高玉飞｜山东大学｜学者主页

2026

基于响应面法的金刚石线锯切割大理石工艺参数多目标优化

李官正，崔凡，高玉飞

《制造技术与机床》

DOI

2026

Experimental Study on Slicing Sapphire Crystal with Ultrasonic-Assisted Diamond Wire Saw

Faroug Ismael, Pengfei Sun, Yihe Liu, Honghao Li, Yufei Gao

Micromachines

DOI

2026

Study on the microcrack damage depth of monocrystalline silicon in diamond wire electrical discharge sawing based on finite element analysis of stress field

Yingqi Hou, Naijun Zhang, Shengtan Hu, Yufei Gao

Applied Physics A

DOI

2026

Mechanisms of material removal and surface formation in diamond wire saw electrical discharge composite cutting of monocrystalline silicon

Naijun Zhang, Yufei Gao, Shengtan Hu, Jiahao Xu

The International Journal of Advanced Manufacturing Technology

DOI

2026

Study on the wear of diamond wire saw in cutting granite

Yihe Liu, Yufei Gao, Hui Dong, Dameng Cheng

Diamond and Related Materials

DOI

2026

Surface Fractal Characterization of Granite Cut by Diamond Wire Saw

Yihe Liu, Yufei Gao, Jiahao Xu

Fractal and Fractional

DOI

2026

Editorial for the Special Issue on Advanced Abrasive Processing Technology and Applications

Yufei GAO

Materials

DOI

2026

Experimental Study on Grinding of Inner Raceway of Tapered Roller Bearing Outer Ring

Yingqi Hou, Jiahao Xu, Ziyue Hei, Guangdi Jin, Yufei GAO

Micromachines

DOI

2025

Surface properties of monocrystalline silicon in diamond wire electrical discharge combined sawing

Naijun Zhang, Yufei Gao

The International Journal of Advanced Manufacturing Technology

DOI

2025

Study on the Motion Trajectory of Abrasives and Surface Improvement Mechanism in Ultrasonic-Assisted Diamond Wire Sawing Monocrystalline Silicon

Honghao Li, Yufei Gao, Shengtan Hu, Zhipu Huo

Micromachines

DOI

2025

Correction to: Surface properties of monocrystalline silicon in diamond wire electrical discharge combined sawing

Naijun Zhang, Yufei Gao

The International Journal of Advanced Manufacturing Technology

DOI

2025

Research progress on subsurface microcrack damage of silicon wafer cut by diamond wire saw: a review

Dameng Cheng, Yufei Gao, Chunfeng Yang

Journal of Materials Science Materials in Electronics

DOI

2025

Research status and development trends of wire-cut electrical discharge machining of monocrystalline silicon: a review

Shengtan Hu, Yufei Gao, Dameng Cheng

The International Journal of Advanced Manufacturing Technology

DOI

2025

Surface and subsurface microstructure properties of monocrystalline silicon cut by electroplated diamond wire saw

Dong Hui, Yufei Gao, Chunfeng Yang

Surface Science and Technology

DOI

2025

A comprehensive review on wafering of silicon substrate for photovoltaic solar cell

Dameng Cheng, Yufei Gao, Chunfeng Yang

Solar Energy

DOI

2025

Prediction of excess kerf loss in diamond wire sawing based on vibration source signal measurement and processing

Dameng Cheng, Yufei Gao, Wenbin Huang

Measurement

DOI

2025

Backpropagation Neural Network-Based Prediction Model of Marble Surface Quality Cut by Diamond Wire Saw

Dong Hui, Feng Kui Cui, Zhipu Huo, Yufei Gao

Micromachines

DOI

2025

Experimental study on surface roughness in ultrasonic vibration–assisted diamond wire sawing monocrystalline silicon

Honghao Li, Yufei Gao, Dameng Cheng, Chunfeng Yang

The International Journal of Advanced Manufacturing Technology

DOI

2025

Influence of Grinding Parameters on Surface Roughness and Subsurface Crack Damage Depth of Sapphire Crystal

Yingqi Hou, Yufei Gao, Chunfeng Yang

Materials

DOI

2025

Modeling and experimental investigation on sawing force in ultrasonic vibration–assisted diamond wire sawing mono-Si considering material removal mode

