陆向宁｜江苏师范大学｜学者主页

2026

A lightweight high precision real-time system for bonding ball–pad localization in industrial packaging inspection

Haoran Wei, Zhen-Zhi He, Guo Ye, Xiaotong Shu, Jin-Song Peng, Tianchi Chen, Lian-Chao Sheng, Xiangning Lu

Measurement science and technology

DOI

2026

Review of wafer defect detection based on supervised learning algorithms

Xiaotong Shu, Guo Ye, Wei-Wei Yang, Zhen-Zhi He, Lian-Chao Sheng, Xiangning Lu

Engineering computations

DOI

2026

A multi-modal flexible sensor based on a liquid-metal-enhanced fluorinated ionogel for intelligent motion monitoring and recognition.

Yu-Fan Shao, Li-Jun Zhu, Ming-Hui Shao, Lian-Chao Sheng, Xiangning Lu, Tian-Chi Chen

Nanoscale

DOI

2026

Enhanced grain segmentation in wafer microscopy using normalized graph-cut-guided boundary fusion

Pengcheng Ji, Lin Xu, Guo Ye, Zhen-Zhi He, Xiangning Lu

Machine Vision and Applications

DOI

2026

A Novel Annular-Dielectric-Layer-Structured TSV in Silicon Interposer for 2.5-D/3-D Integration

Hongyang Wang, Tian-Chi Chen, Jin-Song Peng, Lian-Chao Sheng, Guo Ye, Zhen-Zhi He, Xiangning Lu

IEEE Transactions on Components, Packaging, and Manufacturing Technology

DOI

2026

High-performance polydopamine and silver nanoparticle-modified MXene-based hydrogel flexible strain sensors for transfer-learning-assisted handwriting recognition and wrist-movement monitoring.

Jia-Ye Zhou, Yu-Fan Shao, Xuqing Song, Tian-Chi Chen, Xiangning Lu

Nanoscale

DOI

2026

Wafer-YOLO: A lightweight object detection network for wafer inspection

Xiaotong Shu, Zhen-Zhi He, Jia-Yi Yuan, Guo Ye, Tian-Chi Chen, Lian-Chao Sheng, Xiangning Lu

Microelectronics Journal

DOI

2026

A Graphene-Ag-Cu Composite TSV for 3D IC Interconnects With Electrical and Electro-Thermal Analysis

Hongyang Wang, Zhi-Yuan Wu, Zhen-Zhi He, Liyi Li, Jin-Song Peng, Tian-Chi Chen, Xiangning Lu

IEEE Transactions on Components, Packaging, and Manufacturing Technology

DOI

2026

An overview of infrared thermography for inspection of solder joint in electronic devices

Jia-Yi Yuan, Zhen-Zhi He, Lin Xu, Jin-Song Peng, Hector Gutierrez, Lian-Chao Sheng, Tian-Chi Chen, Xiangning Lu

Infrared Physics & Technology

DOI

2025

A multifunctional, double network cellulose-acrylamide based hydrogel sensor reinforced using a liquid metal for human motion detection and dual-mode handwriting recognition via a transfer learning algorithm

Song Xuqing, Tianchi Chen, Shao Yufan, Sheng Lianchao, Lu Xiangning

Journal of Materials Chemistry C

DOI

2025

A lightweight ghost-driven attention network for wire bond positioning in measurement

Haoran Wei, Xiaotong Shu, Xiangning Lu, Guo Ye, Tian-Chi Chen, Lian-Chao Sheng, Zhen-Zhi He

Engineering Research Express

DOI

2025

Thermal analysis of a novel fan-out packaging structure optimized with graphene

Zhi-Yuan Wu, Zehui Dai, Guo Ye, Jin-Song Peng, Zhen-Zhi He, Xiangning Lu

Engineering Research Express

DOI

2025

Wafer Defect Detection Technology Based on CTM-IYOLOv10 Network

Pengcheng Ji, Zhen-Zhi He, Wei-Wei Yang, Jiawei Du, Guo Ye, Xiangning Lu

Journal of Imaging

DOI

2025

An improved detection algorithm using RFS-YOLOv8n for wafer surface defect

Lin Xu, Jin-Song Peng, Pengfei Liu, Lian-Chao Sheng, Xiangning Lu, Zhen-Zhi He

Measurement science and technology

DOI

2024

Optimized YOLOv8 based on SGW for surface defect detection of silicon wafer

Guan-Qun Zhu, Jin-Song Peng, Lian-Chao Sheng, Tian-Chi Chen, Zhen-Zhi He, Xiangning Lu

