郭永环

2025

基于CNN-MOGWO的钢/铝异种金属激光焊焊接工艺参数多目标优化

《焊接》

2025

Multi-objective optimization of process parameters in (PC/TPU) dual-material injection molding

International Polymer Processing

DOI

2025

The effect of FeCoNiCrTi on intermetallic compounds at the aluminum/copper dissimilar metal laser welded interface

Journal of Materials Research and Technology

DOI

2025

Multi-objective Optimization of Steel/Al Laser Welding Parameters Based on RIME-CatBoost and MOAVOA

Journal of Materials Engineering and Performance

DOI

2025

Multi-objective optimization of injection molding process using interpretable extreme gradient boosting model based on improved north eagle optimization algorithm

Journal of Mechanical Science and Technology

DOI

2025

Based on WCA-KELM and MOSOA: optimization of injection molding quality for plastic alloy products

Journal of Polymer Engineering

DOI

2025

Optimization of Glass Fiber Reinforced Injection Molded Product Quality Based on the ILSO-RF Model and MSINSWOA

International Journal of Precision Engineering and Manufacturing

DOI

2024

基于BKA-GBRT与MOSPO的铝/铜激光焊接参数多目标优化

《焊接学报》

2024

ERRATUM: Multi-objective Optimization of Injection Molding Process Based on One-Dimensional Convolutional Neural Network and the Non-dominated Sorting Genetic Algorithm II

SAE International Journal of Materials and Manufacturing

DOI

2024

Changes in Intermetallic Compounds and Mechanical Performance of Steel/Aluminum Welded Joints Containing Nano TiC during Isothermal Aging

ACS Applied Nano Materials

DOI

2024

Control of quality defects of the glass fiber injection molded product based on LSO-RF and NSWOA

Journal of Mechanical Science and Technology

DOI

2024

Effects of Pre‐Placed Nano‐TiC Powder on the Performance of Steel/Aluminum Laser Welded Joints

steel research international

DOI

2024

Optimization of Laser Welded Joints of Steel/Al with Pre-placed High-Entropy Alloy Powder

International Journal of Precision Engineering and Manufacturing

DOI

2024

Correction: Evolution of Microstructure and Mechanical Properties in Dual-Phase Steel Containing Ce and Nb

Journal of Materials Engineering and Performance

DOI

2024

Correction: Multi-objective optimization of laser welding parameters for steel/Al based on Kriging-MSSA

Welding in the World

DOI

2024

Multiobjective optimization of laser welding parameters for P92 steel based on MFO/MOEAD-Kriging

Proceedings of the Institution of Mechanical Engineers Part E Journal of Process Mechanical Engineering

DOI

2024

Multi-objective optimization of laser welding parameters for steel/Al based on Kriging-MSSA

Welding in the World

DOI

2024

Multi-objective optimization of laser welding process parameters of steel/Al based on BO-RF and MOJS

Journal of Mechanical Science and Technology

DOI

2024

Multi-objective Optimization of Injection Molding Process Based on One-Dimensional Convolutional Neural Network and the Non-dominated Sorting Genetic Algorithm II

SAE International Journal of Materials and Manufacturing

DOI

2024

Effect of Rare Earth/Stable Element Oxides on High Temperature Mechanical Properties of Low Chromium Nickel Ferritic Stainless Steel

Lecture notes in mechanical engineering

DOI

2023

Intermetallic compound evolution and mechanical properties of Cu/Sn58Bi/Cu 3D structures blended with B4C nanoparticles during isothermal aging

Journal of Materials Research and Technology

DOI

2023

Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B4C nanoparticles

Journal of Materials Research and Technology

DOI

2023

Ultrasonic-assisted connection of Cu/Cu structure using Sn58Bi solder enhanced by B4C nanoparticles

Journal of Materials Processing Technology

DOI

2023

Microstructure and properties of Sn58Bi/Ni solder joint modified by Mg particles

Journal of Materials Research and Technology

DOI

2023

Study on the dual inhibition behavior of interfacial IMCs in Cu/SAC105/Cu joint by adopting SiC nanowires and nanocrystalline Cu substrate

Journal of Materials Research and Technology

DOI

2023

Quality monitoring of injection molding based on TSO-SVM and MOSSA

Journal of Polymer Engineering

DOI

2023

Evolution of Microstructure and Mechanical Properties in Dual-Phase Steel Containing Ce and Nb

Journal of Materials Engineering and Performance

DOI

2023

Predicting and Controlling the Quality of Injection Molding Properties for Fiber-Reinforced Composites

SAE International Journal of Materials and Manufacturing

DOI

2022

Microstructure Evolution and Thermal, Wetting, Mechanical Properties of Sic Nanowires Reinforced Sac105 Composite Solder

Intermetallics

DOI

2022

Growth behavior and reliability of interfacial IMC for Sn58Bi/Cu and Sn58Bi–AlN/Cu solder joints applied in IGBT modules

Journal of Materials Research and Technology

DOI

2022

Multi-objective Optimization and Quality Monitoring of Two-piece Injection Molding Products

SAE International Journal of Materials and Manufacturing

DOI

2022

Tensile properties and prediction of DP780 treated with rare earth Ce based on DE-SVM-Ⅱ

Materials Today Communications

DOI

2022

Multi-objective optimization of injection molding process parameters based on BO-RFR and NSGAⅡ methods

International Polymer Processing

DOI

2022

Quality Monitoring and Multi-Objective Optimization of the Glass Fiber-Reinforced Plastic Injection Molded Products

SAE International Journal of Materials and Manufacturing

DOI

2022

Quality prediction and control of thin-walled shell injection molding based on GWO-PSO, ACO-BP, and NSGA-II

Journal of Polymer Engineering

DOI

2022

Multi-objective optimization of injection molded parts with insert based on IFOA-GRNN-NSGA-II

Journal of Polymer Engineering

DOI

2022

Experimental-based optimization of polymer injection molding process parameters using anfis-ga method

Journal of Mechanical Science and Technology

DOI

2022

Research on Factors Influencing Tensile Property in CGHAZ of DP780 Steel

Journal of Physics Conference Series

DOI

2021

铈和铌改性对DP780双相钢焊缝冲击性能的影响

《钢铁》

DOI

2021

DP780钢焊接接头温度场及粗晶区相含量数值模拟

《机械工程材料》

2021

薄壁圆管精密激光焊接夹具设计与分析

《制造技术与机床》

DOI

2021

The analysis of the fracture mechanism of thermal simulation CGHAZ of AHSS DP780: based on response surface method and quantum genetic algorithm

Welding in the World

DOI

2021

Warpage optimization of the GFRP injection molding process parameters

Microsystem Technologies

DOI

2020

热输入和退火保温时间对409L铁素体不锈钢TIG焊接接头过热区晶粒尺寸的影响

《机械工程材料》

2020

409L铁素体不锈钢高温疲劳、蠕变性能的研究现状及展望

《材料保护》

DOI

2020

Ti纳米颗粒对三维封装Sn互连材料组织与性能的影响

《稀有金属材料与工程》

2019

热输入对00Cr11Ti铁素体不锈钢焊接过热区组织及力学性能的影响

《热加工工艺》

2019

Numerical simulation and welding parameters optimization for minimum deformation of AHSS based on RSM & QGA

Materials Research Express

DOI

2019

Measurement of Ce/Ti Content in Austenitic Stainless Steel Welding Wire

Steel Research International

DOI

2019

Impact Toughness and Fracture Structure about Welded Joints of Low Chromium Nickel Ferritic Stainless Steel Containing Ce/Ti

Steel Research International

DOI

2019

A Review of Research on DP 780 Welded Joint Microstructure and Mechanical Properties

2019

Microstructure and mechanical properties of thermal simulation CGHAZ of DP780 high strength steel

Materials Research Express

DOI

2018

Ce、Ti对409L低铬镍铁素体不锈钢焊接接头组织和力学性能的影响

《热加工工艺》

2018

CuZnAl记忆颗粒对黄铜/锡/黄铜焊点组织与性能影响

DOI

2018

Materials, processing and reliability of low temperature bonding in 3D chip stacking

Journal of Alloys and Compounds

DOI

2018

Forecasting of mechanical properties of covered electrode containing La/CeO2 based on fuzzy neutral network

Rare Metals

DOI

2017

基于人工神经网络含稀土元素熔敷金属力学性能预测

《沈阳工业大学学报》

2017

V型坡口多层多道焊温度场数值模拟

《热加工工艺》

2017

含Yb的Sn-Zn无铅钎料性能研究

《稀土》

2017

近十年含稀土无铅钎料研究进展及发展趋势

《稀土》

2016

含稀土元素的对接接头焊接数值模拟的现状与应用

《稀土》

2016

电子组装结构中激光软钎焊研究最新进展

《机械科学与技术》

2016

Sn-9Zn/Cu无铅焊点ZnO须自发生长

《焊接学报》

2016

WLCSP30器件SnAgCuFe焊点可靠性研究（英文）

《稀有金属材料与工程》

2016

Yb对Sn-Cu-Ni无铅钎料性能与组织的影响

《稀土》

2016

Ce对CSP36器件SnAgCu焊点可靠性影响研究

《稀土》

2016

Reliability of SnAgCuFe Solder Joints in WLCSP30 Device

DOI

2016

CSP36のはんだ接合部の信頼性に及ぼすCEの影響を研究した。【JST・京大機械翻訳】

2016

希土類元素を含む突合せ溶接継手の溶接数値シミュレーションの現状と応用【JST・京大機械翻訳】

2016

The Current Situation and Application of Welding Numerical Simulation Containing Rare Earth Elements

2016

WLCSP30デバイスのはんだ接合部の信頼性に関する研究【JST・京大機械翻訳】

2015

电子封装结构无铅焊点可靠性有限元模拟的研究进展

《电焊机》

2015

半导体激光钎焊SnAgCuCe无铅焊点组织与性能

《稀土》

2015

Sn-0.3Ag-0.7Cu-xSb无铅钎料润湿性

《焊接学报》

2015

SnAgCu-xEu钎料润湿性能及焊点力学性能研究

《稀土》

2015

SnAgCu-nano Al钎料Anand本构关系及焊点可靠性

DOI

2015

含稀土元素的熔敷金属力学性能预测研究现状分析

《稀土》

2015

基于田口法的Sn-Cu-Ni-xEu无铅钎料润湿性研究

《江苏大学学报(自然科学版)》

2015

电子组装用无铅软钎料研究最新进展

《电子技术应用》

2015

纳米-微米颗粒增强复合钎料研究最新进展

《中南大学学报(自然科学版)》

2015

稀土元素Eu对SnAgCu钎料组织与性能影响

《稀有金属》

2015

低银Sn1.0Ag0.5Cu焊点疲劳寿命预测

《东南大学学报(自然科学版)》

2015

一种含Eu、Li、Al和纳米Mo的自钎性银钎料

2015

Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints

Journal of materials science. Materials in electronics

DOI

2015

Reviews on latest advances in micro/nano-sized particles enhanced composite solders

DOI

2015

Chip stacking interconnected material containing Lu and carbon nano tube

2015

Microstructures and properties of SnAgCu solder doped with Eu

DOI

2015

Containing Eu, Li, Al and Mo from nano silver brazing solder

2015

Creep behavior of SnAgCu solders containing nano-Al particles

Journal of Materials Science: Materials in Electronics

DOI

2015

Wettability optimization analysis of lead-free solders with Taguchi method

Journal of Materials Science: Materials in Electronics

DOI

2015

Sizes effect of CeSn3 on the whiskers growth of SnAgCuCe solder joints in electronic packaging

Journal of materials science. Materials in electronics

DOI

2015

Wettability of Sn-0.3Ag-0.7Cu-xSb lead-free solders

2015

Determination of La/CeO2 content in ilmenite electrode coating

Rare Metals

DOI

2014

热循环对SnAgCu(纳米Al)/Cu焊点界面与性能影响

《材料工程》

2014

一种熔敷金属力学性能测试用试板焊接工装

《机床与液压》

2014

模糊神经网络在焊接性能预测中的应用现状

《电焊机》

2014

La/CeO2对熔敷金属组织与力学性能的影响

《稀土》

2014

Wettability of SnCuNi-xEu solders and mechanical properties of solder joints

DOI

2014

Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices

Microelectronics and reliability

DOI

2014

Reliability of SnAgCu/SnAgCuCe solder joints with different heights for electronic packaging

Journal of Materials Science: Materials in Electronics

DOI

2014

Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

DOI

2014

Reliability of Lead-free Solder Joints in WLCSP Device with Finite Element Simulation and Taguchi Method

DOI

2014

Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices

Electronic Materials Letters

DOI

2014

Reliability of lead-free solder joints in CSP device under thermal cycling

Journal of materials science. Materials in electronics

DOI

2014

Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging

DOI

2014

Properties enhancement of SnAgCu solders containing rare earth Yb

DOI

2014

Dorn Creep Model and Finite Element Simulation of SnAgCu-CNT Solder Joints in FCBGA Device

DOI

2014

Properties and microstructures of SnAgCu–xEu alloys for concentrator silicon solar cells solder layer

DOI

2013

含纳米铝颗粒SnAgCu钎料组织与性能

《焊接学报》

2013

时效对SnAgCu/SnAgCu-TiO2焊点界面与性能影响

《焊接学报》

2013

La/CeO2稀土对熔敷金属拉伸断口形貌与力学性能的影响

《稀有金属》

2013

Effects of rare earth elements on sulphur and phosphorus impurities in deposited metal

China Welding

2013

纳米TiO2颗粒对SnAgCu钎料组织与性能的影响

《稀有金属材料与工程》

2013

Effect of aging on the interface and properties of SnAgCu/SnAgCu-TiO_2 solder joints

2013

Lead-free solder with high creep-resistant property

2013

Intermetallic compound layer growth between SnAgCu solder and Cu substrate in electronic packaging

Journal of Materials Science: Materials in Electronics

DOI

2012

WLCSP器件Sn3.9Ag0.6Cu焊点疲劳寿命预测

《焊接学报》

2012

稀土元素对SnAgCu焊点内部组织的影响机制

《机械工程学报》

2012

稀土元素对无铅钎料组织和性能的影响

《中国有色金属学报》

2012

WLCSP器件结构优化模拟及无铅焊点可靠性

《焊接学报》

2012

Microstructures and properties of SnZn-xEr lead-free solders

DOI

2012

Effect of Zn on properties and microstructure of SnAgCu alloy

Journal of materials science. Materials in electronics

DOI

2012

Microstructures and Properties of SnZn Lead-Free Solder Joints Bearing La for Electronic Packaging

IEEE Transactions on Electron Devices

DOI

2012

Development of SnAg-based lead free solders in electronics packaging

Microelectronics and reliability

DOI

2012

Reliability behavior of lead-free solder joints in electronic components

Journal of materials science. Materials in electronics

DOI

2010

氧化铈对低合金钢焊条焊缝硫磷的影响

《焊接学报》

2010

Influence of ceria on phosphorus and sulphur of low alloy steel weld

2010

Design of Ingredients of Low Carbon Steel Electrode Containing La and Y

2009

氧化铈对低合金钢焊条力学性能的影响

《焊接学报》

2015

含镧铈元素的熔敷金属力学性能预测研究

《第二十次全国焊接学术会议论文集》