代岩伟｜北京工业大学｜学者主页

2026

基于封装结构版图的高保真湿扩散仿真方法

刘泓利，代岩伟，秦飞

《电子与封装》

DOI

2026

智能卡传递模塑过程诱发的金线偏移仿真计算

刘蒙恩，宋晓健，江永，代岩伟

《电子与封装》

2026

玻璃芯基板研究进展：从工艺到可靠性

刘泓利，代岩伟，秦飞

《电子与封装》

2026

γ-ray irradiation effects on mechanical and thermophysical properties of Ajinomoto build-up film: A comparative study

Fei Qin, Ziru Niu, Hongli Liu, Changhao Chen, Shimeng Xu, Yanwei Dai

Microelectronics Reliability

DOI

2026

Dislocation-climb-mediated void evolution in creeping metallic crystals

Huadong Zhang, Weichen Kong, Yanwei Dai, Yinghua Liu

International Journal of Plasticity

DOI

2026

Phase-Field Modeling of Crack Propagation in Multilayer Thin-Film Structures for Electronic Packaging

Xinyi Luo, Xin Zhang, Yanwei Dai, Tao Wang, Haidong Fan, Peidong Li

Acta Mechanica Solida Sinica

DOI

2026

Quasi in-situ scratch performances of pressureless sintered nano-copper under various sintering processes

Yanwei Dai, Yudong Wu, Qiang Jia, Fei Qin

Materials Science in Semiconductor Processing

DOI

2026

Artificial intelligence-assisted reliability assessment in electronics packaging: a brief review

Yanwei Dai, Fei Qin, Xinyue Jia, Yuqi Hao

Moore and More

DOI

2026

Exploring the phenomenon of pseudo-constraint in computational fracture mechanics

Weichen Kong, Yanwei Dai, Yinghua Liu, Yuh J. Chao

Engineering Fracture Mechanics

DOI

2026

Structural optimization design of LTCC substrate and their impacts on thermal performances of system-in-package

Ge Shi, Zhong-Jun Yu, Zheng Xu, Xing-Yao Zeng, Yan-Wei Dai, Fei Qin, Hai-Bo Zhang

Microelectronics and reliability

DOI

2025

埋入式晶圆级封装芯片翘曲有限元仿真及参数敏感性分析

吴道伟，李贺超，李逵，张雨婷，代岩伟，秦飞

《半导体技术》

DOI

2025

基于循环内聚力模型的TSV界面裂纹扩展模拟研究

黄玉亮，秦飞，吴道伟，李逵，张雨婷，代岩伟

《电子与封装》

DOI

2025

基于MLP-LSTM机器学习模型的烧结纳米银高温老化力学性能快速反演与预测

赵利波，代岩伟，秦飞

《电子与封装》

2025

深度学习辅助的纳米薄膜材料压痕力学性能反演与预测

于鹏举，隗嘉慧，代岩伟，秦飞

《航空科学技术》

DOI

2025

不同直径TSV-Cu的纳米压痕力学性能表征

张卓浩，秦飞，吴道伟，李逵，代岩伟

《物理测试》

DOI

2025

A Novel Wafer Warpage Prediction Method Considering Characteristics of Back-End-of-Line Layers and Nonlinear Stress–Strain Relation of Cu Under Large Temperature Variations

Chong Ma, Hongli Liu, Fei Qin, Yanwei Dai

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2025

Phase-field fracture modeling for thermo-electro-elastic quasicrystals: A novel energy decomposition approach

Simin Zhao, Raj Kiran V, Yanwei Dai, Xin Zhang, Haidong Fan, Qingyuan Wang, Peidong Li

Applied Mathematical Modelling

DOI

2025

Experimental and Numerical Study on Various Liquid-Cooled Heat Sinks Including Topology Optimization

Ge Shi, Yanwei Dai, Zhongjun Yu, Xingyao Zeng, Cheng Ling Tan, Haibo Zhang, Guang Yang, Fei Qin