Honghao Li, Yufei Gao, Dameng Cheng, Chunfeng Yang

The International Journal of Advanced Manufacturing Technology

DOI

2025

Process Parameters Analysis in Diamond Wire Saw Cutting NdFeB Magnet

Chengwanli Peng, Guanzheng Li, Xing-Chun Zhang, Yufei Gao

Materials

DOI

2025

The formation mechanism and influencing factors of the sawed surface of ZTA nanocomposite ceramics in diamond wire sawing

Guanzheng Li, Yufei Gao, Wenbin Huang, Zhenyu Shi

Materials Science and Engineering B

DOI

2025

Surface Topography Analysis and Surface Roughness Prediction Model of Diamond Wire-Sawed NdFeB Magnet Based on Optimized Back Propagation Neural Network

Guanzheng Li, Xing-Chun Zhang, Yufei Gao, Feng Kui Cui, Zhenyu Shi

Processes

DOI

2024

金刚石线锯电火花复合切割硬脆半导体的研究进展

张乃军，高玉飞，郭志田

《制造技术与机床》

DOI

2024

超声辅助金刚石线锯复合切割技术的研究进展

李洪浩，高玉飞，张乃军

《制造技术与机床》

DOI

2024

The state of the art of wire sawing-based hybrid cutting technology: a review

Naijun Zhang, Honghao Li, Yufei Gao

The International Journal of Advanced Manufacturing Technology

DOI

2024

Sawing force modeling and analysis for diamond wire sawing PV monocrystalline silicon considering abrasive wear

Yufeng Guo, Yufei Gao, Chunfeng Yang

Wear

DOI

2024

Research on the reliability of wire web in diamond multi-wire saw slicing photovoltaic monocrystalline silicon wafer

Dameng Cheng, Yufeng Guo, Yufei Gao, Zhenyu Shi

Solar Energy Materials and Solar Cells

DOI

2024

Fracture strength analysis of large-size and thin photovoltaic monocrystalline silicon wafers

Dameng Cheng, Yufei Gao, Guanzheng Li

Engineering Fracture Mechanics

DOI

2024

Relationship between surface roughness and subsurface crack damage depth of sapphire crystals cut by diamond wire saw based on slicing experiments

Zhenfeng Zhu, Yufei Gao, Zhenyu Shi

The International Journal of Advanced Manufacturing Technology

DOI

2024

Improvement of wire marks on the surface of Si3N4 ceramics cut by diamond wire saw

Guanzheng Li, Yufei Gao, Wenbin Huang, Zhenyu Shi

Materials Science and Engineering B

DOI

2024

Influences of fiber orientation and process parameters on diamond wire sawn surface characteristics of 2.5D Cf/SiC composites

Yihe Liu, Yufei Gao, Guanzheng Li, Zhenyu Shi

Materials Today Communications

DOI

2024

Analysis of Wafer Warpage in Diamond Wire Saw Slicing Sapphire Crystal

Yihe Liu, Dameng Cheng, Guanzheng Li, Yufei Gao

Applied Sciences

DOI

2024

A critical review on the fracture of ultra-thin photovoltaics silicon wafers

Dameng Cheng, Yufei Gao

Solar Energy Materials and Solar Cells

DOI

2024

Surface characteristics of precision as-cut NdFeB magnet considering diamond wire wear

Xingchun Zhang, Yufei Gao, Chunfeng Yang, Zhenyu Shi

Precision Engineering

DOI

2024

Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon

Keying Wang, Yufei Gao, Chunfeng Yang

Materials

DOI

2023

Wire bow analysis based on process parameters in diamond wire sawing

Yufeng Guo, Yufei Gao, Xing-Chun Zhang, Zhenyu Shi

The International Journal of Advanced Manufacturing Technology

DOI

2023

Study on Grinding-Affected Layer of Outer-Ring Inner Raceway of Tapered Roller Bearing

Dameng Cheng, Guangdi Jin, Yufei Gao, Panling Huang, Zhenyu Shi, Yuanchao Tang

Materials

DOI

2023

Fracture probability of PV mono-Si wafers in diamond wire slicing due to coupling of capillary adhesion bending stress and sawing stress

Dameng Cheng, Yufei Gao

Materials Science in Semiconductor Processing

DOI

2023

Influence of Diamond Wire Saw Processing Parameters on the Sawn Surface Characteristics of Silicon Nitride Ceramics

