刘二勇｜西安科技大学｜学者主页

期刊论文

2026

微量合金元素和配位剂对锂电铜箔性能的影响

张哲，李佳林，白忠波，刘二勇，蔡辉，张菁丽

《电镀与涂饰》

2026

镍、钴微合金化极薄电解铜箔微观组织与性能

王天昊，李佳林，刘二勇，蔡辉，张菁丽，白忠波，杨庆浩，赵磊

《电镀与精饰》

2025

低成本无钯活化复合铜箔化学镀技术研究

杨恒亮，张菁丽，刘二勇，蔡辉，白忠波，李晓晗，马超

《铜业工程》

2025

Study on Electrodeposition Thickening Process and Performance Regulation of Composite Copper Foil Collectors

Xiaosong Tao, Bo Zhang, Miyu Zhao, Lihua Zhan, Lixin Zhang, Eryong Liu

International Conference on Electrical, Mechanical and Computer Engineering (ICEMCE)

DOI

2025

Study on Microstructure, Corrosion, and Heat Resistance of Ni/Cu/Ni Composite Foil and Battery Application

Deshi Feng, Eryong Liu, Jingli Zhang, Hui Ye Cai, Zhongbo Bai, Xiaohan Li

Journal of Electronic Materials

DOI

2025

The effect of additives on microstructure and properties of electrodeposited porous copper foils

Yifan Xu, Wan‐chang Sun, Eryong Liu, Zhongbo Bai, Ya‐peng Jia, Mengran Zhou, Bo Zhang, Hui Ye Cai, Jingli Zhang, Tianze Jia

Surface Innovations

DOI

2025

Effects of multi-component additives on the microstructure and mechanical performance of HVLP copper foil for high-speed electronic devices

Mengran Zhou, Wan‐chang Sun, Eryong Liu, Yan Xiao, Yifan Xu, Bo Zhang, Tian-ze Jia, Hui Cai, Jingli Zhang

Journal of Applied Electrochemistry

DOI

2025

Quantifying synergistic interactions of ternary additives for microstructural control in ultrathin Li-ion battery copper foils

Jin-Ze Zhang, Jialin Li, Liping Wang, Zhongbo Bai, Eryong Liu, H. Cai, Jing-Li Zhang, Qinhao Yang

RSC Advances

DOI

2024

硫酸钛-钨酸钠复合添加剂对电解铜箔后处理形貌及抗剥离强度的影响

张锦园，张杰，白忠波，彭肖林，刘二勇，张菁丽，焦阳

《电镀与精饰》

2024

不同厂家高频高速铜箔指标对抗剥离强度的影响

于洁，白忠波，孟建龙，刘二勇，张菁丽，蔡辉

《电镀与精饰》

2024

Effect of additives on the microstructure and properties of pulsed electrodeposited copper foils

Jing-pei Liu, Wan‐chang Sun, Zhongbo Bai, Eryong Liu, Hui Cai, Shasha Tian, Congxiao Zhang, Yifan Xu, Bo Zhang, Mengran Zhou, Tianze Jia

Transactions of the IMF

DOI

2024

Effect of Different Surface States of Electrolytic Copper Foils on the Performance of Lithium-Ion Batteries

Jie Yu, Eryong Liu, Zhongbo Bai, Shuangming Du, Ruixi Guo

Journal of The Electrochemical Society

DOI

2024

Study on microstructure and properties of typical copper foils

Jian-Hua Yang, Liping Wang, Zhongbo Bai, Xiao-Lin Peng, Baoxin Feng, Eryong Liu

Kovove Materialy-metallic Materials

DOI

2023

PEG及其复合添加剂对电解铜箔后处理的影响

张杰，白忠波，冯宝鑫，彭肖林，任伟伟，张菁丽，刘二勇

《化工进展》

DOI

2023

电解铜箔用钛阳极涂层的研究现状

张锦园，张菁丽，白忠波，杜良良，冯宝鑫，彭肖林，刘二勇，蔡辉

《电镀与精饰》

2023

钼酸钠-钨酸钠复合添加剂对铜箔电解粗化的影响

冯宝鑫，张杰，白忠波，彭肖林，任伟伟，蔡辉，张菁丽，刘二勇

《电镀与涂饰》

2023

Failure Mechanism Analysis of Titanium Anode for Electrolytic Copper Foils

Jinyuan Zhang, Jingli Zhang, Jingli Zhang, Jingli Zhang, Hui Cai, Zhongbo Bai, Xiaolin Peng, Yang Jiao, Ming Wang, Eryong Liu, Wan‐chang Sun

Journal of Failure Analysis and Prevention

DOI

2023

Microstructure and Properties of Porous Copper Foils with High Specific Surface Area Prepared by Electrodeposition

Ya‐peng Jia, Wan‐chang Sun, Zhongbo Bai, Eryong Liu, Liang-liang Du, Hui Ye Cai, Jingli Zhang, Xiaolin Peng, Liping Wang

Journal of The Electrochemical Society

DOI

2023

Effect of low temperature annealing on microstructure and properties of copper foil

Liping Wang, Zhongbo Bai, Wan‐chang Sun, Liang-liang Du, Xiao-lin Peng, Yan Xiao, Jie Zhang, Ya‐peng Jia, Shuangming Du, Hui Cai, Eryong Liu

Materials Today Communications

DOI

2023

Effect of additives on microstructure and properties of the coarsened layer of very low profile (HVLP) copper foil

Yan Xiao, Wan‐chang Sun, Zhongbo Bai, Eryong Liu, Liang-liang Du, Hui Ye Cai, Liping Wang, Jing-pei Liu, Ya‐peng Jia, Jie Zhang

Journal of Applied Electrochemistry

DOI

预印本

2023

Study on the degradation behavior of collagen in electrolytic copper foil and its efficacy

Jie Yu, Eryong Liu, Zhongbo Bai, Yang Jiao, Ming Wang

Research Square

DOI

2023

Influences of composite additives and technological parameters on the microstructure and properties of electrolytic copper foil

Jing-pei Liu, Wan‐chang Sun, Zhongbo Bai, Eryong Liu, Hui Wu Cai, Jingli Zhang, Sha-sha Tian, Cong‐xiao Zhang, Yifan Xu, Mengran Zhou, Bo Zhang

Research Square

DOI

刘二勇

精选作品

期刊论文

微量合金元素和配位剂对锂电铜箔性能的影响

镍、钴微合金化极薄电解铜箔微观组织与性能

低成本无钯活化复合铜箔化学镀技术研究

Study on Electrodeposition Thickening Process and Performance Regulation of Composite Copper Foil Collectors

Study on Microstructure, Corrosion, and Heat Resistance of Ni/Cu/Ni Composite Foil and Battery Application

The effect of additives on microstructure and properties of electrodeposited porous copper foils

Effects of multi-component additives on the microstructure and mechanical performance of HVLP copper foil for high-speed electronic devices

Quantifying synergistic interactions of ternary additives for microstructural control in ultrathin Li-ion battery copper foils

硫酸钛-钨酸钠复合添加剂对电解铜箔后处理形貌及抗剥离强度的影响

不同厂家高频高速铜箔指标对抗剥离强度的影响

Effect of additives on the microstructure and properties of pulsed electrodeposited copper foils

Effect of Different Surface States of Electrolytic Copper Foils on the Performance of Lithium-Ion Batteries

Study on microstructure and properties of typical copper foils

PEG及其复合添加剂对电解铜箔后处理的影响

电解铜箔用钛阳极涂层的研究现状

钼酸钠-钨酸钠复合添加剂对铜箔电解粗化的影响

Failure Mechanism Analysis of Titanium Anode for Electrolytic Copper Foils

Microstructure and Properties of Porous Copper Foils with High Specific Surface Area Prepared by Electrodeposition

Effect of low temperature annealing on microstructure and properties of copper foil

Effect of additives on microstructure and properties of the coarsened layer of very low profile (HVLP) copper foil

预印本

Study on the degradation behavior of collagen in electrolytic copper foil and its efficacy

Influences of composite additives and technological parameters on the microstructure and properties of electrolytic copper foil

研究方向