阎照文

2026

非回跳延迟型TVS瞬态建模方法

《安全与电磁兼容》

2026

9 kHz～1 GHz带有G形线圈的高灵敏度磁场探头

《安全与电磁兼容》

2026

Non-Invasive IC RF Immunity Assessment Using Magnetic Field Injection Probe

International Conference on Electronics, Information and Communications

DOI

2026

A New Wideband Differential Magnetic Probe Loaded With 180° Out-of-Phase Power Divider

IEEE Microwave and Wireless Technology Letters

DOI

2026

Design of RF Current and Voltage Probes for IC Conducted Emission Measurement

IEEE Transactions on Instrumentation and Measurement

DOI

2026

A Phaseless Source Reconstruction Method Based on Adam Optimization Algorithm Combined with Regularization

Italian National Conference on Sensors

DOI

2026

Uncertainty Evaluation of Calibration Factor for Magnetic Field Probe Under Microstrip Line

2026 Asia-Pacific International Symposium and Exhibition on Electromagnetic Compatibility (APEMC)

DOI

2026

A Planar Sheet-Type Composite Electric and Magnetic Near-Field Probe

IEEE Antennas and Wireless Propagation Letters

DOI

2026

Interference Mechanisms of Undesired Fields on Shielded Tangential Magnetic Field Probes During Measurement

IEEE Transactions on Antennas and Propagation

DOI

2026

Comparison of Piecewise I-V and S11 Behavioral Modeling Methods Based on TLP Measurement

Lecture notes in electrical engineering

DOI

2025

Ez-Field Coupling Mechanism in Calibration of Shielded Single-Port Magnetic Field Probes

IEEE Transactions on Instrumentation and Measurement

DOI

2025

A Calibration Method for Magnetic-Field Injection Probes by Separating Electric-Field Response

IEEE Transactions on Antennas and Propagation

DOI

2025

An Integrated Simulation Software for Component EMC Design and Analysis

2025 International Workshop on Advanced Interconnects (WAI)

DOI

2024

载人月球探测飞行器综合电子系统技术发展研究

《宇航学报》

2024

集成电路电磁兼容性分析方法及展望

《安全与电磁兼容》

2024

A Miniaturized Ultrawideband V-Shaped Tip E-Probe for Near-Field Measurements

Italian National Conference on Sensors

DOI

2024

Digital Chip Susceptibility Assessment and Level Classification via the DPI Approach

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2024

Design of an Ultrawideband Air-Filled Grounded Coplanar Waveguide for Near-Field Probe Calibration

IEEE Transactions on Antennas and Propagation

DOI

2024

Research on 9 kHz–1 GHz Broadband and High-Power Injection Probe With Low Loss for Time-Domain Conducted Immunity Measurement

IEEE Transactions on Instrumentation and Measurement

DOI

2024

Analysis and Testing of Conducted Electromagnetic Susceptibility in Integrated Circuits Based on Multi-Waveform Interference Using BCI

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2024

Research on Electromagnetic Environment Characteristic Acquisition System for Industrial Chips

Electronics

DOI

2024

Modeling of Electromagnetic Disturbance Characteristics of Bus Network Protocol Chip

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2024

ESD Characterisation and Modelling of Digital Integrated Circuits Based on TLP Test

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2023

宽频带高平坦度传导电磁敏感性注入探头研究

《北京航空航天大学学报》

2023

基于分段线性模型针对传输线脉冲瞬态干扰信号的芯片协同防护设计方法

《电子与信息学报》

2023

Analysis of the Damage Characteristics of Integrated Circuits with Various Pulse Width

IEEE International Symposium on Electromagnetic Compatibility

DOI

2023

A Sensitive Dual-Stage Active Wideband Electric Field Probe for Near-Field Measurements

International Bhurban Conference on Applied Sciences and Technology

DOI

2023

A Horn-Tip Ultrawideband E-Probe for Radiated EMI Measurements Up To 50 GHz

IEEE International Symposium on Electromagnetic Compatibility

DOI

2023

A Quad-Tip Wideband E-Field Probe With High Spatial Resolution For Near-Field Measurement

International Symposium on Antennas and Propagation

DOI

2023

Design of Miniature Ultrawideband Active Magnetic Field Probe Using Integrated Design Idea

Italian National Conference on Sensors

DOI

2023

Broadband Pulse Injection Probe With Improved Injection Efficiency for Conducted Electromagnetic Susceptibility Test

IEEE Sensors Journal

DOI

2022

芯片传导瞬态电磁干扰下的防护特性研究

《安全与电磁兼容》

2022

高性能近场测试电场探头和磁场探头研究进展

《安全与电磁兼容》

2022

A Broadband Time-Domain Detection System for Electromagnetic Compatibility Conducted Susceptibility Test

IEEE Transactions on Instrumentation and Measurement

DOI

2022

High Common-Mode-Rejection Magnetic-Field Probe Based on Differential Dual Loop and Integrated Balun

IEEE transactions on magnetics

DOI

2022

A Miniaturized Ultrawideband Active Electric Probe With High Sensitivity for Near-Field Measurement

IEEE Transactions on Instrumentation and Measurement

DOI

2022

Miniature Active Differential Magnetic Field Probe With High Sensitivity for Near-Field Measurements

IEEE Transactions on Antennas and Propagation

DOI

2022

Research on Transient Conduction Sensitivity of the Chips Using TLP Method

2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

DOI

2021

Near-Field Precision Measurement System of High-Density Integrated Module

IEEE Transactions on Instrumentation and Measurement

DOI

2021

Extraction and analysis of Conducted Electromagnetic Susceptibility Elements of Integrated Circuits

IEEE Access

DOI

2020

Design of a Wide-Band Front-End for a High Speed Data Acquisition System

International Conference on Microwave and Millimeter Wave Technology

DOI

2020

Ultrawideband Real-Time Monitoring System Based on Electro-Optical Under-Sampling and Data Acquisition for Near-Field Measurement

IEEE Transactions on Instrumentation and Measurement

DOI

2020

Applications of the Miniaturized Probes in the Near-Field Measurements of RF Integrated Modules

International Conference on Microwave and Millimeter Wave Technology

DOI

2020

Design of Miniature Active Magnetic Probe for Near-Field Weak Signal Measurement in ICs

IEEE Microwave and Wireless Components Letters

DOI

2020

An Improved Equivalent Dipole Moment Source Model Based on Regularization Optimization Method for Near Field-Far Field Conversion

IEEE Access

DOI

2020

Analysis and optimization of electromagnetic scattering characteristics of two-dimensional metal airfoil covered with metamaterial

Journal of Physics Conference Series

DOI

2020

Applying PML technique with additional differential equation method in non-uniform mixed-element DGTD method

Optik

DOI

2019

Research on the Electric Probe Calibration Based on Electric Dipole Moment

International Workshop on Electromagnetic Compatibility of Integrated Circuits

DOI

2019

The Research of Bulk Current Injection Probe Used for ICs Electromagnetic Immunity Measurement

International Workshop on Electromagnetic Compatibility of Integrated Circuits

DOI

2019

Improved-Sensitivity Resonant Electric-Field Probes Based on Planar Spiral Stripline and Rectangular Plate Structure

IEEE Transactions on Instrumentation and Measurement

DOI

2019

A High-Sensitivity Resonant Tangential E-Probe With Loaded Improved Dipole and Embedded Integrated Balun

IEEE Transactions on Instrumentation and Measurement

DOI

2019

An Ultrawideband Electric Probe Based on U-Shaped Structure for Near-Field Measurement From 9 kHz to 40 GHz

IEEE Antennas and Wireless Propagation Letters

DOI

2019

A Novel Tangential Electric-Field Sensor Based on Electric Dipole and Integrated Balun for the Near-Field Measurement Covering GPS Band

Italian National Conference on Sensors

DOI

2019

A Miniature High-Sensitivity Active Electric Field Probe for Near-Field Measurement

IEEE Antennas and Wireless Propagation Letters

DOI

2018

开关电源中RCD钳位电路研究

《中国集成电路》

2018

信号完整性导论(精)

《科学》

2018

Noncontact Wideband Current Probes With High Sensitivity and Spatial Resolution for Noise Location on PCB

IEEE Transactions on Instrumentation and Measurement

DOI

2018

A Design of 9kHz-0.5GHz Low Noise Amplifier with High Gain and Smooth Flatness

International Symposium on Antennas, Propagation and EM Theory

DOI

2018

The Far-field Estimation for Microstrip Line Based on Near-field Scanning

International Symposium on Antennas, Propagation and EM Theory

DOI

2017

三维TSV集成电路电磁敏感性分析方法

《北京航空航天大学学报》

2017

A 0.6–5.5GHz E-PHEMT broadband high-gain LNA designed by ADS

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2017

The research of current injection probe based on electromagnetic model

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2017

A study on calibration compensation and perturbation of electromagnetic probes

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2017

Modeling and impedance analysis of power distribution network in 3D ICs with TSVs

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

DOI

2017

The open experiment: an experimental graduate course in electronics communications engineering

2017

Electromagnetic susceptibility analysis method for 3D TSV ICs

DOI

2017

A Miniature Ultrawideband Electric Field Probe Based on Coax-Thru-Hole via Array for Near-Field Measurement

IEEE Transactions on Instrumentation and Measurement

DOI

2016

Two methods for BCI probe to improve the high frequency performance

International Symposium on Antennas, Propagation and EM Theory

DOI

2016

高周波性能を改善するためのBCIプローブのための2の方法【Powered by NICT】

2016

Extraction of equivalent dipole-moment model based on improve mapped matrix

International Symposium on Antennas, Propagation and EM Theory

DOI

2016

A Simple Miniature Ultrawideband Magnetic Field Probe Design for Magnetic Near-Field Measurements

IEEE Transactions on Antennas and Propagation

DOI

2016

マッピングされた行列を改善に基づく等価双極子モーメントモデルの抽出【Powered by NICT】

2016

The equivalent source modeling of electromagnetic interference coupling on the cable

International Conference on Microwave and Millimeter Wave Technology

DOI

2015

Research on the transmission and coupling issue of multilayer TSV and multilayer TSV array

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2015

Modeling on electromagnetic susceptibility of operational amplifier OPA694

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2015

An effective method of near to far field transformation based on dipoles model

Asia-Pacific Microwave Conference

DOI

2015

Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration

DOI

2015

Research on crosstalk issue of through silicon via for 3D integration

ACM Symposium on Cloud Computing

DOI

2014

An Improved Miniaturized Three-Layer Embedded Electromagnetic Bandgap Structure

IEEE Transactions on Antennas and Propagation

DOI

2014

A near-field to far-field transformation method research based on interference source reconstruction

URSI General Assembly and Scientific Symposium

DOI

2013

FEKO 5.4电磁场分析技术与实例详解

2013

Structure optimization of through silicon via (TSV) interconnect as transmission channel for 3D integration

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2013

The electromagnetic compatibility analysis based on a navigation system

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2013

The research of near-field interference characteristic of sensor in RE measurement

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2013

A Novel Segmented Modeling Method of Via including the Effect of Power/Ground Plane Pair

DOI

2013

A novel segmented equivalent circuit modeling method of TSV in 3D-IC

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2013

A Novel Miniaturized Electromagnetic Bandgap Structure and Its Effects on Signal Integrity and Electromagnetic Emission

DOI

2012

Principle and applications of segmented modeling method of via

International Symposium on Antennas, Propagation and EM Theory

DOI

2012

A novel EBG structure with embedded meander bridge for broadband suppression of SSN

Asia-Pacific Software Engineering Conference

DOI

2012

A Novel EBG Structure with Embedded Meander Bridge and Its Applications on SI and PI

PRZEGLĄD ELEKTROTECHNICZNY

2011

信号完整性仿真分析方法

《中国水利水电》

2011

The SI and EMI analysis and pre-design of the sensor

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2011

Designing of a voltage monitor for measuring the voltage of sensitive component on the PCB in EM environment

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2011

Notice of RetractionConstruction and practice of the public laboratory platforms for the postgraduates of electronic and information engineering

International Conference on E-Business and E-Government

DOI

2011

A Behavior Level Analytical Method of Electromagnetic Susceptibility for Radio Frequency Receiver

DOI

2011

Signal integrity analysis of a novel Electromagnetic Bandgap structure

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI

2010

Signal integrity for high speed digital design

Proceedings of the 9th International Symposium on Antennas, Propagation and EM Theory

DOI

2010

Compact electromagnetic band gap structure for avoiding high-speed circuit noise

2010

A novel Electromagnetic Bandgap Structure used in mitigating the ultra-high frequency and high frequency noise of PDS

Proceedings of the 9th International Symposium on Antennas, Propagation and EM Theory

DOI

2010

A behavioral quantification analytical method of electromagnetic susceptibility at board level

Proceedings of the 9th International Symposium on Antennas, Propagation and EM Theory

DOI

2009

构建电子信息类博士生创新实践基地的探索

《北京航空航天大学学报(社会科学版)》

2008

电子信息技术综合实验原理与方法

2008

Design and implementation for signal integrity trouble diagnosing system

International Symposium on Antennas, Propagation and EM Theory

DOI

2008

The simulation and pre-design on the PCB of the simulator

2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility

DOI

2003

电磁场新型等效源法

《北京工业大学出版社》

ANSYS 10.0工程电磁分析技术与实例详解

《中国水利水电》

2025

集成电路类型对近场扫描抗扰度测试的磁场强度影响分析

《2025年全国微波毫米波会议报告集-电磁干扰技术》

2013

EMI and PI analysis of analog board

IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI