梁水保｜合肥工业大学｜学者主页

2026

功率器件烧结银互连组织演化及性能影响研究进展

郭志濠，魏雨晨，钟志宏，梁水保

《电子与封装》

DOI

2026

Magnetic Field-Driven Preferential Grain Growth and Orientation Evolution in Tin for Electronic Interconnects

Shui-Bao Liang, Cheng Wei, Han Jiang, Xin-Ping Zhang

JOM

DOI

2026

Stress effects on grain boundary grooving in polycrystalline interconnects: Insights from phase-field simulations

Shuibao Liang, Han Jiang, Zhihong Zhong, Saranarayanan Ramachandran

Journal of Applied Physics

DOI

2026

Mechanistic insights into grain size mediated interface migration in Cu–Cu bonding for advanced packaging

Yuchen Wei, Han Jiang, Zhihong Zhong, Saranarayanan Ramachandran, Shuibao Liang

Microelectronics Journal

DOI

2026

Torque-Driven Grain Rotation in Solder Interconnects under Electromigration for Advanced Packaging: Insights from Phase-Field Simulations

Han Jiang, Yi Xu, Saranarayanan Ramachandran, Shuibao Liang

ACS Applied Materials & Interfaces

DOI

2026

Coupled Finite Element Analysis and Phase Field Modeling of Thermomechanical Fracture in Through-Glass Vias for Advanced Packaging

Han Jiang, Susu Li, Shuibao Liang, Guangbin Dou

IEEE Transactions on Electron Devices

DOI

2026

Electromigration Degradation of Buried Power Rails Considering Grain Evolution in Stacked Integration

Han Jiang, Shuibao Liang, Yaohua Xu, Saranarayanan Ramachandran

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2026

Interfacial Engineering for Enhanced EGaIn-Based Bonding: Role of Fluxes and Surface Topography on Wetting, Spreading, and Adhesion Strength

Zongshuai Li, Yaohua Xu, Yi Wang, Shuibao Liang, Han Jiang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Influence of Interfacial Energetics on Void Morphology and Closure in Cu–Cu Bonding

Yuchen Wei, Susu Li, Leyin Zhang, Han Jiang, Zhihong Zhong, Yaohua Xu, Shuibao Liang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Thermomechanical Reliability Implications of Copper Filler Scaling in Through-Glass Via Structures

Liguo Xu, Dong Wang, Lan Fang, Shuibao Liang, Chenghu Dai, Han Jiang

International Symposium on Semiconductor and Electronic Technology (ISSET)

DOI

2025

Thermomechanical and Fatigue Analysis of SiC Power Modules with a Comparison of Sintered Silver and Copper Die Attaches

Shuibao Liang, Zhihao Guo, Han Jiang, Zhihong Zhong, Yaohua Xu, Yi Wang, Saranarayanan Ramachandran

Journal of Electronic Materials

DOI

2025

Unraveling Grain Boundary Migration and Evolution of the Cu-Cu bonding Structure Driven by Thermo-mechanical Stress

Yuchen Wei, Leyin Zhang, Susu Li, Han Jiang, Zhihong Zhong, Yaohua Xu, Shuibao Liang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Investigating the Effect of Temperature Gradients on Crack Propagation and Performance Degradation of SiC Power Modules with Sintered Silver Die Attach

Zhihao Guo, Zhenchao Li, Susu Li, Han Jiang, Zhihong Zhong, Yaohua Xu, Kuijing Song, Shuibao Liang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Grain Morphology Effects on Void Formation and Electromigration-Induced Failure in Copper Interconnects

Han Jiang, Susu Li, Zhenchao Li, Leyin Zhang, Yaohua Xu, Saranarayanan Ramachandran, Shuibao Liang

IEEE Transactions on Semiconductor Manufacturing

DOI

2025

Grain morphology effect on interfacial void closure in Cu–Cu bonding for advanced semiconductor packaging

Han Jiang, Yaohua Xu, Saranarayanan Ramachandran, Shuibao Liang

Microelectronics Reliability

DOI

2025

Influence of Phase Coarsening on Inhomogeneous Deformation and Fracture Behavior in Sn–Bi Solder Interconnects

