Moving Boundary Simulation and Experimental Verification of High Aspect-Ratio Through-Silicon-Vias for 3-D Integration

Chongshen Song, Zheyao Wang, Zhimin Tan, Litian Liu

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2011

Chip-to-wafer (C2W) 3D integration with well-controlled template alignment and wafer-level bonding

Qianwen Chen, Dingyou Zhang, Zheyao Wang, Litian Liu, James Jian-Qiang Lu

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

精选作品

期刊论文

Low-Temperature Bonding of Porous Cu Bumps With a 1.5- μ m Fine Pitch

Flip-Chip Bonded HTS MEMS Contact Switch with SOI Cantilever

三维集成压电与声光器件

Finite Element Analysis of the Impact of Cu Density on Hybrid Bonding Interfacial Stress

Flip-Chip Bonded Dual-Substrate RF MEMS Switch with SOI Cantilever

Low-Resistance Interconnects by Bonding Porous Cu Bumps and Ultrathin Cu/Sn Pads

Finite Element Analysis of the Effect of Structural Parameters and Misalignment on Bonding Strength in Fine-Pitch Hybrid Bonding

Fabrication and Formation Principle of Porous Cu–Sn Bumps for Metal Bonding in Chiplet Integration

Cu–Cu Bonded Microbump Interconnects With a 10-μm Pitch for 3-D-Stacked Chiplets

Fabrication of Fine-Pitch Cu-Sn Microbumps Using Electroplating and Wet Seed Layer Etching

Low-Temperature and CMP-Free Direct Bonding of Porous Cu Bumps

Fabrication of High‐Density Micro‐Bump Arrays for 3D Integration of MEMS and CMOS

Through-silicon-via Architecture of 3D Integration for Superconducting Quantum Computing Application

Seed Layer Etching, Thermal Reflow and Bonding of Cu-Sn Micro Bumps with $5\ \mu \mathrm{m}$ Diameters

Transient-Liquid-Phase Bonding of Granulated Cu–Sn Bumps With a 4- μ m Fine Pitch

Low Temperature Cu-Cu Bonding Using an Intermediate Sacrificial Sn Layer

Bonding of 5 μm Cu-Sn Micro Bumps Using Thermal Reflow and Solid-State Pre-Bonding

Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications

High-Frequency Characterization of Through-Silicon-Vias With Benzocyclobutene Liners

Thermal Stresses of TSVs With Silicon Post Conductors and Polymer Insulators

Thermal Reliability Tests of Air-Gap TSVs With Combined Air-SiO2Liners

Delamination of bonding Interface between benzocyclobutene (BCB) and silicon dioxide/silicon nitride

3-D Integration of MEMS and CMOS Using Electroless Plated Nickel Through-MEMS-Vias

Mechanical Reliability Testing of Air-Gap Through-Silicon Vias

Air-gap/SiO2 liner TSVs with improved electrical performance

Fabrication of Ni Microbumps With Small Feature Size on Au Using Electroless Ni Plating With Noncontact Induction

Low-Capacitance Through-Silicon-Vias With Combined Air/SiO2Liners

3-D Integration and Through-Silicon Vias in MEMS and Microsensors

Three-dimensional integration of suspended single-crystalline silicon MEMS arrays with CMOS

Thermal and Electrical Reliability Tests of Air-Gap Through-Silicon Vias

Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias

Void-formation in uncured and partially-cured BCB bonding adhesive on patterned surfaces

Void-free BCB adhesive wafer bonding with high alignment accuracy

Reliability of Au-Si eutectic bonding

Reactive ion etching characteristics of partially-cured benzocyclobutene

Implementation of Air-Gap Through-Silicon-Vias (TSVs) Using Sacrificial Technology

Development of ultra-low capacitance through-silicon-vias (TSVs) with air-gap liner

Low Capacitance Through-Silicon-Vias With Uniform Benzocyclobutene Insulation Layers

Ultralow-Capacitance Through-Silicon Vias With Annular Air-Gap Insulation Layers

Air-Gap Through-Silicon Vias

High aspect ratio and low capacitance through-silicon-vias (TSVs) with polymer insulation layers

Measurement and Simulation of Thermal-Induced Stress in C2W 3D Integration with Template Alignment

Design and realize of 3D integration of a pressure sensor system with through silicon via (TSV) approach

Design and Fabrication of WLP Compatible Miniaturized Pressure Sensor System with Through Silicon Via (TSV) Interconnects

Thermal Conductivity Enhancement of Benzocyclobutene With Carbon Nanotubes for Adhesive Bonding in 3-D Integration

Moving Boundary Simulation and Experimental Verification of High Aspect-Ratio Through-Silicon-Vias for 3-D Integration

Chip-to-wafer (C2W) 3D integration with well-controlled template alignment and wafer-level bonding

预印本

A Flip-Chip Bonded RF MEMS Contact Switch with Integrated Hermetic Sealing Using a Single-Crystal Silicon Cantilever

研究方向