Physica Scripta

DOI

2024

Wafer Defect Detection Based on YOLO-BA

Xiaotong Shu, Lin Xu, Zhen-Zhi He, Lian-Chao Sheng, Guo Ye, Xiangning Lu

2024 International Conference on Sensing, Measurement & Data Analytics in the era of Artificial Intelligence (ICSMD)

DOI

2023

基于GP-AdaLAM的芯片引脚缺陷快速检测算法

杜佳伟，彭劲松，何贞志，杨威威，陆向宁

《厦门大学学报(自然科学版)》

2022

基于机器视觉的喷嘴外形关键尺寸检测系统

杨硕，陆向宁，何贞志，仝子悦，杜佳伟

《电子测量技术》

2018

硅通孔形状和填充材料对热应力的影响

魏丽，陆向宁，郭玉静

《南京理工大学学报》

2017

基于Hough变换的高精度机器视觉对准系统的研究

魏丽，郭玉静，陆向宁

《应用光学》

2016

主动红外微电子封装缺陷检测技术 = Active infrared technology for defect inspection of microelectronics packaging

陆向宁

《电子工业出版社》

2016

近十年中国无铅钎料研究进展

张亮，TU KingNing，陈信文，范晖，陆向宁，胡小武，钟素娟，杨帆

《中国科学:技术科学》

2014

基于小波分析的倒装芯片主动红外缺陷检测

徐振淞，史铁林，陆向宁，宿磊，廖广兰

《红外与激光工程》

2012

基于主动红外热成像的倒装焊缺陷检测方法研究

陆向宁

《华中科技大学》

2011

基于主动红外的倒装芯片缺陷检测研究

査哲瑜，廖广兰，陆向宁，夏奇，史铁林

《半导体光电》

2010

硅各向同性深刻蚀中的多层掩模工艺

聂磊，史铁林，陆向宁

《半导体光电》

陆向宁

精选作品

期刊论文

A lightweight high precision real-time system for bonding ball–pad localization in industrial packaging inspection

Review of wafer defect detection based on supervised learning algorithms

A multi-modal flexible sensor based on a liquid-metal-enhanced fluorinated ionogel for intelligent motion monitoring and recognition.

Enhanced grain segmentation in wafer microscopy using normalized graph-cut-guided boundary fusion

A Novel Annular-Dielectric-Layer-Structured TSV in Silicon Interposer for 2.5-D/3-D Integration

High-performance polydopamine and silver nanoparticle-modified MXene-based hydrogel flexible strain sensors for transfer-learning-assisted handwriting recognition and wrist-movement monitoring.

Wafer-YOLO: A lightweight object detection network for wafer inspection

A Graphene-Ag-Cu Composite TSV for 3D IC Interconnects With Electrical and Electro-Thermal Analysis

An overview of infrared thermography for inspection of solder joint in electronic devices

A multifunctional, double network cellulose-acrylamide based hydrogel sensor reinforced using a liquid metal for human motion detection and dual-mode handwriting recognition via a transfer learning algorithm

A lightweight ghost-driven attention network for wire bond positioning in measurement

Thermal analysis of a novel fan-out packaging structure optimized with graphene

Wafer Defect Detection Technology Based on CTM-IYOLOv10 Network

An improved detection algorithm using RFS-YOLOv8n for wafer surface defect

Optimized YOLOv8 based on SGW for surface defect detection of silicon wafer

Wafer Defect Detection Based on YOLO-BA

基于GP-AdaLAM的芯片引脚缺陷快速检测算法

基于机器视觉的喷嘴外形关键尺寸检测系统

硅通孔形状和填充材料对热应力的影响

基于Hough变换的高精度机器视觉对准系统的研究

主动红外微电子封装缺陷检测技术 = Active infrared technology for defect inspection of microelectronics packaging

近十年中国无铅钎料研究进展

基于小波分析的倒装芯片主动红外缺陷检测

基于主动红外热成像的倒装焊缺陷检测方法研究

基于主动红外的倒装芯片缺陷检测研究

硅各向同性深刻蚀中的多层掩模工艺

研究方向