Micromachines

DOI

2025

A microstructure based thermo-elastoplastic phase-field modelling for three-dimensional fatigue crack growth of nano-silver layer

Yulin Liu, Yulin Liu, Yanwei Dai, Yinghua Liu, Yinghua Liu

International Journal of Fatigue

DOI

2025

Reliability of LTCC RF SiP Plate Antenna Solder Ball under Random Vibration Simulation

Ge Shi, Fei Qin, Shirong Li, Yanwei Dai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Simulation of Solder Ball Reliability of LTCC RF SiP Components under Thermal Cycling Load

Shirong Li, Fei Qin, Ge Shi, Yanwei Dai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Modelling of ultrasonic bonding process and parameter effect on gold wire balloons

Hechao Li, Kui Li, Yanwei Dai, Fei Qin, Daowei Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Effect of dual annealing process on stress-strain relations of through silicon vias-copper

Zhuohao Zhang, Fei Qin, Kui Li, Daowei Wu, Yuting Zhang, Yanwei Dai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Numerical model for predicting warpage of wafer with back-end-of-line layers: A comparison investigation

Chong Ma, Hongli Liu, Fei Hu Qin, Yanwei Dai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Numerical investigation on delamination and warpage behaviors of three-dimensional multilayered package on package under thermal loading

Xingyu Liu, Yanwei Dai, Kui Li, Fei Qin

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Numerical study on heat transfer behaviors in reflow soldering process

Hechao Li, Yanwei Dai, Fei Hu Qin, Kui Li

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Determination of fracture toughness and CZM parameters of interfaces for three-dimensional multilayered package on package

Xingyu Liu, Yanwei Dai, Kui Li, Fei Qin, Daowei Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

A Machine Learning Framework for Rapidly Identifying and Predicting Mechanical Properties of Interconnected Layer in SiC Module Considering Surface Metallization Effect Under High-Temperature Aging

Libo Zhao, Yanwei Dai, Fei Qin

IEEE Transactions on Industrial Informatics

DOI

2025

A 3D microstructural constraint-based remaining ductility model for creep crack growth in metals

Weichen Kong, Yanwei Dai, Yinghua Liu, Kamran M. Nikbin

International Journal of Solids and Structures

DOI

2025

A dual-scale stochastic analysis framework for creep failure considering microstructural randomness

Weichen Kong, Yanwei Dai, Xiang Zhang, Yinghua Liu

International Journal of Plasticity

DOI

2025

Investigation of creep behaviors in three-dimensional porous sintered silver by FFT homogenization

Shiwei Ma, Yanwei Dai, Yinghua Liu

International Journal of Mechanical Sciences

DOI

2025

Predicting effective thermal conductivity of sintered nano-Ag with artificial neural networks

Libo Zhao, Jiahui Wei, Yan-Wei Dai, Dao-Wei Wu, Yu-Ting Zhang, Kui Li, Fei Qin

International Journal of AI for Materials and Design

DOI

2024

基于数据驱动的纳米烧结银内聚力模型参数反演与预测

代岩伟，隗嘉慧，秦飞

《电子与封装》

2024

基于SVR数据驱动模型的SiC功率器件关键互连结构热疲劳寿命预测研究

于鹏举，代岩伟，秦飞

《电子与封装》

2024

Cohesive Zone Parameters Extraction for Sintered Nano Ag/Al Joints With the Different Surface Finish Layers Under High Temperature Aging

Libo Zhao, Yanwei Dai, Fei Qin

IEEE Transactions on Device and Materials Reliability

DOI

2024

Deep learning assisted prediction on main factors influencing shear strength of sintered nano Ag-Al joints under high temperature aging

Libo Zhao, Yanwei Dai, Fei Qin

Engineering Failure Analysis

DOI

2024

Structural fatigue crack propagation simulation and life prediction based on improved XFEM-VCCT

