汪学方｜华中科技大学｜学者主页

2018

内置皮拉尼计的硅通孔圆片级MEMS真空封装研究

汪学方

《机械与电子》

2016

Simulation and design of a hot-film air flow sensor with sapphire as substrate

Chunlin Xu, Shannan Zhan, Jingcao Chu, Xuefang Wang, Sheng Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

一种悬浮石墨烯压力传感器的制造与建模

蒋圣伟，师帅，袁娇娇，方靖，徐春林，汪学方

《传感器与微系统》

2013

用于3D封装的带TSV的超薄芯片新型制作方法

袁娇娇，吕植成，汪学方，师帅，吕亚平，张学斌，方靖

《微纳电子技术》

2013

石墨烯压力传感器的研究进展

蒋圣伟，师帅，袁娇娇，方靖，徐春林，汪学方

《微纳电子技术》

2013

Fabricating processes of free-standing silicon nitride thin film for MEMS devices

Shuai Shi, Xuefang Wang, Chunlin Xu, Jiaojiao Yuan, Jing Fang, Shengwei Jiang, Sheng Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2013

Simulation of deflection and stress for MEMS pressure sensor based on graphene

Shengwei Jiang, Xuefang Wang, Shuai Shi, Jiaojiao Yuan, Jing Fang, Can Gao, Sheng Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2013

Research of wet etching in HF-based solution to release SOI-based gyroscope micro-structures

Jing Fang, Xuefang Wang, Chang Hu, Zhicheng Lv, Shuai Shi, Jiaojiao Yuan, Sheng Liu, Can Gao

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2013

Resistance electric filed dependence simulation of piezoresistive silicon pressure sensor and improvement by shield layer

Gang Cao, Chaojun Liu, Xiaogang Liu, Xuefang Wang, Sheng Liu

International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI

2012

应用于MEMS封装的TSV工艺研究

王宇哲，汪学方，徐明海，吕植成，徐春林，胡畅，王志勇，刘胜

《微纳电子技术》

2012

Void free filling of TSV vias by bottom up copper electroplating for wafer level MEMS vacuum packaging

Chunlin Xu, Xuefang Wang, Yuzhe Wang, Minghai Xu, Chang Hu, Sheng Liu

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2012

Deep wet etching process of Pyrex glass for vacuum packaging

Shuai Shi, Xuefang Wang, Minghai Xu, Yuzhe Wang, Jiaojiao Yuan, Sheng Liu

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2012

Modeling and simulation of a micromachined gyroscope using differential frequency approximate match method

Chang Hu, Xuefang Wang, Sheng Liu

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2012

Anodic bonding for Pyrex 7740 and nitride silicon for wafer level vacuum packaging

Minghai Xu, Xuefang Wang, Yuzhe Wang, Chunlin Xu, Chang Hu, Sheng Liu

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2011

MEMS圆片级真空封装金硅键合工艺研究

张卓，汪学方，王宇哲，刘川，刘胜

《电子与封装》

2011

基于热学理论的微型真空检测器件的研究

刘川，汪学方，罗小兵

《工程热物理学报》

2010

A hot platinum thin film anemometer

Chuan Liu, Xiaobing Luo, Zhuo Zhang, Xuefang Wang, Sheng Liu

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2008

一种用于MEMS器件真空密封技术的电阻熔焊方法

王成刚，汪学方，甘志银，林栋，张鸿海，刘胜

《焊接技术》

2008

Measurement of Leak Rate for MEMS Vacuum Packaging

Zhiyin Gan, Dexiu Huang, Xuefang Wang, Dong Liang Lin, Sheng Liu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2007

基于等离子体朗缪尔流效应的新型微机械陀螺仪

汪学方，罗小兵，艾叶，刘胜，张鸿海，甘志银

《仪表技术与传感器》

2007

基于MEMS技术的人造视网膜传感器系统设计

汪学方，张波，刘胜，刘磊

《传感器与微系统》

2007

MEMS器件真空封装内部真空度测试的研究

汪学方，甘志银，刘胜，张鸿海，林栋，王成刚

《仪表技术与传感器》

2006

微陀螺仪的真空回流封装工艺研究

刘文明，王志勇，鲍剑斌，汪学方，关荣峰，朱福龙，刘胜

《微细加工技术》

2006

基于熔焊的MEMS真空封装

林栋，甘志银，汪学方，王成刚，张鸿海，刘胜

《电子工业专用设备》

2006

Hermeticity Investigation of MEMS Vacuum Packaging

Dong Liang Lin, Zhiyin Gan, Xuefang Wang, Chenggang Wang, Honghai Zhang, Sheng Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2005

基于激光干涉测量的硅键合工艺分析

马斌，陈明祥，张鸿海，刘胜，汪学方

《半导体技术》

2005

MEMS封装技术及标准工艺研究

关荣锋，汪学方，甘志银，王志勇，刘胜，张鸿海，黄德修

《半导体技术》

2005

键合技术中键合胶残余应力检测的实验研究

马斌，任继文，张鸿海，刘胜，汪学方，王志勇

《机械科学与技术》

2004

采用五步相移技术对硅片表面翘曲形变的检测

马斌，张鸿海，刘胜，汪学方，王志勇

《机床与液压》

2003

一种用于MEMS检测的无耦合六维力传感器的研制

贺德建，张鸿海，刘胜，汪学方，王志勇

《微纳电子技术》

汪学方

精选作品

期刊论文

内置皮拉尼计的硅通孔圆片级MEMS真空封装研究

Simulation and design of a hot-film air flow sensor with sapphire as substrate

一种悬浮石墨烯压力传感器的制造与建模

用于3D封装的带TSV的超薄芯片新型制作方法

石墨烯压力传感器的研究进展

Fabricating processes of free-standing silicon nitride thin film for MEMS devices

Simulation of deflection and stress for MEMS pressure sensor based on graphene

Research of wet etching in HF-based solution to release SOI-based gyroscope micro-structures

Resistance electric filed dependence simulation of piezoresistive silicon pressure sensor and improvement by shield layer

应用于MEMS封装的TSV工艺研究

Void free filling of TSV vias by bottom up copper electroplating for wafer level MEMS vacuum packaging

Deep wet etching process of Pyrex glass for vacuum packaging

Modeling and simulation of a micromachined gyroscope using differential frequency approximate match method

Anodic bonding for Pyrex 7740 and nitride silicon for wafer level vacuum packaging

MEMS圆片级真空封装金硅键合工艺研究

基于热学理论的微型真空检测器件的研究

A hot platinum thin film anemometer

一种用于MEMS器件真空密封技术的电阻熔焊方法

Measurement of Leak Rate for MEMS Vacuum Packaging

基于等离子体朗缪尔流效应的新型微机械陀螺仪

基于MEMS技术的人造视网膜传感器系统设计

MEMS器件真空封装内部真空度测试的研究

微陀螺仪的真空回流封装工艺研究

基于熔焊的MEMS真空封装

Hermeticity Investigation of MEMS Vacuum Packaging

基于激光干涉测量的硅键合工艺分析

MEMS封装技术及标准工艺研究

键合技术中键合胶残余应力检测的实验研究

采用五步相移技术对硅片表面翘曲形变的检测

一种用于MEMS检测的无耦合六维力传感器的研制

会议论文

芯片键合胶残余应力检测的实验研究

研究方向