孟淼｜同济大学｜学者主页

2026

钛合金电致应力松弛行为及微观组织演变机理：热效应与非热效应

杨岚清，严思梁，向心力，彭赫力，孟淼，李萍

《塑性工程学报》

2026

TA15合金电致动态球化动力学

严思梁，刘子龙，李俊辉，孟淼，黄亮

《稀有金属材料与工程》

2026

Ti65钛合金热变形行为及本构方程

李萍，许海峰，孟淼，虞仁海，薛克敏

《塑性工程学报》

2026

A 150-Msps 77-dB SNDR SAR ADC in 28-nm CMOS

Bingbing Yao, Jiangfan Wen, Likai Shen, Qide Cheng, Miao Meng, Hui Zhang, Lei Qiu

IEEE Custom Integrated Circuits Conference (CICC)

DOI

2026

An 802.11b-WiFi Backscatter Modulator Featuring 30 dB PSLR with All-Digital Gaussian Pulse Shaping

Yongling Zhang, Miao Meng

Digest of papers - IEEE Radio Frequency Integrated Circuits Symposium

DOI

2026

MSCR: Multi-Source-Collaborative Reconfigurable RF Energy Harvester with 3-D MPPT Achieving −32 dBm Sensitivity and 8X Boost in Available Output Power

Yunzhi Ma, Yiming Liu, Haoyu Chen, Yongling Zhang, Lei Qiu, Miao Meng

Digest of papers - IEEE Radio Frequency Integrated Circuits Symposium

DOI

2026

A Multi-Band IoT Tag Featuring a 150Mb/s Calibration-Free 64-QAM Backscatter Modulator and a 10Mb/s LO-Free DBPSK Receiver

Yongling Zhang, Zheng Qin, Lei Qiu, Patrick P. Mercier, Miao Meng

IEEE Custom Integrated Circuits Conference (CICC)

DOI

2026

A 13-b 320-MS/s Noise-Successive-Attenuated SAR ADC with R-C-Traded-Off Reference Buffer

Jiangfan Wen, Qide Cheng, Shenglong Zhuo, Miao Meng, Hui Zhang, Bingbing Yao, Lei Qiu

IEEE Custom Integrated Circuits Conference (CICC)

DOI

2026

A Crystal-Less Backscatter Tag Demonstrating Bi-Directional 802.11b-WiFi Communication with On-the-Fly Baseband Processing

Yongling Zhang, Lei Qiu, Patrick P. Mercier, Miao Meng

IEEE Custom Integrated Circuits Conference (CICC)

DOI

2026

A 0.38 ppm/°C High-Order Compensated Voltage Reference Using Digitized Temperature Range Partitioning

Xiaopeng Wang, Haiwen Tian, Huosheng Wen, Zhongxiao Tian, Jiaqi Yang, Lei Wang, Rui Bai, Yifan Wu, Shenglong Zhuo, Miao Meng, Lei Qiu

IEEE Custom Integrated Circuits Conference (CICC)

DOI

2026

A Sub-μW VCO-Based Direct Digitization Front-End with an Auto-Ranging Technique Achieving 1.8 NEF and 182.3 FoMDR for Energy-Efficient Neural Recording

Hong Liao, Xiaoxu Yang, Minghao Chen, Yuqian Li, Lei Qiu, Patrick P. Mercier, Miao Meng

2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

DOI

2026

A 23μW 158.4dB FoM Triple-Slope Current-to-Digital Converter with Digital Thermal Noise Reduction for Electrochemical Current Readout

Minghao Chen, Miao Meng

International Symposium on Circuits and Systems

DOI

2026

An 8.2μW Fully-Packaged Wireless Implantable SoC for Chemical and Electrical Neural Signal Monitoring

Minghao Chen, Gang-Zhen Zhu, Wen-Jun Zhao, Hong Liao, Xiaoxu Yang, Yuqian Li, Jiahao Dong, Bing-Fang Wang, Zhiqiang Chang, Ying Fang, Jiang-Feng Wu, Lei Qiu, Miao Meng

IEEE Custom Integrated Circuits Conference

DOI

2025

钛合金变截面筋板类构件局部加载成形工艺研究

孟淼，叶龙涛，薛克敏，严思梁

《塑性工程学报》

2025

具有不同典型显微组织Ti-22Al-26Nb合金的高温断裂行为（英文）

张勇强，薛克敏，孟淼，严思梁，李萍

Transactions of Nonferrous Metals Society of China

2025

A Low-Power Backscatter System With a Digitally Controlled Reconfigurable 16-QAM Modulator for Energy-Efficient Wireless Communication

Yongling Zhang, Ji Xiong, Miao Meng

IEEE Journal of Solid-State Circuits

DOI

2025

A Battery-Less Backscatter Tag Supporting Energy-and Spectrally-Efficient Bidirectional WiFi Communication and Ad Hoc Networking

Yongling Zhang, Ji Xiong, Tianle Tang, Wenjun Zhao, Jiangfeng Wu, Miao Meng

DOI

2025

An Implantable Fully-Packaged Current-Controlled Wireless Near-Adiabatic Neural Stimulator Achieving 71.7% Peak Efficiency and 13.5% Efficiency Variation Across Supported Stimulation Current Range

Hong Liao, Wentao Ma, Xiaoxu Yang, Jianfang Nie, Bingfang Wang, Zhiqiang Chang, Yin Fang, Miao Meng

IEEE Custom Integrated Circuits Conference (CICC)

DOI

2025

A Wearable Backscatter System Featuring Concurrent RF Harvesting and Bidirectional Communication with Commodity BLE Transceivers

Ji Xiong, Yongling Zhang, Junzai Chen, Xiao-Yu Li, Jin-Rui Zuo, Yan Wang, Xiaoyi Wang, Miao Meng

IEEE Custom Integrated Circuits Conference

DOI

2025

A Battery-Free BLE Backscatter Communication Chip for Wearable Systems

Yongling Zhang, Ji Xiong, Junzai Chen, Xiao-Yu Li, Jin-Rui Zuo, Yan Wang, Xiaoyi Wang, Miao Meng

IEEE Solid-State Circuits Letters

DOI

2024

A 45μW Ultrasonic Implantable Wireless Neural Recording Chip Featuring Simultaneous Power Transmission and Backscatter Communication

Xiaoxu Yang, Yongling Zhang, Wentao Ma, Dahai Yao, Tianle Tang, Miao Meng

IEEE Biomedical Circuits and Systems Conference (BioCAS)

DOI

2024

A Fully On-chip 0.04mm2 Power Management Unit with Low Output Ripple for Ultrasonic Wireless Powered Micro Implantable Medical Devices

Wentao Ma, Miao Meng

IEEE Biomedical Circuits and Systems Conference (BioCAS)

DOI

2024

12.4 A 19μW 200Mb/s loT Tag Demonstrating High-Definition Video Streaming via a Digital-Switch-Based Reconfigurable 16-QAM Backscatter Communication Technique

Yongling Zhang, Rongliang Luo, Ji Xiong, Si-Qi Liang, Miao Meng

IEEE International Solid-State Circuits Conference

DOI

2023

电磁成形中材料本构模型研究进展

严思梁，胡磊，张晓丽，孟淼，薛克敏

《塑性工程学报》

2023

A Fully-Reflective Wi-Fi-Compatible Backscatter Communication System With Retro-Reflective MIMO Gain for Improved Range

Miao Meng, Manideep Dunna, Shih-Kai Kuo, Hans C. Yu, Po-Han Peter Wang, Dinesh Bharadia, Patrick P. Mercier

IEEE Journal of Solid-State Circuits

DOI

2022

变形温度对大塑性变形TA15合金显微组织和力学性能的影响

纪小虎，孟淼，严思梁，李萍，甘国强，薛克敏

《中国有色金属学报》

2022

基于三维静电场法的高强铝合金多筋变截面构件预成形优化设计

李萍，徐洪磊，黄晓雨，孟淼，薛克敏

《塑性工程学报》

2022

A GMSK/PAM4 Multichannel Magnetic Human Body Communication Transceiver

Miao Meng, Hossein Rahmanian Kooshkaki, Xiaoyang Wang, Shih-Kai Kuo, Erda Wen, Patrick P. Mercier

IEEE Solid-State Circuits Letters

DOI

2021

7075铝合金半固态制坯及触变挤压成形

牛海侠，孟淼，李萍，薛克敏

《塑性工程学报》

2021

SyncScatter: Enabling WiFi like synchronization and range for WiFi backscatter Communication