Zhiying Chen, Yanwei Dai, Yinghua Liu

Engineering Fracture Mechanics

DOI

2024

Heat Dissipation Optimization Study of Active Phased Array Antenna Microchannel

Ge Shi, Fei Qin, Guang Yang, Yanwei Dai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

A Machine Learning Framework to Predict the Thermal Fatigue Lifetime of SiC Module with Sintered Silver Layer

Pengju Yu, Yanwei Dai, Fei Qin

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Determination of Cohesive Zone Model (CZM) and Numerical Analysis of Interface Fracture in Sintered Silver with Different Metallization Layers

Xingyu Liu, Yanwei Dai, Rong Kang, Libo Zhao, Fei Qin

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Effect of Different Solder Layer Damage on Junction Temperature of IGBT Module

Siyuan Song, Tong An, Fei Qin, Yanpeng Gong, Yanwei Dai, Pei Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Heat Dissipation Optimization Study of LTCC-Based RF SiP Components

Guang Yang, Fei Hu Qin, Ge Shi, Yanwei Dai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

A higher-order asymptotic solution for 3D sharp V-notch front tip fields in creeping solids

Weichen Kong, Yanwei Dai, Yinghua Liu

Engineering Fracture Mechanics

DOI

2024

Crack propagation simulation and overload fatigue life prediction via enhanced physics-informed neural networks

Zhiying Chen, Yanwei Dai, Yinghua Liu

International Journal of Fatigue

DOI

2024

Recurrent neural network (RNN) and long short-term memory neural network (LSTM) based data-driven methods for identifying cohesive zone law parameters of nickel-modified carbon nanotube reinforced sintered nano-silver adhesives

Yanwei Dai, Jiahui Wei, Fei Qin, Fei Qin

Materials Today Communications

DOI

2024

Elastoplastic nanoindentation behaviors of sintered nano-silver under various sintering parameters

Yanwei Dai, Libo Zhao, Fei Qin, Si Chen

Soldering and Surface Mount Technology

DOI

2024

Pre-notch and pre-crack size effects on T-peel fracture behaviors of SAC305 solder joints

Yanwei Dai, Jianfeng Wang, Jiarui Yu, Mengen Liu, Fei Qin

Theoretical and Applied Fracture Mechanics

DOI

2024

Mode I fracture of sintered nano-silver doped with nickel-coated multiwall carbon nanotube

Yanwei Dai, Libo Zhao, Zhi Zan, Fei Qin

Materials Science in Semiconductor Processing

DOI

2023

基于层级多尺度方法的TSV晶圆翘曲预测模型研究

孙国立，秦飞，代岩伟，李宝霞

《微电子学与计算机》

DOI

2023

基于数据驱动的电子封装焊点疲劳寿命预测方法研究进展与挑战

代岩伟，秦飞，于鹏举，李逵

《微电子学与计算机》

2023

包镍多壁碳纳米管增强SAC305焊料的Ⅰ型断裂机理研究

张谋，秦飞，代岩伟

《微电子学与计算机》

DOI

2023

Nanoindentation Elastoplastic and Creep Behaviors of Sintered Nano-Silver Doped with Nickel-Modified Multiwall Carbon Nanotube Filler

Yanwei Dai, Zhi Zan, Libo Zhao, Fei Qin

Journal of Electronic Materials

DOI

2023

Deep neural network aided cohesive zone parameter identifications through die shear test in electronic packaging

Libo Zhao, Yanwei Dai, Jiahui Wei, Fei Qin

Fatigue & Fracture of Engineering Materials & Structures

DOI

2023

Inverse identification of cohesive zone parameters for sintered nano-silver joints based on dynamic convolution neural network

