2026
Experimental and Phase-Field Simulation for Optimizing Withdrawal Rate of Directionally Solidified Sn-0.7Cu-0.1Ni-1.0Zn Solder: Enhanced Wettability and Mechanical Properties
Dongdong Zhang, Zhu-Huan Yu, Tian-Xiao Ma, Jun-Feng Qiang, Haiyan Lv, Xiong Yang, Zi Yang, Xi-Rui Shangguan
Journal of materials engineering and performance (Print)