Manideep Dunna, Miao Meng, P. Wang, Chi Zhang, P. Mercier, Dinesh Bharadia

Symposium on Networked Systems Design and Implementation

2019

钛合金大型构件局部加载近等温成形三态组织形成机制研究

孟淼

《西北工业大学》

2019

27.4 Multi-Beam Shared-Inductor Reconfigurable Voltage/SECE-Mode Piezoelectric Energy Harvesting of Multi-Axial Human Motion

Miao Meng, Ahmed Ibrahim, T. Xue, H. Yeo, Dixiong Wang, S. Roundy, S. Trolier-McKinstry, M. Kiani

IEEE International Solid-State Circuits Conference

DOI

2019

Innovative Implantable and Wearable Medical Devices Enabled by Ultrasonic Power Transfer and Piezoelectric Energy Harvesting

Miao Meng

2019

Gastric Seed: Towards Distributed Ultrasonically Interrogated Millimeter-Sized Implants for Large-Scale Gastric Electrical-Wave Recording

Miao Meng, M. Kiani

IEEE Transactions on Circuits and Systems - II - Express Briefs

DOI

2019

Self-Image-Guided Ultrasonic Wireless Power Transmission to Millimeter-Sized Biomedical Implants

Miao Meng, M. Kiani

Annual International Conference of the IEEE Engineering in Medicine and Biology Society

DOI

2019

A Multi-Beam Shared-Inductor Reconfigurable Voltage/SECE Mode Piezoelectric Energy Harvesting Interface Circuit

Miao Meng, Dixiong Wang, B. Truong, S. Trolier-McKinstry, S. Roundy, M. Kiani

IEEE Transactions on Biomedical Circuits and Systems

DOI

2019

An Ultrasonically Powered Wireless System for In Vivo Gastric Slow-Wave Recording

Miao Meng, Philip P. Graybill, R. Ramos, Amir Javan-Khoshkholgh, Aydin Farajidavar, M. Kiani

Annual International Conference of the IEEE Engineering in Medicine and Biology Society

DOI

2018

A Comprehensive Comparative Study on Inductive and Ultrasonic Wireless Power Transmission to Biomedical Implants

Ahmed Ibrahim, Miao Meng, M. Kiani

IEEE Sensors Journal

DOI

2017

Design and Optimization of Ultrasonic Wireless Power Transmission Links for Millimeter-Sized Biomedical Implants

Miao Meng, M. Kiani

IEEE Transactions on Biomedical Circuits and Systems

DOI

2017

A Hybrid Inductive-Ultrasonic Link for Wireless Power Transmission to Millimeter-Sized Biomedical Implants

Miao Meng, M. Kiani

IEEE Transactions on Circuits and Systems - II - Express Briefs

DOI

2017

Inductive and ultrasonic wireless power transmission to biomedical implants

Ahmed Ibrahim, Miao Meng, M. Kiani

International Symposium on Circuits and Systems

DOI

2016

Optimal resonance configuration for ultrasonic wireless power transmission to millimeter-sized biomedical implants.

Miao Meng, M. Kiani

Conference proceedings

DOI

2015

Design considerations for ultrasonic power transmission to millimeter-sized implantable microelectronics devices

Miao Meng, Ahmed Ibrahim, M. Kiani

Biomedical Circuits and Systems Conference

DOI

精选作品

期刊论文

钛合金电致应力松弛行为及微观组织演变机理：热效应与非热效应

TA15合金电致动态球化动力学

Ti65钛合金热变形行为及本构方程

A 150-Msps 77-dB SNDR SAR ADC in 28-nm CMOS

An 802.11b-WiFi Backscatter Modulator Featuring 30 dB PSLR with All-Digital Gaussian Pulse Shaping

MSCR: Multi-Source-Collaborative Reconfigurable RF Energy Harvester with 3-D MPPT Achieving −32 dBm Sensitivity and 8X Boost in Available Output Power

A Multi-Band IoT Tag Featuring a 150Mb/s Calibration-Free 64-QAM Backscatter Modulator and a 10Mb/s LO-Free DBPSK Receiver

A 13-b 320-MS/s Noise-Successive-Attenuated SAR ADC with R-C-Traded-Off Reference Buffer

A Crystal-Less Backscatter Tag Demonstrating Bi-Directional 802.11b-WiFi Communication with On-the-Fly Baseband Processing

A 0.38 ppm/°C High-Order Compensated Voltage Reference Using Digitized Temperature Range Partitioning

A Sub-μW VCO-Based Direct Digitization Front-End with an Auto-Ranging Technique Achieving 1.8 NEF and 182.3 FoMDR for Energy-Efficient Neural Recording

A 23μW 158.4dB FoM Triple-Slope Current-to-Digital Converter with Digital Thermal Noise Reduction for Electrochemical Current Readout

An 8.2μW Fully-Packaged Wireless Implantable SoC for Chemical and Electrical Neural Signal Monitoring

钛合金变截面筋板类构件局部加载成形工艺研究

具有不同典型显微组织Ti-22Al-26Nb合金的高温断裂行为（英文）

A Low-Power Backscatter System With a Digitally Controlled Reconfigurable 16-QAM Modulator for Energy-Efficient Wireless Communication

A Battery-Less Backscatter Tag Supporting Energy-and Spectrally-Efficient Bidirectional WiFi Communication and Ad Hoc Networking

An Implantable Fully-Packaged Current-Controlled Wireless Near-Adiabatic Neural Stimulator Achieving 71.7% Peak Efficiency and 13.5% Efficiency Variation Across Supported Stimulation Current Range

A Wearable Backscatter System Featuring Concurrent RF Harvesting and Bidirectional Communication with Commodity BLE Transceivers

A Battery-Free BLE Backscatter Communication Chip for Wearable Systems

A 45μW Ultrasonic Implantable Wireless Neural Recording Chip Featuring Simultaneous Power Transmission and Backscatter Communication

A Fully On-chip 0.04mm2 Power Management Unit with Low Output Ripple for Ultrasonic Wireless Powered Micro Implantable Medical Devices

12.4 A 19μW 200Mb/s loT Tag Demonstrating High-Definition Video Streaming via a Digital-Switch-Based Reconfigurable 16-QAM Backscatter Communication Technique

电磁成形中材料本构模型研究进展

A Fully-Reflective Wi-Fi-Compatible Backscatter Communication System With Retro-Reflective MIMO Gain for Improved Range

变形温度对大塑性变形TA15合金显微组织和力学性能的影响

基于三维静电场法的高强铝合金多筋变截面构件预成形优化设计

A GMSK/PAM4 Multichannel Magnetic Human Body Communication Transceiver

7075铝合金半固态制坯及触变挤压成形

SyncScatter: Enabling WiFi like synchronization and range for WiFi backscatter Communication

钛合金大型构件局部加载近等温成形三态组织形成机制研究

27.4 Multi-Beam Shared-Inductor Reconfigurable Voltage/SECE-Mode Piezoelectric Energy Harvesting of Multi-Axial Human Motion

Innovative Implantable and Wearable Medical Devices Enabled by Ultrasonic Power Transfer and Piezoelectric Energy Harvesting

Gastric Seed: Towards Distributed Ultrasonically Interrogated Millimeter-Sized Implants for Large-Scale Gastric Electrical-Wave Recording

Self-Image-Guided Ultrasonic Wireless Power Transmission to Millimeter-Sized Biomedical Implants

A Multi-Beam Shared-Inductor Reconfigurable Voltage/SECE Mode Piezoelectric Energy Harvesting Interface Circuit

An Ultrasonically Powered Wireless System for In Vivo Gastric Slow-Wave Recording

A Comprehensive Comparative Study on Inductive and Ultrasonic Wireless Power Transmission to Biomedical Implants

Design and Optimization of Ultrasonic Wireless Power Transmission Links for Millimeter-Sized Biomedical Implants

A Hybrid Inductive-Ultrasonic Link for Wireless Power Transmission to Millimeter-Sized Biomedical Implants

Inductive and ultrasonic wireless power transmission to biomedical implants

Optimal resonance configuration for ultrasonic wireless power transmission to millimeter-sized biomedical implants.

Design considerations for ultrasonic power transmission to millimeter-sized implantable microelectronics devices

研究方向