Jiahui Wei, Yanwei Dai, Fei Qin

Engineering Fracture Mechanics

DOI

2023

Research on heat dissipation performance of double-sided cooling IGBT module

Zuoyi Huang, Tong An, Fei Qin, Yanpeng Gong, Yanwei Dai, Zhen Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Thickness effect on shear fracture toughness of sintered silver joints

Rong Kang, Yanwei Dai, Fei Qin, Yanning Li

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Theoretical analysis and prediction for thermal stress of sintered silver interconnection structure based on modified Suhir's solution

Jiahui Wei, Yanwei Dai, Fei Qin

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Mode I fracture of graphene reinforced Sn-Ag-Cu solder joints

Jianfeng Wang, Yanwei Dai, Fei Qin, Kui Li

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Study on cracking behavior of sintering silver joints based on cohesive zone model

Rui Liang Yang, Yanwei Dai, Fei Qin

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Prediction of bonding strength for sintered Ag/DBA joints based on cohesive zone model

Libo Zhao, Yanwei Dai, Fei Qin, Qiang Jia

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Effect of Si segregation at grain boundaries on the mechanical behaviours of ageing Al metallization layer in insulated gate bipolar transistor module

Tong An, Xiaoxuan Chen, Qi Wang, Jing Han, Fei Qin, Yanwei Dai, Pei Chen, Yanpeng Gong

Molecular Simulation

DOI

2023

Life prediction of corrosion-fatigue based on a new crack growth rate model with damage and the extended finite element method

Zhiying Chen, Yanwei Dai, Yinghua Liu

Engineering Fracture Mechanics

DOI

2023

Numerical study on high-cycle fatigue crack growth of sinusoidal interface based on cyclic cohesive zone model

Zhiying Chen, Yanwei Dai, Yinghua Liu

International Journal of Fatigue

DOI

2023

Shear fracture resistance enhancement through micropatterning on copper substrate for sintered nano silver joints

Yanwei Dai, Shuai Zhao, Fei Qin, Tong An, Yanpeng Gong, Pei Chen

International Journal of Adhesion and Adhesives

DOI

2023

Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices

Song Wang, Ge Shi, Libo Zhao, Yanwei Dai, Tianyu Hou, Ying He, Ping Chen, Fei Qin

Crystals

DOI

2023

Comparative Study of the Parameter Acquisition Methods for the Cauer Thermal Network Model of an IGBT Module

Tong An, Rui Zhou, Fei Qin, Yanwei Dai, Yanpeng Gong, Pei Chen

Electronics

DOI

2023

Bondline thickness effect on fracture and cohesive zone model of sintered nano silver adhesive joints under end notched flexure tests

Yanwei Dai, Yanning Li, Zhi Zan, Fei Qin

Fatigue & Fracture of Engineering Materials & Structures

DOI

2023

Macro–Mesoscale Modeling of the Evolution of the Surface Roughness of the Al Metallization Layer of an IGBT Module during Power Cycling

Tong An, Xueheng Zheng, Fei Qin, Yanwei Dai, Yanpeng Gong, Pei Chen

Materials

DOI

2023

Effects of nonproportional loading and residual stress on creep crack tip fields

Wei Liu, Wei Liu, Yanwei Dai, Yinghua Liu, Weichen Kong

Engineering Fracture Mechanics

DOI

2023

Holding time effect on mechanical properties and protrusion behaviors of through silicon via copper under various annealing processes

Min Zhang, Fei Hu Qin, Si Chen, Yanwei Dai, Yifan Jin, Pei Chen, Tong An, Yanpeng Gong

Materials Science in Semiconductor Processing

DOI

2023

Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading

Min Zhang, Fangzhou Chen, Fei Qin, Si Chen, Yanwei Dai

Materials

DOI

2022

包镍碳纳米管提高烧结银的断裂韧性

代岩伟，昝智，秦飞

《电子与封装》

2022

2.5D封装结构回流焊过程热应力分析

李逵，吴婷，赵帅，郭雁蓉，杨宇军，代岩伟，秦飞

《半导体技术》

2022

Effect of Capped Cu Layer on Protrusion Behaviors of Through Silicon via Copper (TSV-Cu) Under Double Annealing Conditions: Comparative Study

Min Zhang, Fei Qin, Si Chen, Yanwei Dai, Yifan Jin, Pei Chen, Tong An, Yanpeng Gong

IEEE Transactions on Device and Materials Reliability

DOI

2022

Computational Modeling of Intergranular Crack Propagation in燼n營ntermetallic Compound Layer

Tong An, Rui Zhou, Fei Qin, Pei Chen, Yanwei Dai, Yanpeng Gong

Computer Modeling in Engineering & Sciences

DOI

2022

Plane stress sharp V-notch tip field in power-law creeping solids

Weichen Kong, Shuaifeng Ma, Yanwei Dai, Yinghua Liu

Engineering Fracture Mechanics

DOI

2022

Stress analysis of automotive IGBT module under vibration load

Yanzhong Tian, Tong An, Fei Qin, Yanpeng Gong, Yanwei Dai, Yanpeng Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Influence of chip layout on temperature distribution of multi-chip press pack IGBT devices

Rui Zhou, Tong An, Fei Qin, Yanpeng Gong, Yanwei Dai, Pei Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Warpage Prediction of Wafer-Level Interposer Packaging Using Equivalent Model

Guoli Sun, Yanwei Dai, Fei Qin, Baoxia Li

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

CZM determination and numerical analysis on interface delamination of nickel coated carbon nanotubes reinforced sintered silver interconnection layers

Zhi Zan, Yanwei Dai, Shuai Zhao, Fei Qin

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Numerical simulation of thermal-mechanical of IGBT Al metalization layer under power cycling

Xueheng Zheng, Tong An, Fei Qin, Yanpeng Gong, Yanwei Dai, Pei Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Porosity effect on fatigue life of sintered silver during thermal cycling

Haotian Yu, Fei Qin, Yanwei Dai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Microstructure evolution and protrusion of through silicon via copper (TSV-Cu) considering different annealing heating rates

Min Zhang, Yanwei Dai, Fei Qin, Yifan Jin

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Thermal-stress Finite Element Analysis of Different Bonding Wire Shapes of IGBT

Qi Wang, Tong An, Fei Qin, Yanpeng Gong, Yanwei Dai, Pei Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Thermal stress analysis of wafer-level multilayer stacking process for 3D-TSV packaging

Shengjun Zhao, Si Chen, Fei Qin, Yanwei Dai, Yanpeng Gong

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Effect of the thermal contact resistance on the heat dissipation performance of the press-pack IGBT module

Zuoyi Huang, Tong An, Fei Qin, Yanpeng Gong, Yanwei Dai, Pei Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Study on the effect of surface roughness characteristics on thermal contact resistance of PP-IGBTs

Yakun Zhang, Tong An, Fei Qin, Yanpeng Gong, Yanwei Dai, Pei Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Three-dimensional sharp V-notch stress intensity factor and strain energy rate density under creeping conditions

Weichen Kong, Yanwei Dai, Yinghua Liu

Engineering Fracture Mechanics

DOI

2022

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen

Journal of Electronic Packaging

DOI

2022

Mode II cohesive zone law of porous sintered silver joints with nickel coated multiwall carbon nanotube additive under ENF test

Yanwei Dai, Zhi Zan, Shuai Zhao, Fei Qin

Theoretical and Applied Fracture Mechanics

DOI

2022

Influences of material mismatch on interface crack tip field in three layered creeping materials

Yanwei Dai, Fei Qin, Yinghua Liu, Haofeng Chen

Engineering Failure Analysis

DOI

2022

First-principles study of copper contamination in silicon semiconductor

Pei Chen, Yadong Li, Fei Qin, Tong An, Yanwei Dai, Min Zhang, Minghui Liu, Lipeng Zhang

Surfaces and Interfaces

DOI

2022

Mud-Cracking Effect of Sintered Silver Layer on Quantifying Heat Transfer Behavior of SiC Devices Under Power Cycling: Voronoi Tessellation Model

Fei Qin, Shuai Zhao, Yanwei Dai, Yuankun Hu, Tong An, Yanpeng Gong

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2022

Comparison of junction temperature variations of IGBT modules under DC and PWM power cycling test conditions

Tong An, Yanzhong Tian, Fei Qin, Yanwei Dai, Yanpeng Gong, Pei Chen

Journal of Power Electronics

DOI

2022

Numerical prediction based on XFEM for mixed-mode crack growth path and fatigue life under cyclic overload

Zhiying Chen, Hongchen Bao, Yanwei Dai, Yinghua Liu

International Journal of Fatigue

DOI

2022

Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes

Min Zhang, Fei Qin, Si Chen, Yanwei Dai, Pei Chen, Tong An

Journal of Electronic Materials

DOI

2022

Effect of surface finish metallization layer on shearing fracture toughness of sintered silver bonded joints

Shuai Zhao, Yanwei Dai, Fei Qin, Yanning Li, Tong An, Yanpeng Gong

Engineering Fracture Mechanics

DOI

2022

The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure

Fei Qin, Qi He, Yanpeng Gong, Tong An, Pei Chen, Yanwei Dai

Engineering Analysis with Boundary Elements

DOI

2021

热、振及热振耦合条件下塑封球栅阵列含铅焊点失效分析

安彤，陈晓萱，秦飞，代岩伟，公颜鹏

《焊接学报》

2021

Shearing fracture toughness enhancement for sintered silver with nickel coated multiwall carbon nanotubes additive

Yanwei Dai, Zhi Zan, Shuai Zhao, Yanning Li, Fei Qin

Engineering Fracture Mechanics

DOI

2021

The Effect of the Surface Roughness Characteristics of the Contact Interface on the Thermal Contact Resistance of the PP-IGBT Module

Tong An, Zezheng Li, Yakun Zhang, Fei Qin, Liang Wang, Zhongkang Lin, Xinling Tang, Yanwei Dai, Yanpeng Gong, Pei Chen

IEEE Transactions on Power Electronics

DOI

2021

Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling

Fei Qin, Shuai Zhao, Yanwei Dai, Lingyun Liu, Tong An, Pei Chen, Yanpeng Gong

Journal of Electronic Packaging

DOI

2021

Out-of-plane effect on the sharp V-notch tip fields in power-law creeping solids: A three-dimensional asymptotic analysis

Weichen Kong, Yanwei Dai, Yinghua Liu

International Journal of Solids and Structures

DOI

2021

Effectiveness Validation on Equivalent Model for Wafer-Level Warpage Prediction

Guoli Sun, Jiahui Wei, Fei Qin, Yanwei Dai, Kui Li, Baoxia Li

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2021

Loading rate on mode II fracture toughness of sintered silver

Yanning Li, Yanwei Dai, Fei Qin, Shuai Zhao

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2021

Thickness and metallization layer effect on interfacial and vertical cracking of sintered silver layer: A numerical investigation

Fei Qin, Shuai Zhao, Lingyun Liu, Yanwei Dai, Tong An, Pei Chen, Yanpeng Gong

Microelectronics Reliability

DOI

2021

Constitutive modelling of annealing behavior in through silicon vias-copper

Yadong Li, Pei Chen, Fei Hu Qin, Tong An, Yanwei Dai, Min Zhang, Yifan Jin

Materials Characterization

DOI

2021

Characterizations of material constraint effect for creep crack in center weldment under biaxial loading

Yanwei Dai, Fei Qin, Yinghua Liu, Filippo Berto, Haofeng Chen

International Journal of Fracture

DOI

2021

On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters

Shuai Zhao, Yanwei Dai, Fei Qin, Yanning Li, Lingyun Liu, Zhi Zan, Tong An, Pei Chen, Yanpeng Gong, Yuexing Wang

Materials Science and Engineering A

DOI

2021

Characteristics and implications of material mismatch on mode II creep crack tip field: Theoretical analysis and numerical investigation

Yanwei Dai, Fei Qin, Yinghua Liu, Haofeng Chen, Filippo Berto

Theoretical and Applied Fracture Mechanics

DOI

2021

On the second order term asymptotic solution for sharp V-notch tip field in elasto-viscoplastic solids

Yanwei Dai, Fei Qin, Yinghua Liu, Yuh J. Chao

International Journal of Solids and Structures

DOI

2021

In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process

Fei Qin, Lixiang Zhang, Pei Chen, Tong An, Yanwei Dai, Yanpeng Gong, Zhongbo Yi, Haiming Wang

Mechanical Systems and Signal Processing

DOI

2020

A new DBEM for solving crack problems in arbitrary dissimilar materials

Wei-Zhe Feng, Lan-Fang Gao, Xiao‐Wei Gao, Yanwei Dai, Wei Qian

Engineering Analysis with Boundary Elements

DOI

2020

DBEM computation of T-stress and mixed-mode SIFs using interaction integral technique

Wei-Zhe Feng, Lan-Fang Gao, Yanwei Dai, Wei Qian

Theoretical and Applied Fracture Mechanics

DOI

2020

Effect of Crack Evolution on the Resistance and Current Density of the Al Metallization in the IGBT Module During Power Cycling

Fei Qin, Jingyi Zhao, Tong An, Jingru Dai, Yanwei Dai, Pei Chen

IEEE Transactions on Device and Materials Reliability

DOI

2020

Sharp V‐notches in viscoplastic solids: Strain energy rate density rule and fracture toughness

Yanwei Dai, Luca Susmel, Fei Qin

Fatigue & Fracture of Engineering Materials & Structures

DOI

2020

An alternative numerical method for calculating C* parameter under mode I loading utilizing rate-dependent energy release rate

Xianhe Du, Yanwei Dai, Qiang Han, Yinghua Liu, Peng Cao, Guian Qian, Filippo Berto

Theoretical and Applied Fracture Mechanics

DOI

2020

Effect of the accumulated plastic deformation on J-integral for TSV-Cu/SiO2 interface crack under cyclic thermal load

Min Zhang, Fei Qin, Yanwei Dai, Hongwen He, Jiantao Zheng, Hao Zhang, Pei Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2020

Estimation of C∗-Integral for Central Cracked Plate Under Biaxial Loading

Yanwei Dai, Fei Qin, Yinghua Liu, Wei-Zhe Feng, Guian Qian

International Journal of Applied Mechanics

DOI

2020

Nano-indentation test across the sintered silver/ copper interface

Lingyun Liu, Fei Qin, Yanwei Dai, Pei Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2020

A numerical method to determine the equivalent thermal conductivity of sintered silver

Yuankun Hu, Fei Qin, Yanwei Dai, Pei Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2020

Crack Effect on the Equivalent Thermal Conductivity of Porously Sintered Silver

Fei Qin, Yuankun Hu, Yanwei Dai, Tong An, Pei Chen, Yanpeng Gong, Huiping Yu

Journal of Electronic Materials

DOI

2020

An improved singular curved boundary integral evaluation method and its application in dual BEM analysis of two- and three-dimensional crack problems

Wei-Zhe Feng, Lan-Fang Gao, Meng Qu, Ling Zhou, Yanwei Dai, Kai Yang

European Journal of Mechanics - A/Solids

DOI

2020

In-process measurement of the grinding force in silicon wafer self-rotating grinding process

Lixiang Zhang, Fei Qin, Pei Chen, Tong An, Yanwei Dai, Zhongbo Yi, Haiming Wang

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2020

A Lifetime Prediction Method for IGBT Modules Considering the Self-Accelerating Effect of Bond Wire Damage

Fei Qin, Xiaorui Bie, Tong An, Jingru Dai, Yanwei Dai, Pei Chen

IEEE Journal of Emerging and Selected Topics in Power Electronics

DOI

2020

Evaluation of thermal conductivity for sintered silver considering aging effect with microstructure based model

Fei Qin, Yuankun Hu, Yanwei Dai, Tong An, Pei Chen

Microelectronics Reliability

DOI

2020

Study of Warpage Evolution and Control for Six-Side Molded WLCSP in Different Packaging Processes

Fei Qin, Shuai Zhao, Yanwei Dai, Mengke Yang, Min Xiang, Daquan Yu

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2020

Optimization of TSV interconnects and BEOL layers under annealing process through fracture evaluation

Fei Qin, Mengye Zhang, Yanwei Dai, Pixu Chen, Tong An, Haoxiang He, Hengbing Zhang, J. Zheng

Fatigue & Fracture of Engineering Materials & Structures

DOI

2020

C(t) dominance of the mixed I/II creep crack: Part II. Extensive creep

Yanwei Dai, Yinghua Liu, Fei Qin, Yuh J. Chao, Guian Qian

Theoretical and Applied Fracture Mechanics

DOI

2019

Notch stress intensity factor and C-integral evaluation for sharp V-notch in power-law creeping solids

Yanwei Dai, Yinghua Liu, Fei Qin, Yuh J. Chao

Engineering Fracture Mechanics

DOI

2019

Constraint modified time dependent failure assessment diagram (TDFAD) based on C(t)-A2(t) theory for creep crack

Yanwei Dai, Yinghua Liu, Fei Qin, Yuh J. Chao, Haofeng Chen

International Journal of Mechanical Sciences

DOI

2019

Vibration lifetime estimation of PBGA solder joints using Steinberg model

Tong An, Fei Qin, Bin Zhou, Pei Chen, Yanwei Dai, Huaicheng Li, Tao Tang

Microelectronics Reliability

DOI

2019

A unified method to solve higher order asymptotic crack-tip fields of mode I, mode II and mixed mode I/II crack in power-law creeping solids

Yanwei Dai, Yinghua Liu, Fei Qin, Yuh J. Chao

Engineering Fracture Mechanics

DOI

2019

Validation of submodel technique for fracture evaluation in wafer-level package under thermal loading

Min Zhang, Fei Qin, Yanwei Dai, Tong An, Pei Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2019

Estimation of stress field for sharp V-notch in power-law creeping solids: An asymptotic viewpoint

Yanwei Dai, Yinghua Liu, Fei Qin, Yuh J. Chao, Filippo Berto

International Journal of Solids and Structures

DOI

2019

C(t) dominance of the mixed I/II creep crack: Part I. Transient creep

Yanwei Dai, Yinghua Liu, Fei Qin, Guian Qian, Yuh J. Chao

Theoretical and Applied Fracture Mechanics

DOI

2019

Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process

Lixiang Zhang, Pei Chen, Tong An, Yanwei Dai, Fei Qin

Current Applied Physics

DOI

2019

A Study on the Effect of Microstructure Evolution of the Aluminum Metallization Layer on Its Electrical Performance During Power Cycling

Jingyi Zhao, Tong An, Chao Fang, Xiaorui Bie, Fei Qin, Pei Chen, Yanwei Dai

IEEE Transactions on Power Electronics

DOI

2019

Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading

Yanwei Dai, Min Zhang, Fei Qin, Pei Chen, Tong An

Engineering Fracture Mechanics

DOI

2018

Numerical Investigations on the Effects of T-Stress in Mode I Creep Crack

Yanwei Dai, Yinghua Liu, Haofeng Chen

International Journal of Computational Methods

DOI

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