Siyuan Zhang, Yufei Gao, Xingchun Zhang, Yufeng Guo

Micromachines

DOI

2023

Effect of the diamond saw wires capillary adhesion on the thickness variation of ultra-thin photovoltaic silicon wafers during slicing

Dameng Cheng, Yufei Gao

Solar Energy Materials and Solar Cells

DOI

2023

Study on surface characteristics of as-sawn sapphire crystal wafer considering diamond saw wire wear

Zhenfeng Zhu, Yufei Gao, Zhenyu Shi, Xing-Chun Zhang

Wear

DOI

2023

Surface roughness in grinding outer ring inner raceway of tapered roller bearing

Guangdi Jin, Yufei Gao, Panling Huang, Jun Zhou, Yuanchao Tang

The International Journal of Advanced Manufacturing Technology

DOI

2023

Study on subsurface microcrack damage depth of diamond wire as-sawn sapphire crystal wafers

Zhenfeng Zhu, Yufei Gao, Xing-Chun Zhang

Engineering Fracture Mechanics

DOI

2023

Study on surface roughness and morphology of diamond wire as-sawn sapphire crystal wafers

Zhenfeng Zhu, Yufei Gao

The International Journal of Advanced Manufacturing Technology

DOI

2022

Finite element analysis of the clamping stress of photovoltaic silicon brick in diamond wire sawing

Dameng Cheng, Yufei Gao

Materials Science in Semiconductor Processing

DOI

2022

Experiment and theoretical prediction for subsurface microcracks and damage depth of multi-crystalline silicon wafer in diamond wire sawing

Xinying Li, Yufei Gao, Runtao Liu, Wei Dong Zhou

Engineering Fracture Mechanics

DOI

2022

Influences of hard inclusions on processing stress in diamond multi-wire sawing multi-crystalline silicon

Dameng Cheng, Yufei Gao, Chunfeng Yang

Materials Science in Semiconductor Processing

DOI

2022

Simulation analysis of cutting coolant flow field in fixed and free abrasive combined wire sawing polysilicon

Tianzhao Pu, Yufei Gao, Tianliang Hu, Chunfeng Yang

The International Journal of Advanced Manufacturing Technology

DOI

2022

Surface properties of diamond wire sawn photovoltaic mc-Si wafers by stirred slurry pretreated and additive-free acid textured

Runtao Liu, Yufei Gao, Chunfeng Yang

Surface Topography Metrology and Properties

DOI

2022

Wet sandblasting pretreatment of diamond wire sawn multi-crystalline silicon wafer for surface acid texturization in photovoltaics

Runtao Liu, Yufei Gao, Chunfeng Yang

Journal of Materials Science Materials in Electronics

DOI

2021

Analysis of sawing characteristics of fine diamond wire slicing multicrystalline silicon

Yihe Liu, Yufei Gao, Chunfeng Yang

Diamond and Related Materials

DOI

2021

The study of crack damage and fracture strength for single crystal silicon wafers sawn by fixed diamond wire

Tengyun Liu, Peiqi Ge, Wenbo Bi, Yufei Gao

Materials Science in Semiconductor Processing

DOI

2021

Sawing characteristics of diamond wire cutting sapphire crystal based on tool life cycle

Youkang Yin, Yufei Gao, Chunfeng Yang

Ceramics International

DOI

2021

Fracture strength of photovoltaic silicon wafers cut by diamond wire saw based on half-penny crack system

Liyuan Wang, Yufei Gao, Tianzhao Pu, Youkang Yin

Engineering Fracture Mechanics

DOI

2021

Finite element analysis on processing stress of polysilicon cut by diamond multi-wire saw

Dameng Cheng, Yufei Gao, Runtao Liu

Materials Science in Semiconductor Processing

DOI

2021

Study on a novel fixed and free abrasive combined wire sawing multi-crystalline silicon wafers for wet acid texturization

Runtao Liu, Yufei Gao, Dameng Cheng, Tianzhao Pu

Solar Energy

DOI

2021

Hydrodynamic action in slicing PV polysilicon with a novel fixed and free abrasive combined wire sawing

Tianzhao Pu, Yufei Gao, Youkang Yin, Liyuan Wang

The International Journal of Advanced Manufacturing Technology

DOI

2021

Analysis of crack-free surface generation of photovoltaic polysilicon wafer cut by diamond wire saw

Youkang Yin, Yufei Gao, Liyuan Wang, Lei Zhang, Tianzhao Pu

Solar Energy

DOI

2021

Fabrication and cutting performance of a new type of abrasives-helix-distribution saw wire for slicing KDP crystal

Hongshuang Li, Yufei Gao, Liyuan Wang, Tianzhao Pu, Wenbo Bi

The International Journal of Advanced Manufacturing Technology

DOI

2020

电镀金刚石线表面磨粒密度对锯切性能影响分析

李升，高玉飞

《制造技术与机床》

DOI

2020

Study on cutting PV polysilicon with a new type of diamond abrasives-helix-distribution saw wire based on controlling the subsurface microcrack damage depth

Youkang Yin, Yufei Gao, Xinying Li, Tianzhao Pu, Liyuan Wang

The International Journal of Advanced Manufacturing Technology

DOI

2020

A new method of determining the slicing parameters for fixed diamond wire saw

Tengyun Liu, Peiqi Ge, Wenbo Bi, Yufei Gao

Materials Science in Semiconductor Processing

DOI

2020

Analytical prediction of subsurface microcrack damage depth in diamond wire sawing silicon crystal

Liyuan Wang, Yufei Gao, Xinying Li, Tianzhao Pu, Youkang Yin

Materials Science in Semiconductor Processing

DOI

2020

Experimental investigation on the machining characteristics of fixed-free abrasive combined wire sawing PV polycrystalline silicon solar cell

Tianzhao Pu, Yufei Gao, Liyuan Wang, Youkang Yin

The International Journal of Advanced Manufacturing Technology

DOI

2020

Study on process parameters of fabrication fine diameter electroplated diamond wire for slicing crystalline silicon solar cell

Hongshuang Li, Yufei Gao, Peiqi Ge, Wenbo Bi, Lei Zhang

The International Journal of Advanced Manufacturing Technology

DOI

2019

电镀金刚石线锯氨基磺酸盐预镀镍工艺

李红双，高玉飞，葛培琪，毕文波，龚洋，柳廷全

《电镀与涂饰》

DOI

2019

电镀金刚石线锯切割光伏多晶硅的表面特性与锯丝磨损分析

庞继伟，高玉飞，李升

《金刚石与磨料磨具工程》

DOI

2019

Analysis of Antireflection Performance of V‐Ring Groove Structures for Photovoltaic Crystal Silicon Solar Cells

Longxu Yao, Lei Zhang, Peiqi Ge, Yufei Gao, Hui Wang

physica status solidi (a)

DOI

2019

Experiment and theoretical prediction for surface roughness of PV polycrystalline silicon wafer in electroplated diamond wire sawing

Xinying Li, Yufei Gao, Youkang Yin, Liyuan Wang, Tianzhao Pu

Journal of Manufacturing Processes

DOI

2019

Experimental study on slicing photovoltaic polycrystalline silicon with diamond wire saw

Youkang Yin, Yufei Gao, Xinying Li, Tianzhao Pu, Liyuan Wang

Materials Science in Semiconductor Processing

DOI

2019

Study on nucleation and propagation of median cracks generated by scratching single crystal silicon

Longxu Yao, Lei Zhang, Peiqi Ge, Yufei Gao, Hui Wang

Materials Science in Semiconductor Processing

DOI

2019

Material removal and surface generation mechanisms in diamond wire sawing of silicon crystal

Yufei Gao, Peiqi Ge, Lei Zhang, Wenbo Bi

Materials Science in Semiconductor Processing

DOI

2019

Sawing stress of SiC single crystal with void defect in diamond wire saw slicing

Yufei Gao, Yang Chen

The International Journal of Advanced Manufacturing Technology

DOI

2019

Nucleation location and propagation direction of radial and median cracks for brittle material in scratching

Xinying Li, Yufei Gao, Peiqi Ge, Lei Zhang, Wenbo Bi, Jianfeng Meng

Ceramics International

DOI

2018

线锯切割晶片翘曲度的影响因素分析

李红双，高玉飞，李新颖，葛培琪，毕文波

《工具技术》

2018

工艺参数对悬砂法复合电镀制备金刚线的影响

李升，高玉飞，李新颖

《电镀与涂饰》

2018

The effect of cut depth and distribution for abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon

Xinying Li, Yufei Gao, Peiqi Ge, Lei Zhang, Wenbo Bi

Materials Science in Semiconductor Processing

DOI

2018

Study on the subsurface microcrack damage depth in electroplated diamond wire saw slicing SiC crystal

Yufei Gao, Yang Chen, Peiqi Ge, Lei Zhang, Wenbo Bi

Ceramics International

DOI

2018

Fabrication and performance evaluation for resin-bonded diamond wire saw

Mengran Ge, Wenbo Bi, Peiqi Ge, Yufei Gao

The International Journal of Advanced Manufacturing Technology

DOI

2018

Experimental study of rectangular groove texture in the surface of photovoltaic silicon with diamond coated micro-milling tools

Yuantai Wu, Lei Zhang, Peiqi Ge, Yufei Gao

Materials Science in Semiconductor Processing

DOI

2018

Stress analysis in scratching of anisotropic single-crystal silicon carbide

Peizhi Wang, Peiqi Ge, Wenbo Bi, Tengyun Liu, Yufei Gao

International Journal of Mechanical Sciences

DOI

2018

Coupling stress caused by thermal and slicing force in KDP crystal slicing with fixed abrasive wire saw

Zongqiang Li, Peiqi Ge, Wenbo Bi, Tengyun Liu, Peizhi Wang, Yufei Gao

The International Journal of Advanced Manufacturing Technology

DOI

2017

Effects of the micro-structure of arc-shaped groove, rectangular groove and semicircle-based rectangular groove on the reflectance of silicon solar cell

Yuantai Wu, Lei Zhang, Peiqi Ge, Yufei Gao, Wenbo Bi

Solar Energy

DOI

2017

A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC

Peizhi Wang, Peiqi Ge, Zongqiang Li, Mengran Ge, Yufei Gao

Materials Science in Semiconductor Processing

DOI

2017

Prediction of sawing force for single-crystal silicon carbide with fixed abrasive diamond wire saw

Peizhi Wang, Peiqi Ge, Yufei Gao, Wenbo Bi

Materials Science in Semiconductor Processing

DOI

2016

A finite element analysis of sawing stress in fixed-abrasive wire saw slicing KDP crystal

Mengran Ge, Yufei Gao, Peiqi Ge, Yang Jiao, Wenbo Bi

The International Journal of Advanced Manufacturing Technology

DOI

2016

Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing

Tengyun Liu, Peiqi Ge, Wenbo Bi, Yufei Gao

Materials Science in Semiconductor Processing

DOI

2016

Experiment study on electroplated diamond wire saw slicing single-crystal silicon

Yufei Gao, Peiqi Ge, Tengyun Liu

Materials Science in Semiconductor Processing

DOI

2016

Depth of cut for single abrasive and cutting force in resin bonded diamond wire sawing

Tengyun Liu, Peiqi Ge, Yufei Gao, Wenbo Bi

The International Journal of Advanced Manufacturing Technology

DOI

2016

Experimental study on manufacturing of grits-spiral- distribution electroplated wire saw

Yufei GAO, Peiqi Ge, Lei Zhang, Wenbo Bi

DOAJ (DOAJ: Directory of Open Access Journals)

DOI

2013

KDP晶体金刚石线锯切割表面缺陷分析

高玉飞，葛培琪，毕文波，毕玉超

《人工晶体学报》

2013

KDP晶体金刚石线锯切入方向的研究

毕玉超，葛培琪，高玉飞

《硅酸盐通报》

2013

Study on Wire Approach Direction Using Diamond Wire Saw Cutting KDP Crystal

Yufei Gao

Guisuanyan tongbao

2011

金刚石线锯切割单晶硅表面缺陷与锯丝磨损分析

黄波，高玉飞，葛培琪

《金刚石与磨料磨具工程》

2011

电镀工艺参数对金刚石锯丝复合镀层质量影响研究

高玉飞，葛培琪

《金刚石与磨料磨具工程》

2009

往复式电镀金刚石线锯切割单晶硅片特性研究

高玉飞，葛培琪，李绍杰

《人工晶体学报》

2009

电镀金刚石线锯切割单晶硅技术及机理研究

高玉飞

《山东大学》

2008

切削液对金刚石线锯切割单晶硅片质量的影响

高玉飞，葛培琪，李绍杰，侯志坚

《武汉理工大学学报》

2007

电镀金刚石线锯制造及切割技术研究

高玉飞，葛培琪，侯志坚，李绍杰

《制造技术与机床》

2007

用复合电镀法制造电镀金刚石锯丝的实验研究

高玉飞，葛培琪，李绍杰，侯志坚

《金刚石与磨料磨具工程》

2007

利用金刚石线锯切割硅晶体的实验研究

侯志坚，葛培琪，张进生，李绍杰，高玉飞

《金刚石与磨料磨具工程》

2007

The development of a wire saw for wafer slicing of single-crystal silicon

Z.J. Hou, Pei Qi Ge, Yufei Gao

International Journal of Computer Applications in Technology

DOI

2006

单晶硅超精密加工的分子动力学仿真研究进展

高玉飞，葛培琪，侯志坚

《工具技术》

精选作品

期刊论文

基于响应面法的金刚石线锯切割大理石工艺参数多目标优化

Experimental Study on Slicing Sapphire Crystal with Ultrasonic-Assisted Diamond Wire Saw

Study on the microcrack damage depth of monocrystalline silicon in diamond wire electrical discharge sawing based on finite element analysis of stress field

Mechanisms of material removal and surface formation in diamond wire saw electrical discharge composite cutting of monocrystalline silicon

Study on the wear of diamond wire saw in cutting granite

Surface Fractal Characterization of Granite Cut by Diamond Wire Saw

Editorial for the Special Issue on Advanced Abrasive Processing Technology and Applications

Experimental Study on Grinding of Inner Raceway of Tapered Roller Bearing Outer Ring

Surface properties of monocrystalline silicon in diamond wire electrical discharge combined sawing

Study on the Motion Trajectory of Abrasives and Surface Improvement Mechanism in Ultrasonic-Assisted Diamond Wire Sawing Monocrystalline Silicon

Correction to: Surface properties of monocrystalline silicon in diamond wire electrical discharge combined sawing

Research progress on subsurface microcrack damage of silicon wafer cut by diamond wire saw: a review

Research status and development trends of wire-cut electrical discharge machining of monocrystalline silicon: a review

Surface and subsurface microstructure properties of monocrystalline silicon cut by electroplated diamond wire saw

A comprehensive review on wafering of silicon substrate for photovoltaic solar cell

Prediction of excess kerf loss in diamond wire sawing based on vibration source signal measurement and processing

Backpropagation Neural Network-Based Prediction Model of Marble Surface Quality Cut by Diamond Wire Saw

Experimental study on surface roughness in ultrasonic vibration–assisted diamond wire sawing monocrystalline silicon

Influence of Grinding Parameters on Surface Roughness and Subsurface Crack Damage Depth of Sapphire Crystal

Modeling and experimental investigation on sawing force in ultrasonic vibration–assisted diamond wire sawing mono-Si considering material removal mode

Process Parameters Analysis in Diamond Wire Saw Cutting NdFeB Magnet

The formation mechanism and influencing factors of the sawed surface of ZTA nanocomposite ceramics in diamond wire sawing

Surface Topography Analysis and Surface Roughness Prediction Model of Diamond Wire-Sawed NdFeB Magnet Based on Optimized Back Propagation Neural Network

金刚石线锯电火花复合切割硬脆半导体的研究进展

超声辅助金刚石线锯复合切割技术的研究进展

The state of the art of wire sawing-based hybrid cutting technology: a review

Sawing force modeling and analysis for diamond wire sawing PV monocrystalline silicon considering abrasive wear

Research on the reliability of wire web in diamond multi-wire saw slicing photovoltaic monocrystalline silicon wafer

Fracture strength analysis of large-size and thin photovoltaic monocrystalline silicon wafers

Relationship between surface roughness and subsurface crack damage depth of sapphire crystals cut by diamond wire saw based on slicing experiments

Improvement of wire marks on the surface of Si3N4 ceramics cut by diamond wire saw

Influences of fiber orientation and process parameters on diamond wire sawn surface characteristics of 2.5D Cf/SiC composites