Shuibao Liang, Han Jiang, Zhihong Zhong, Yaohua Xu, Saranarayanan Ramachandran

IEEE Transactions on Device and Materials Reliability

DOI

2025

Study on Thermomigration-Induced Void Formation in Advanced Copper Interconnects

Shuibao Liang, Han Jiang, Rongxin Zhou, Yaohua Xu, Saranarayanan Ramachandran

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2024

Investigation of Electro-Thermo-Mechanical Degradation and Crack Propagation of Wire Bonds in Power Modules Using Integrated Phase Field Modeling and Finite Element Analysis

Han Jiang, Shuibao Liang, Yaohua Xu, Saranarayanan Ramachandran

IEEE Transactions on Power Electronics

DOI

2024

Probing the Scaling Effect on Electromigration and Segregation in Sn–58Bi Solder Interconnects Through Numerical Modeling

Shuibao Liang, Xin-Ping Zhang, Han Jiang, Zhihong Zhong

IEEE Transactions on Electron Devices

DOI

2024

Effect of Sintered Silver Phase Coarsening on the Fatigue Characteristics of SiC Power Modules

Zhihao Guo, Shuibao Liang, Han Jiang, Zhihong Zhong, Kuijing Song, Yaohua Xu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Investigation of Effects of Porosity and Coarsening on Thermal and Mechanical Properties of Sintered Silver Die Attachment

Han Jiang, Shuibao Liang, Yaohua Xu, Saranarayanan Ramachandran

IEEE Transactions on Electron Devices

DOI

2024

Effect of Phase Evolution on Inhomogeneous Deformation and Fracture Behavior in Sn-Bi Solder Alloys

Shuibao Liang, Wangyun Li, Han Jiang, Zhihao Guo, Zhihong Zhong

International Conference on Electronics Packaging (ICEP)

DOI

2024

Simulation Study of Pore Structure Evolution and its Influences on the Properties of Sintered Silver

Han Jiang, Shuibao Liang, Changqing Liu

International Conference on Electronics Packaging (ICEP)

DOI

2024

Investigating the preferential growth of Bi grains in Sn-Bi based solder under thermal aging

Shuibao Liang, Han Jiang, Zhihong Zhong, Yaohua Xu, Kuijing Song

Journal of Materials Research and Technology

DOI

2023

Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing

Shuibao Liang, Han Jiang, Jiaqiang Huang

Journal of Electronic Materials

DOI

2023

Investigation of Electrical–Thermal–Mechanical Effects in Electric-Assisted Silver Sintering Process Through Phase Field Modeling

Shuibao Liang, Changqing Liu, Han Jiang, Zhihong Zhong

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2023

Insights Into the Grain Orientation Effect on Electromigration-Induced Failure in Solder Interconnects Through Phase Field Modeling

Shuibao Liang, Han Jiang, Zhihong Zhong, Saranarayanan Ramachandran

IEEE Transactions on Electron Devices

DOI

2022

Phase field modelling of the electromigration behaviour in sintered silver

Hanqing Jiang, Shui-Bao Liang, Cheng Wei, C. Ke

DOI

2022

Unravelling the electric field effect on the grain boundary migration in alumina through phase field modelling

Shui-Bao Liang, Xin-Ping Zhang

Journal of The American Ceramic Society

DOI

2022

Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array

Hanqing Jiang, S. Robertson, Shui-Bao Liang, Zhao-Xia Zhou, Li-Guo Zhao, Chang-Qing Liu

Materials letters (General ed.)

DOI

2021

Effect of anisotropy in thermal conductivity on grain boundary migration under temperature gradient – A phase field study

Shui-Bao Liang, Cheng Wei, C. Ke

DOI

2021

3D Finite Element Simulation Study of Chip Stacking Structure Considering Different Numbers of Stacked Dies and the Effects of Underfill and Intermetallic Compound Layer of Micro-joints

Bing-Xian Yang, Jiu-Bin Fei, Shui-Bao Liang, Min-Bo Zhou, Wei-Lin Hu, Hai-Jun Huang, Xin-Ping Zhang

Electronic Components and Technology Conference

DOI

2021

Insight into the preferential grain growth of intermetallics under electric current stressing – A phase field modeling

Shui-Bao Liang, Anil Kunwar, Cheng Wei, C. Ke

DOI

2019

电--热--力场作用下微互连中微观组织演化及其对可靠性影响的相场模拟研究

梁水保

《华南理工大学》

2019

Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient

Shui-Bao Liang, C. Ke, Jin-Hao Huang, Min-Bo Zhou, X.-P. Zhang

Microelectronics and reliability

DOI

2019

Study of the Influence of Elastic Anisotropy of Cu on Thermo-Mechanical Behavior and Cu Protrusion of Through Silicon Vias Using Combined Phase Field and Finite Element Methods

Shui-Bao Liang, C. Ke, Cheng Wei, Min-Bo Zhou, X.-P. Zhang

IEEE transactions on device and materials reliability

DOI

2019

Three-Dimensional Simulation of the Thermo-Mechanical Interaction between the Micro-Bump Joints and Cu Protrusion in Cu-Filled TSVs of the High Bandwidth Memory (HBM) Structure

Jie-Ying Zhou, Shui-Bao Liang, Cheng Wei, W. Le, C. Ke, Min-Bo Zhou, Xiao Ma, Xin-Ping Zhang

Electronic Components and Technology Conference

DOI

2019

Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress

Shui-Bao Liang, C. Ke, Cheng Wei, Jia-Qiang Huang, Min-Bo Zhou, Xin-Ping Zhang

Journal of Materials Research

DOI

2018

Phase field modeling of grain boundary migration and preferential grain growth driven by electric current stressing

Shui-Bao Liang, C. Ke, Cheng Wei, Min-Bo Zhou, X.-P. Zhang

Journal of Applied Physics

DOI

2018

Three-Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods

Shui-Bao Liang, C. Ke, Cheng Wei, Min-Bo Zhou, Xin-Ping Zhang

Electronic Components and Technology Conference

DOI

2018

Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3.0Ag0.5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature

Jin-Hao Huang, M.-B. Zhou, Shui-Bao Liang, X.-P. Zhang

Journal of Materials Science: Materials in Electronics

DOI

2018

Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration

Jie-Ying Zhou, Cheng Wei, Shui-Bao Liang, Han Jiang, Xiao Ma, Xin-Ping Zhang

International Conference on Electronic Packaging Technology

DOI

2018

Interaction effects between the preferred growth of β-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling

Shui-Bao Liang, Xin-Ping Zhang, Cheng Wei, C. Ke, Chang-Qing Liu

Electronics System-integration Technology Conference

DOI

2018

Phase field study of the combined effects of electromigration and thermomigration on phase segregation and physical properties of Sn58Bi solder joints under electric current stressing coupled with temperature gradient

Shui-Bao Liang, C. Ke, Cheng Wei, Min-Bo Zhou, Xin-Ping Zhang

International Conference on Electronic Packaging Technology

DOI

2017

二元合金体系形变过程中Kirkendall空洞形貌演化和生长动力学的晶体相场法研究（英文）

马文婧，柯常波，梁水保，周敏波，张新平

Transactions of Nonferrous Metals Society of China

2017

Morphological evolution and growth kinetics of Kirkendall voids in binary alloy system during deformation process—Phase field crystal simulation study

Wen-jing Ma, C. Ke, Shui-Bao Liang, Min-Bo Zhou, Xin-Ping Zhang

DOI

2017

Coupled phase field and finite element modeling of void evolution and physical property change of micro flip-chip solder joints under electromigration and elastic stress field

Shui-Bao Liang, C. Ke, Min-Bo Zhou, Xin-Ping Zhang

International Conference on Electronic Packaging Technology

DOI

2017

Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects

Shui-Bao Liang, C. Ke, Wen-Jing Ma, Minbo Zhou, Xin-Ping Zhang

Microelectronics and reliability

DOI

2017

Microstructure simulation and thermo-mechanical behavior analysis of Cu-filled through silicon vias (TSVs) using combined Monte Carlo and finite element method

Shui-Bao Liang, Cheng Wei, C. Ke, Min-Bo Zhou, Xin-Ping Zhang

International Conference on Electronic Packaging Technology

DOI

2017

Microstructure Simulation and Thermo-Mechanical Behavior Analysis of Copper Filled Through Silicon Vias Using Coupled Phase Field and Finite Element Methods

Shui-Bao Liang, C. Ke, Han-Jiang, Min-Bo Zhou, Xin-Ping Zhang

Electronic Components and Technology Conference

DOI

2016

Phase Field Simulation of Segregation of the Bi-Riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing

Shui-Bao Liang, C. Ke, Wen-jing Ma, Min-Bo Zhou, Xin-Ping Zhang

Electronic Components and Technology Conference

DOI

2016

Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gradient

Shui-Bao Liang, C. Ke, Min-Bo Zhou, Xin-Ping Zhang

International Conference on Electronic Packaging Technology

DOI

2016

Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure

Han Jiang, Shui-Bao Liang, Hui-Hui Yuwen, Xin-Ping Zhang

International Conference on Electronic Packaging Technology

DOI

2016

Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects

Shui-Bao Liang, C. Ke, Mengying Tan, Min-Bo Zhou, Xin-Ping Zhang

International Conference on Electronic Packaging Technology

DOI

2015

Sn/Cu互连体系界面和金属间化合物层Kirkendall空洞演化和生长动力学的晶体相场法模拟

马文婧，柯常波，周敏波，梁水保，张新平

《金属学报》

2015

Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation

Shui-Bao Liang, C. Ke, Min-Bo Zhou, Xin-Ping Zhang

International Conference on Electronic Packaging Technology

DOI

2015

Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic compound layer of Sn/Cu soldering system under cyclic loading

Wen-jing Ma, C. Ke, Shui-Bao Liang, Min-Bo Zhou, Xin-Ping Zhang

International Conference on Electronic Packaging Technology

DOI

2015

PHASE-FIELD CRYSTAL SIMULATION ON EVOLU- TION AND GROWTH KINETICS OF KIRKENDALL VOIDS IN INTERFACE AND INTERMETALLIC COMPOUND LAYER IN Sn/Cu SOLDERING SYSTEM

Wen-jing Ma, C. Ke, Min-Bo Zhou, Shui-Bao Liang, Xin-Ping Zhang

DOI

2014

Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects

Shui-Bao Liang, C. Ke, Wen-jing Ma, Min-Bo Zhou, Xin-Ping Zhang

International Conference on Electronic Packaging Technology

DOI

精选作品

期刊论文

功率器件烧结银互连组织演化及性能影响研究进展

Magnetic Field-Driven Preferential Grain Growth and Orientation Evolution in Tin for Electronic Interconnects

Stress effects on grain boundary grooving in polycrystalline interconnects: Insights from phase-field simulations

Mechanistic insights into grain size mediated interface migration in Cu–Cu bonding for advanced packaging

Torque-Driven Grain Rotation in Solder Interconnects under Electromigration for Advanced Packaging: Insights from Phase-Field Simulations

Coupled Finite Element Analysis and Phase Field Modeling of Thermomechanical Fracture in Through-Glass Vias for Advanced Packaging

Electromigration Degradation of Buried Power Rails Considering Grain Evolution in Stacked Integration

Interfacial Engineering for Enhanced EGaIn-Based Bonding: Role of Fluxes and Surface Topography on Wetting, Spreading, and Adhesion Strength

Influence of Interfacial Energetics on Void Morphology and Closure in Cu–Cu Bonding

Thermomechanical Reliability Implications of Copper Filler Scaling in Through-Glass Via Structures

Thermomechanical and Fatigue Analysis of SiC Power Modules with a Comparison of Sintered Silver and Copper Die Attaches

Unraveling Grain Boundary Migration and Evolution of the Cu-Cu bonding Structure Driven by Thermo-mechanical Stress

Investigating the Effect of Temperature Gradients on Crack Propagation and Performance Degradation of SiC Power Modules with Sintered Silver Die Attach

Grain Morphology Effects on Void Formation and Electromigration-Induced Failure in Copper Interconnects

Grain morphology effect on interfacial void closure in Cu–Cu bonding for advanced semiconductor packaging

Influence of Phase Coarsening on Inhomogeneous Deformation and Fracture Behavior in Sn–Bi Solder Interconnects

Study on Thermomigration-Induced Void Formation in Advanced Copper Interconnects

Investigation of Electro-Thermo-Mechanical Degradation and Crack Propagation of Wire Bonds in Power Modules Using Integrated Phase Field Modeling and Finite Element Analysis

Probing the Scaling Effect on Electromigration and Segregation in Sn–58Bi Solder Interconnects Through Numerical Modeling

Effect of Sintered Silver Phase Coarsening on the Fatigue Characteristics of SiC Power Modules

Investigation of Effects of Porosity and Coarsening on Thermal and Mechanical Properties of Sintered Silver Die Attachment

Effect of Phase Evolution on Inhomogeneous Deformation and Fracture Behavior in Sn-Bi Solder Alloys

Simulation Study of Pore Structure Evolution and its Influences on the Properties of Sintered Silver

Investigating the preferential growth of Bi grains in Sn-Bi based solder under thermal aging

Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing

Investigation of Electrical–Thermal–Mechanical Effects in Electric-Assisted Silver Sintering Process Through Phase Field Modeling

Insights Into the Grain Orientation Effect on Electromigration-Induced Failure in Solder Interconnects Through Phase Field Modeling

Phase field modelling of the electromigration behaviour in sintered silver

Unravelling the electric field effect on the grain boundary migration in alumina through phase field modelling

Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array

Effect of anisotropy in thermal conductivity on grain boundary migration under temperature gradient – A phase field study

3D Finite Element Simulation Study of Chip Stacking Structure Considering Different Numbers of Stacked Dies and the Effects of Underfill and Intermetallic Compound Layer of Micro-joints

Insight into the preferential grain growth of intermetallics under electric current stressing – A phase field modeling

电--热--力场作用下微互连中微观组织演化及其对可靠性影响的相场模拟研究

Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient

Study of the Influence of Elastic Anisotropy of Cu on Thermo-Mechanical Behavior and Cu Protrusion of Through Silicon Vias Using Combined Phase Field and Finite Element Methods

Three-Dimensional Simulation of the Thermo-Mechanical Interaction between the Micro-Bump Joints and Cu Protrusion in Cu-Filled TSVs of the High Bandwidth Memory (HBM) Structure

Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress

Phase field modeling of grain boundary migration and preferential grain growth driven by electric current stressing

Three-Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods

Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3.0Ag0.5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature

Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration

Interaction effects between the preferred growth of β-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling

Phase field study of the combined effects of electromigration and thermomigration on phase segregation and physical properties of Sn58Bi solder joints under electric current stressing coupled with temperature gradient

二元合金体系形变过程中Kirkendall空洞形貌演化和生长动力学的晶体相场法研究（英文）

Morphological evolution and growth kinetics of Kirkendall voids in binary alloy system during deformation process—Phase field crystal simulation study

Coupled phase field and finite element modeling of void evolution and physical property change of micro flip-chip solder joints under electromigration and elastic stress field

Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects

Microstructure simulation and thermo-mechanical behavior analysis of Cu-filled through silicon vias (TSVs) using combined Monte Carlo and finite element method

Microstructure Simulation and Thermo-Mechanical Behavior Analysis of Copper Filled Through Silicon Vias Using Coupled Phase Field and Finite Element Methods

Phase Field Simulation of Segregation of the Bi-Riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing

Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gradient

Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure

Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects

Sn/Cu互连体系界面和金属间化合物层Kirkendall空洞演化和生长动力学的晶体相场法模拟

Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation

Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic compound layer of Sn/Cu soldering system under cyclic loading

PHASE-FIELD CRYSTAL SIMULATION ON EVOLU- TION AND GROWTH KINETICS OF KIRKENDALL VOIDS IN INTERFACE AND INTERMETALLIC COMPOUND LAYER IN Sn/Cu SOLDERING SYSTEM

Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects

研究方向