Analysis of Wafer Warpage in Diamond Wire Saw Slicing Sapphire Crystal

A critical review on the fracture of ultra-thin photovoltaics silicon wafers

Surface characteristics of precision as-cut NdFeB magnet considering diamond wire wear

Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon

Wire bow analysis based on process parameters in diamond wire sawing

Study on Grinding-Affected Layer of Outer-Ring Inner Raceway of Tapered Roller Bearing

Fracture probability of PV mono-Si wafers in diamond wire slicing due to coupling of capillary adhesion bending stress and sawing stress

Influence of Diamond Wire Saw Processing Parameters on the Sawn Surface Characteristics of Silicon Nitride Ceramics

Effect of the diamond saw wires capillary adhesion on the thickness variation of ultra-thin photovoltaic silicon wafers during slicing

Study on surface characteristics of as-sawn sapphire crystal wafer considering diamond saw wire wear

Surface roughness in grinding outer ring inner raceway of tapered roller bearing

Study on subsurface microcrack damage depth of diamond wire as-sawn sapphire crystal wafers

Study on surface roughness and morphology of diamond wire as-sawn sapphire crystal wafers

Finite element analysis of the clamping stress of photovoltaic silicon brick in diamond wire sawing

Experiment and theoretical prediction for subsurface microcracks and damage depth of multi-crystalline silicon wafer in diamond wire sawing

Influences of hard inclusions on processing stress in diamond multi-wire sawing multi-crystalline silicon

Simulation analysis of cutting coolant flow field in fixed and free abrasive combined wire sawing polysilicon

Surface properties of diamond wire sawn photovoltaic mc-Si wafers by stirred slurry pretreated and additive-free acid textured

Wet sandblasting pretreatment of diamond wire sawn multi-crystalline silicon wafer for surface acid texturization in photovoltaics

Analysis of sawing characteristics of fine diamond wire slicing multicrystalline silicon

The study of crack damage and fracture strength for single crystal silicon wafers sawn by fixed diamond wire

Sawing characteristics of diamond wire cutting sapphire crystal based on tool life cycle

Fracture strength of photovoltaic silicon wafers cut by diamond wire saw based on half-penny crack system

Finite element analysis on processing stress of polysilicon cut by diamond multi-wire saw

Study on a novel fixed and free abrasive combined wire sawing multi-crystalline silicon wafers for wet acid texturization

Hydrodynamic action in slicing PV polysilicon with a novel fixed and free abrasive combined wire sawing

Analysis of crack-free surface generation of photovoltaic polysilicon wafer cut by diamond wire saw

Fabrication and cutting performance of a new type of abrasives-helix-distribution saw wire for slicing KDP crystal

电镀金刚石线表面磨粒密度对锯切性能影响分析

Study on cutting PV polysilicon with a new type of diamond abrasives-helix-distribution saw wire based on controlling the subsurface microcrack damage depth

A new method of determining the slicing parameters for fixed diamond wire saw

Analytical prediction of subsurface microcrack damage depth in diamond wire sawing silicon crystal

Experimental investigation on the machining characteristics of fixed-free abrasive combined wire sawing PV polycrystalline silicon solar cell

Study on process parameters of fabrication fine diameter electroplated diamond wire for slicing crystalline silicon solar cell

电镀金刚石线锯氨基磺酸盐预镀镍工艺

电镀金刚石线锯切割光伏多晶硅的表面特性与锯丝磨损分析

Analysis of Antireflection Performance of V‐Ring Groove Structures for Photovoltaic Crystal Silicon Solar Cells

Experiment and theoretical prediction for surface roughness of PV polycrystalline silicon wafer in electroplated diamond wire sawing

Experimental study on slicing photovoltaic polycrystalline silicon with diamond wire saw

Study on nucleation and propagation of median cracks generated by scratching single crystal silicon

Material removal and surface generation mechanisms in diamond wire sawing of silicon crystal

Sawing stress of SiC single crystal with void defect in diamond wire saw slicing

Nucleation location and propagation direction of radial and median cracks for brittle material in scratching

线锯切割晶片翘曲度的影响因素分析

工艺参数对悬砂法复合电镀制备金刚线的影响

The effect of cut depth and distribution for abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon