朱福龙｜华中科技大学｜学者主页

2026

Investigation of the interfacial thermal resistance of Cu/Ta heterostructure in the through glass via wafer

Kezhong Xu, Weibin Hui, Yuxin Chen, Ziniu Yu, Jianguo Xie, Chuanjia Wang, Shibo Zu, Yong Jiang, Fulong Zhu

Modelling and Simulation in Materials Science and Engineering

DOI

2026

Phonon coupling governed interfacial thermal resistance in twisted GaN homojunctions at different temperatures

Weibin Hui, Kezhong Xu, Ziniu Yu, Yuxin Chen, Jianguo Xie, Chuanjia Wang, Shibo Zu, Yong Jiang, Fulong Zhu

Surfaces and Interfaces

DOI

2026

Temperature-Dependent Interfacial Thermal Resistance of GaN/AlN Heterostructures: Role of Ga/N Vacancy in the Near-Interface Region

Weibin Hui, Kezhong Xu, Ziniu Yu, Yuxin Chen, Shibo Zu, Fulong Zhu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Electromigration-Induced Atomic and Stress Evolution in Copper Strips

Shibo Zu, Ziniu Yu, Chuanjia Wang, Kezhong Xu, Weibin Hui, Fulong Zhu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Study on the Shear Mechanical Properties and Deformation Mechanisms of Cu/Ta Bilayer with the Tilted Interface

Kezhong Xu, Weibin Hui, Yuxin Chen, Ziniu Yu, Shibo Zu, Fulong Zhu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Mechanism of angle-dependent thermal resistance at GaN/GaN interfaces

Weibin Hui, Keng Xu, Ziniu Yu, Yuxin Chen, Jianguo Xie, Chuanjia Wang, Yue Jiang, Shibo Zu, Fulong Zhu

International Journal of Thermal Sciences

DOI

2026

A Multiscale Simulation Study on the Effects of Filler Coating on the Performance of Electrically Conductive Adhesive

Ziniu Yu, Kezhong Xu, Yuqi Zhou, Weibin Hui, Yuxin Chen, Yuhan Gao, C.X Wang, J. J. Xie, Fulong Zhu

ACS Applied Electronic Materials

DOI

2026

Electromigration-Induced Failure in Rough TGV With Tilted Angle Sidewalls

Chuanjia Wang, Ziniu Yu, Kezhong Xu, Weibin Hui, Yuxin Chen, Jianguo Xie, Fulong Zhu

IEEE Transactions on Electron Devices

DOI

2026

Region-adaptive DIC with variable speckle parameters for accurate warpage measurement in electronic packaging structures

Jianguo Xie, Yuhan Gao, Y. Q. Chen, Kezhong Xu, Yu Ziniu, Chuanjia Wang, Yuqi Zhou, Weibin Hui, Fulong Zhu

Optics & Laser Technology

DOI

2026

Investigation on the Service Performance of Polycrystalline Cu-Filled TGV Under Thermal Cycling

Chuanjia Wang, Ziniu Yu, Kezhong Xu, Weibin Hui, Yuxin Chen, Jianguo Xie, Shibo Zu, Yong Jiang, Fulong Zhu

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2026

Reflectivity-guided adaptive projection speckle DIC for HDR surface measurement

Jianguo Xie, Yuxin Chen, Kezhong Xu, Ziniu Yu, Chuanjia Wang, Yong Jiang, Shibo Zu, Yuhan Gao, Fulong Zhu

Measurement Science and Technology

DOI

2025

Dependence of shear behavior and interface evolution on modulation period of Cu/Ta nanofilms

Kezhong Xu, Yuqi Zhou, Yuxin Chen, Jianguo Xie, Yuhan Gao, Fulong Zhu

Journal of Materials Science

DOI

2025

Optical MEMS die-attach warpage analysis and mitigation via thermoelastic modeling and in-situ micro-Raman spectroscopy characterization

Wenyu Li, Zhoudong Yang, Xueliang Wang, Yuhan Gao, Jianguo Xie, Fulong Zhu, Guoqi Zhang, Jiajie Fan

Measurement

DOI

2025

Study on Microstructural Evolution Mechanisms of Amorphous $\text{SiO}_{2}$ in Through Glass via Wafer During Thinning

Kezhong Xu, Yuqi Zhou, Yuxin Chen, Ziniu Yu, Yuhan Gao, Fulong Zhu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2025

A high-accuracy and robust defect detection method for electronic packaging based on Infrared-visible image fusion

Y. Q. Chen, Yuhan Gao, Keng Xu, Ziniu Yu, Jianguo Xie, Chuanjia Wang, Fulong Zhu

Optics & Laser Technology

DOI

2025

Investigation of the thinning mechanisms of Cu/Ti heterostructure in the through glass via wafer

Kezhong Xu, Yuqi Zhou, Weibin Hui, Yuxin Chen, Yu Ziniu, Jianguo Xie, Chuanjia Wang, Fulong Zhu

Surfaces and Interfaces

DOI

2025

In-situ Measurement Method for Warpage of Electronic Package Substrate Based on Speckle-free DIC and Carbon Coating

Yuhan Gao, Y. Q. Chen, Ziniu Yu, Kezhong Xu, Chuanjia Wang, Jianguo Xie, Yuqi Zhou, Xin Lei, Fulong Zhu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

The Impact of Rough Interfaces and Tilt Angles on Thermal Cycling Reliability of Through Glass Via

C.L. Wang, Ziniu Yu, Xin Lei, Yuhan Gao, Yuqi Zhou, Kezhong Xu, Yuxin Chen, Jianguo Xie, Fulong Zhu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Brittle fracture control of 4H-SiC via laser-textured surfaces: Combined experimental and atomistic study

Yuqi Zhou, Kezhong Xu, Yuhan Gao, Ziniu Yu, Fulong Zhu

Diamond and Related Materials

DOI

2025

Underlying Thinning Mechanisms of Cu/Amorphous SiO2 Heterostructure in Through Glass Via Wafer from an Atomic Perspective

Kezhong Xu, Yuqi Zhou, Yuxin Chen, Jianguo Xie, Yuhan Gao, Fulong Zhu

The Journal of Physical Chemistry C

DOI

2025

Effect of tilted wall in through glass via on the electrochemical deposition process

Ziniu Yu, Yuhan Gao, Xin Lei, Yuxin Chen, Keng Xu, Yuqi Zhou, Fulong Zhu

Electrochimica Acta

DOI

2025

Correction of thermal airflow induced measurement errors in the digital fringe projection system using background-oriented Schlieren technique

Yuxin Chen, Yuhan Gao, Kezhong Xu, Ziniu Yu, Xin Lei, Bin Song, Fulong Zhu

Measurement Science and Technology

DOI

2025

Investigation of shear responses and underlying deformation mechanisms of Cu/Ta nanolayered composite

Kezhong Xu, Yuqi Zhou, Yuxin Chen, Yuhan Gao, Xin Lei, Yu Ziniu, Chuanjia Wang, Jianguo Xie, Fulong Zhu

Applied Surface Science

DOI

2024

Electrical contact reliability investigation of high-speed electrical connectors under fretting wear behavior

Xin Lei, Chenzefang Feng, Weishan Lv, Yuqi Zhou, Chuanguo Xiong, Yuhan Gao, Fulong Zhu

Microelectronics Reliability

DOI

2024

Study on Mechanical Failure Forms of Copper/Tantalum Contact Interface in Through Silicon Via

Ziniu Yu, Weishan Lv, Kezhong Xu, Yuqi Zhou, Yuxin Chen, Bin Song, Fulong Zhu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2024

Atomic-scale insights into the microstructure and interface evolution mechanism of copper/tantalum nanofilms during ultra-precision grinding

Kezhong Xu, Yuqi Zhou, Yuhan Gao, Yuxin Chen, Xin Lei, Yu Ziniu, Fulong Zhu

Surfaces and Interfaces

DOI

2024

Investigation on Electrical and Thermal Performance of Electrical Connectors Under Rough Surface Contact

Xin Lei, Ziniu Yu, Yuhan Gao, Yuqi Zhou, Kezhong Xu, Yuxin Chen, Fulong Zhu

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2024

Correction of thermal airflow distortion in warpage measurements of microelectronic packaging structures via deep learning-based digital image correlation

Yuhan Gao, Y. Q. Chen, Ziniu Yu, Chuanguo Xiong, Xin Lei, Weishan Lv, Sheng Liu, Fulong Zhu

Microsystems & Nanoengineering

DOI

2024

Atomistic simulations of the thinning process of tantalum/copper heterostructure in wafer containing through silicon via

Kezhong Xu, Yuqi Zhou, Yu Ziniu, Yuhan Gao, Yuxin Chen, Xin Lei, Chuanguo Xiong, Weishan Lv, Fulong Zhu

Applied Surface Science

DOI

2024

Investigation of the tribological behaviors for 4H–SiC substrate under different lubrication conditions

Yuqi Zhou, Kezhong Xu, Weishan Lv, Yuhan Gao, Fulong Zhu

Wear

DOI

2024

Design and Fabrication of Piezoresistive Pressure Sensor for Automotive Application

Bin Song, Fanliang Li, DengFeng Wu, Fulong Zhu, Sheng Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Optimized structure to suppress freezing damage in piezoresistive automotive pressure sensors

Bin Song, Fanliang Li, Dengfeng Wu, Jun Yang, Xiaoping Wang, Fulong Zhu, Sheng Liu

Sensors and Actuators A Physical

DOI

2024

Shear response and deformation mechanism of boron nitride nanosheets reinforced aluminum matrix composites

Kezhong Xu, Jinming Li, Yuqi Zhou, Yuhan Gao, Xin Lei, Fulong Zhu

Composite Structures

DOI

2024

Changing torque-force synchronization condition for abrasive particle improves material removal during silicon carbide abrasive machining

Hui Chen, Chengxin Wang, Jianxiong Chen, Yu Xie, Kailin Sun, Yuhua Huang, Fulong Zhu

Tribology International

DOI

2024

In Situ Warpage Measurement of Electronic Packages With Projected Speckle DIC and Deep Learning-Based ROI Identification

Yuhan Gao, Chuanguo Xiong, Weishan Lv, Kezhong Xu, Xin Lei, Fulong Zhu

IEEE Transactions on Instrumentation and Measurement

DOI

2024

Effects of oxidizer concentration and abrasive type on interfacial bonding and material removal in 4H-SiC polishing processes

Yuqi Zhou, Kezhong Xu, Yuhan Gao, Ziniu Yu, Fulong Zhu

Physical Chemistry Chemical Physics

DOI

2023

A full-field warpage characterization measurement method coupled with infrared information

Baoshan Zeng, Yuhan Gao, Chuanguo Xiong, Xin Lei, Weishan Lv, Fulong Zhu

Microelectronics Reliability

DOI

2023

Sn-enhanced high-temperature reliability of Cu/Nano-Ag/Cu joint via transient-liquid-phase bonding

Jiaxin Liu, Weishan Lv, Yun Mou, Yang Peng, Fulong Zhu, Mingxiang Chen

Journal of Materials Science

DOI

2023

The Effect of Filler Mass Fraction on The Physical Properties of Conductive Silver Adhesives

Ziniu Yu, Weishan Lv, Fulong Zhu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2023

The Effect of Cu/SiO2 Rough Interface on TSV Electroplating Process for Electronic Packaging

Weishan Lv, Xin Lei, Jiaxin Liu, Fulong Zhu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2023

Evolution of Nano-notches on the Surface of SiC with Different Crystal Forms during Cutting in the Water Environment

Yuqi Zhou, Weishan Lv, Fulong Zhu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2023

Investigation of the chemical action mechanism based on reactive force field in SiC chemical–mechanical polishing process

Yuqi Zhou, Yuhua Huang, Jinming Li, Weishan Lv, Fulong Zhu

Applied Surface Science

DOI

2023

High reliability of piezoresistive pressure sensors by wafer to wafer direct bonding at room temperature

Bin Song, Fanliang Li, Fulong Zhu, Sheng Liu

Sensors and Actuators A Physical

DOI

2023

The effects of abrasive moving speed and motion mode on the thinning mechanism of SiC in three-body contact

Yuqi Zhou, Yuhua Huang, Jinming Li, Weishan Lv, Fulong Zhu

Physica Scripta

DOI

2023

Atomic scale investigation of notch evolution on 4H-SiC under different cutting surfaces and environments

Yuqi Zhou, Yuhua Huang, Jinming Li, Weishan Lv, Fulong Zhu

Journal of Manufacturing Processes

DOI

2023

Role of Cu/SiO2 Rough Interface in TSV for High-Power Device Under Electromigration

Weishan Lv, Jiaxin Liu, Xin Lei, Fulong Zhu

IEEE Transactions on Electron Devices

DOI

2023

Specular surface deformation measurement based on projected-speckle deflectometry with digital image correlation

Chuanguo Xiong, Yuhan Gao, Yuhua Huang, Fulong Zhu

Optics and Lasers in Engineering

DOI

2023

Rough Interface Effect on High-Temperature Reliability of TSV for Electronic Packaging

Weishan Lv, Xin Lei, Jiaxin Liu, Yun Mou, Fulong Zhu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Optimized super-resolution promote accuracy for projection speckle three-dimensional digital image correlation

Yuhan Gao, Chuanguo Xiong, Xin Lei, Yuhua Huang, Weishan Lv, Fulong Zhu

Measurement Science and Technology

DOI

2023

Femtosecond laser surface modification coupling with surface metallurgical reaction promotes surface plasticity of SiC

Yuhua Huang, Yuqi Zhou, Jinming Li, Fulong Zhu

Journal of Materials Processing Technology

DOI

2023

Understanding of the effect of wear particles removal from the surface on grinding silicon carbide by molecular dynamics simulations

Yuhua Huang, Yuqi Zhou, Jinming Li, Fulong Zhu

Diamond and Related Materials

DOI

2023

Achieving excellent thermal stability in continuous three-dimensional graphene network reinforced copper matrix composites

Nan Nan, Jinming Li, Xiang Zhang, Dongdong Zhao, Fulong Zhu, Chunnian He, Naiqin Zhao

Carbon

DOI

2023

Understanding the role of surface mechanical properties in SiC surface machining

Yuhua Huang, Yuqi Zhou, Jinming Li, Fulong Zhu

Materials Science in Semiconductor Processing

DOI

2023

Fabrication and Sintering Behavior of Nano Cu–Ag Composite Paste for High-Power Device

Weishan Lv, Jiaxin Liu, Yun Mou, Yongjie Ding, Mingxiang Chen, Fulong Zhu

IEEE Transactions on Electron Devices

DOI

2023

Polishing process of 4H-SiC under different pressures in a water environment

Yuqi Zhou, Yuhua Huang, Jinming Li, Weishan Lv, Fulong Zhu

Diamond and Related Materials

DOI

2023

Porosity effect on the mechanical properties of nano-silver solder

Weishan Lv, Jianxiong Hu, Jiaxin Liu, Chuanguo Xiong, Fulong Zhu

Nanotechnology

DOI

2022

Design and Optimization of a Novel MEMS Tuning Fork Gyroscope Microstructure

Chuanguo Xiong, Pengjun Zeng, Weishan Lv, Fengming Lu, Ming Zhang, Yuhua Huang, Fulong Zhu

Micromachines

DOI

2022

Porosity Dependence of Thermal and Electrical Properties in Nano-Silver Paste

Weishan Lv, Jiaxin Liu, Xin Lei, Fulong Zhu

IEEE Transactions on Electron Devices

DOI

2022

A non-destructive inspection method for electronic packaging reliability incorporating mechanical and thermal information

Chuanguo Xiong, Baoshan Zeng, Yuhua Huang, Fulong Zhu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2022

The Effect of Porosity on Thermal Properties of Nano-Silver Solder for Electronic Packaging

Weishan Lv, Jianxiong Hu, Fulong Zhu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2022

The effect of BNNS distribution on the plastic deformation of BNNS/ Al composites during the nanoindentation

Jinming Li, Yuhua Huang, Yuqi Zhou, Fulong Zhu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2022

Effect of water film on 4H-SiC nano-indentation process

Yuqi Zhou, Yuhua Huang, Jinming Li, Fulong Zhu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2022

Evolution and influence of GaN/AlN heterointerface during the thinning process of GaN film

Yuqi Zhou, Yuhua Huang, Jinming Li, Fulong Zhu

Applied Surface Science

DOI

2022

Role of boron nitride nanosheet coatings on aluminum substrates during the nanoindentation from the atomic perspective

Jinming Li, Yuhua Huang, Yuqi Zhou, Fulong Zhu

Applied Surface Science

DOI

2022

Materials removal mechanism and multi modes feature for silicon carbide during scratching

Yuhua Huang, Yuqi Zhou, Jinming Li, Fulong Zhu

International Journal of Mechanical Sciences

DOI

2022

Effect of impurity doping on 4H-SiC planarization

Yuhua Huang, Yuqi Zhou, Jinming Li, Fulong Zhu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Effect of water film on the nano-scratching process of 4H-SiC under the constant load

Yuqi Zhou, Yuhua Huang, Jinming Li, Fulong Zhu

Tribology International

DOI

2022

Molecular Dynamics Study of Compressive Properties and Atomistic Behavior of Boron Nitride Nanosheets Reinforced in Aluminum Matrix Composites

Jinming Li, Yuhua Huang, Yuqi Zhou, Fulong Zhu

JOM

DOI

2022

The effect of contact types on SiC polishing process

Yuqi Zhou, Yuhua Huang, Jinming Li, Fulong Zhu

Materials Science in Semiconductor Processing

DOI

2021

Study on the influence of fretting wear on electrical performance of SMA connector

Chenzefang Feng, Xinxin Lin, Jianxiong Hu, Ben Shen, Zhou Hu, Fulong Zhu

Microelectronics Reliability

DOI

2021

Deformation mechanism of copper reinforced by three-dimensional graphene under torsion and tension

Jinming Li, Yixin Xu, Miaocao Wang, Fulong Zhu, Jianxiong Hu, Chenzefang Feng, Yuhua Huang, Xiang Zhang, Naiqin Zhao, Chunnian He

Modelling and Simulation in Materials Science and Engineering

DOI

2021

Molecular dynamics study of BNNS/Al composites under compression

Jinming Li, Yuhua Huang, Yuqi Zhou, Baoshen Zeng, Chenzefang Feng, Fulong Zhu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2021

Mechanical Response of BNNS-reinforced Aluminum Composites under Uniaxial Compression

Jinming Li, Yuhua Huang, Baoshan Zeng, Chenzefang Feng, Fulong Zhu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2021

Effect of inclusion on 4H-SiC during nano-scratching from an atomistic perspective

Yuhua Huang, Miaocao Wang, Jinming Li, Fulong Zhu

Journal of Physics Condensed Matter

DOI

2021

Removal behavior of micropipe in 4H-SiC during micromachining

Yuhua Huang, Miaocao Wang, Jinming Li, Fulong Zhu

Journal of Manufacturing Processes

DOI

2021

Investigation Regarding the Influence of Contact Condition on the Thermal Contact Resistance Between Copper and Indium

Jianxiong Hu, Chenzefang Feng, Ben Shen, Zhou Hu, Fulong Zhu

IEEE Transactions on Electron Devices

DOI

2021

Accuracy optimization method of ultrasonic power measurement system based on acousto-optic effect

Ben Shen, Baoshan Zeng, Xiaojian Liu, Chenzefang Feng, Zhou Hu, Jianxiong Hu, Fulong Zhu

Optical Review

DOI

2021

Investigation of the Turbulent Drag Reduction Mechanism of a Kind of Microstructure on Riblet Surface

Mingrui Ao, Miaocao Wang, Fulong Zhu

Micromachines

DOI

2021

Local Stress Field in Wafer Thinning Simulations with Phase Space Averaging

Miaocao Wang, Yuhua Huang, Jinming Li, Ling Fang Xu, Fulong Zhu

Computers, materials & continua/Computers, materials & continua (Print)

DOI

2020

Investigation on Contact Resistance of Connector Based on FEM

Chenzefang Feng, Xinxin Lin, Yixin Xu, Fulong Zhu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2020

Investigation of vibration-assisted nano-grinding of gallium nitride via molecular dynamics

Yuhua Huang, Miaocao Wang, Yixin Xu, Fulong Zhu

Materials Science in Semiconductor Processing

DOI

2020

Investigation on gallium nitride with N-vacancy defect nano-grinding by molecular dynamics

Yuhua Huang, Miaocao Wang, Yixin Xu, Fulong Zhu

Journal of Manufacturing Processes

DOI

2020

A powder-metallurgy-based strategy toward three-dimensional graphene-like network for reinforcing copper matrix composites

Xiang Zhang, Yixin Xu, Miaocao Wang, Enzuo Liu, Naiqin Zhao, Chunsheng Shi, Dong Liang Lin, Fulong Zhu, Chunnian He

Nature Communications

DOI

2019

Investigation on Thermal Contact Resistance Between Indium and Cap in Packaging

Jianxiong Hu, Zefang Fengchen, Ye Zhang, Yixin Xu, Fulong Zhu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2019

Investigation on the Interface Thermal Resistance of Copper-Titanium

Yixin Xu, Fulong Zhu, Miaocao Wang, Zilin Lu, Jianxiong Hu, Pengjun Zeng

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2019

Thermal Conductivity Investigation of Phosphor/Silicone Composites

Jianxiong Hu, Fulong Zhu, Yongjun Pan, Zilin Lu, Yixin Xu, Pengjun Zeng

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2019

A molecular dynamic study of nano-grinding of a monocrystalline copper-silicon substrate

Yixin Xu, Miaocao Wang, Fulong Zhu, Xiaojian Liu, Qian Chen, Jianxiong Hu, Zilin Lu, Pengjun Zeng, Yuhong Liu

Applied Surface Science

DOI

2019

Study on subsurface damage of wafer silicon containing through silicon via in thinning

Yixin Xu, Miaocao Wang, Fulong Zhu, Xiaojian Liu, Yuhong Liu, Liping He

The European Physical Journal Plus

DOI

2019

An accurate method to calibrate shadow moiré measurement sensitivity

Wei Zhang, Fulong Zhu, Shenghuai Wang, Pengyan Lu, Xin Wu

Measurement Science and Technology

DOI

2018

Comparison of ultrasonic wire bonding process between gold and copper by nonlinear structure analysis

Yongjun Pan, Fulong Zhu, Xinxin Lin, Jiajie Fan, Sheng Liu

Journal of Adhesion Science and Technology

DOI

2018

Investigation of Nanocutting Characteristics of Off-Axis 4H-SiC Substrate by Molecular Dynamics

Miaocao Wang, Fulong Zhu, Yixin Xu, Sheng Liu

Applied Sciences

DOI

2018

Molecular Dynamics Simulation on Grinding Process of Cu-Si and Cu-SiO2 Composite Structures

Yixin Xu, Fulong Zhu, Miaocao Wang, Xiaojian Liu, Sheng Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2018

Investigation of the differences in nanometric grinding of SiC and Si by molecular dynamics

Miaocao Wang, Fulong Zhu, Yixin Xu, Sheng Liu

International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

DOI

2018

Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique

Fulong Zhu, Xinxin Lin, Wei Zhang, Jiajie Fan, Sheng Liu

IEEE Access

DOI

2017

Investigation of Thermal Properties of Ni-Coated Graphene Nanoribbons Based on Molecular Dynamics Methods

Fulong Zhu, Yan Kan, Kai Tang, Sheng Liu

Journal of Electronic Materials

DOI

2017

Investigation of machining mechanism of monocrystalline silicon in nanometric grinding

Liping He, Fulong Zhu, Yuhong Liu, Sheng Liu

AIP Advances

DOI

2017

Effects of Chirality and Position of Graphene on the Bending Properties of Graphene-Embedded Copper Nanocomposites

Fulong Zhu, Ke Duan, Liping He, Kai Tang, Ying Li, Sheng Liu

Journal of Nanoscience and Nanotechnology

DOI

2016

Ultrasonic power measurement system based on acousto-optic interaction

Liping He, Fulong Zhu, Yanming Chen, Ke Duan, Xinxin Lin, Yongjun Pan, Jiaquan Tao

Review of Scientific Instruments

DOI

2016

Effects of chirality and number of graphene layers on the mechanical properties of graphene-embedded copper nanocomposites

Ke Duan, Fulong Zhu, Kai Tang, Liping He, Yanming Chen, Sheng Liu

Computational Materials Science

DOI

2015

Estimation of homogenized Young’s modulus of silicone/phosphor composite considering random dispersion and size variation of phosphor particles

Simin Wang, Xing Chen, Sheng Liu, Fulong Zhu, Xiaogang Liu

Journal of Composite Materials

DOI

2015

Molecular Dynamics Study on the Effect of Temperature on the Tensile Properties of Single‐Walled Carbon Nanotubes with a Ni‐Coating

Fulong Zhu, Hengyou Liao, Kai Tang, Youkai Chen, Sheng Liu

Journal of Nanomaterials

DOI

2014

Contact resistance investigation of electrical connector with different shrink range

Ke Duan, Fulong Zhu, Ying Li, Kai Tang, Sheng Liu, Yanming Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

Effect of defects on thermal conductivity of graphene

Kai Tang, Fulong Zhu, Ying Li, Ke Duan, Sheng Liu, Yanming Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

Warpage analysis of DBC substrate based on non-contact shadow moiré technology

Ke Duan, Fulong Zhu, Mingxiang Chen, Ying Li, Kai Tang, Sheng Liu, Yanming Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

An adjustable sensitivity shadow moiré technique for surface morphology measurement

Wei Zhang, Fulong Zhu, Honghai Zhang, Sheng Liu

Journal of Modern Optics

DOI

2013

Effect of vacancy defects on thermal conductivity of single-walled carbon nanotubes

Kai Tang, Fulong Zhu, Youkai Chen, Ying Li, Hengyou Liao, Xiahui Chen, Sheng Liu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2013

Mechanical behavior investigation of single-walled carbon nanotubes with one vacancy

Youkai Chen, Fulong Zhu, Kai Tang, Ying Li, Hengyou Liao, Sheng Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2012

Compressing deformation investigation of single-walled carbon nanotube coated with Ni

Youkai Chen, Fulong Zhu, Hengyou Liao, Wei Zhang, Sheng Liu

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2012

The effect of temperature on compressive mechanical behavior of SWCNT-Ni

Youkai Chen, Fulong Zhu, Hengyou Liao, Shao Song, Sheng Liu

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2012

Warpage measurement of silicon wafers of various bonding areas

Wei Zhang, Fulong Zhu, Yiquan Dai, Hengyou Liao, Shao Song, Honghai Zhang, Sheng Liu

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2012

Torsion behavior simulation of Ni-coating SWCNT based on molecular dynamics

Hengyou Liao, Fulong Zhu, Wei Zhang, Youkai Chen, Shao Song, Sheng Liu

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2012

Tensile behaviors investigation of SWCNT-Ni with vacancies

Hengyou Liao, Fulong Zhu, Wei Zhang, Youkai Chen, Shao Song, Sheng Liu

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2011

Warpage measurement of various substrates based on white light shadow moiré technology

Shao Song, Fulong Zhu, Wei Zhang, Sheng Liu

International Microsystems, Packaging, Assembly and Circuits Technology Conference

DOI

2011

Notice of Retraction: 3-D warpage measurement of silicon wafer

Wei Zhang, Fulong Zhu, Shao Song, Honghai Zhang, Sheng Liu, Chuanqion Sun

International Conference on Artificial Intelligence, Management Science and Electronic Commerce

DOI

2011

Expert advisor for integrated virtual manufacturing and reliability for TSV/SiP based modules

Zhaohui Chen, Shengjun Zhou, Zhicheng Lv, Chuan Liu, Xing Chen, Xiao Jia, Ke Zeng, Bin Song, Fulong Zhu, Mingxiang Chen, Xuefang Wang, Honghai Zhang, Sheng Liu

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2010

Creep behavior investigation of lead-free solder alloy Sn96.5Ag3Cu0.5

Fulong Zhu, Shao Song, Wei Zhang, Sheng Liu

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2008

Mechanical properties investigation of PMMA, PC, and PS during thermal nanoimprinting

Dan Xie, Honghai Zhang, Sheng Liu, Fulong Zhu, Tao Sheng

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

DOI

2007

基于工艺力学的MEMS封装若干基础问题研究

朱福龙

《华中科技大学》

2006

微陀螺仪的真空回流封装工艺研究

刘文明，王志勇，鲍剑斌，汪学方，关荣峰，朱福龙，刘胜

《微细加工技术》

2006

The effect of temperature and strain rate on the tensile properties of a Sn99.3Cu0.7(Ni) lead-free solder alloy

Fulong Zhu, Honghai Zhang, Rongfeng Guan, Sheng Liu

Microelectronic Engineering

DOI

2006

Effects of temperature and strain rate on mechanical property of Sn96.5Ag3Cu0.5

Fulong Zhu, Honghai Zhang, Rongfeng Guan, Sheng Liu

Journal of Alloys and Compounds

DOI

2006

Investigation of Temperature and Strain Rate Behavior of Lead-free Solder Sn96.5Ag3.5

Fulong Zhu, H.H. Zhang, Ruolin Guan, Shaobo Liu, Y.b. Yang

International Symposium on the Physical and Failure Analysis of Integrated Circuits

DOI

2006

Investigation of microstructures and tensile properties of a Sn-Cu lead-free solder alloy

Fulong Zhu, Honghai Zhang, Rongfeng Guan, Sheng Liu

Journal of Materials Science Materials in Electronics

DOI

2005

微型柔性剪切应力传感器的制作研究

陈四海，汪殿民，朱福龙，徐涌，易新建

《传感器与微系统》

2005

Mechanical properties of a lead-free solder alloys

Fulong Zhu, Zhiyong Wang, Rongfeng Guan, Honghai Zhang

DOI

精选作品

期刊论文

Investigation of the interfacial thermal resistance of Cu/Ta heterostructure in the through glass via wafer

Phonon coupling governed interfacial thermal resistance in twisted GaN homojunctions at different temperatures

Temperature-Dependent Interfacial Thermal Resistance of GaN/AlN Heterostructures: Role of Ga/N Vacancy in the Near-Interface Region

Electromigration-Induced Atomic and Stress Evolution in Copper Strips

Study on the Shear Mechanical Properties and Deformation Mechanisms of Cu/Ta Bilayer with the Tilted Interface

Mechanism of angle-dependent thermal resistance at GaN/GaN interfaces

A Multiscale Simulation Study on the Effects of Filler Coating on the Performance of Electrically Conductive Adhesive

Electromigration-Induced Failure in Rough TGV With Tilted Angle Sidewalls

Region-adaptive DIC with variable speckle parameters for accurate warpage measurement in electronic packaging structures

Investigation on the Service Performance of Polycrystalline Cu-Filled TGV Under Thermal Cycling

Reflectivity-guided adaptive projection speckle DIC for HDR surface measurement

Dependence of shear behavior and interface evolution on modulation period of Cu/Ta nanofilms

Optical MEMS die-attach warpage analysis and mitigation via thermoelastic modeling and in-situ micro-Raman spectroscopy characterization

Study on Microstructural Evolution Mechanisms of Amorphous $\text{SiO}_{2}$ in Through Glass via Wafer During Thinning

A high-accuracy and robust defect detection method for electronic packaging based on Infrared-visible image fusion

Investigation of the thinning mechanisms of Cu/Ti heterostructure in the through glass via wafer

In-situ Measurement Method for Warpage of Electronic Package Substrate Based on Speckle-free DIC and Carbon Coating

The Impact of Rough Interfaces and Tilt Angles on Thermal Cycling Reliability of Through Glass Via

Brittle fracture control of 4H-SiC via laser-textured surfaces: Combined experimental and atomistic study

Underlying Thinning Mechanisms of Cu/Amorphous SiO2 Heterostructure in Through Glass Via Wafer from an Atomic Perspective

Effect of tilted wall in through glass via on the electrochemical deposition process

Correction of thermal airflow induced measurement errors in the digital fringe projection system using background-oriented Schlieren technique

Investigation of shear responses and underlying deformation mechanisms of Cu/Ta nanolayered composite

Electrical contact reliability investigation of high-speed electrical connectors under fretting wear behavior

Study on Mechanical Failure Forms of Copper/Tantalum Contact Interface in Through Silicon Via

Atomic-scale insights into the microstructure and interface evolution mechanism of copper/tantalum nanofilms during ultra-precision grinding

Investigation on Electrical and Thermal Performance of Electrical Connectors Under Rough Surface Contact

Correction of thermal airflow distortion in warpage measurements of microelectronic packaging structures via deep learning-based digital image correlation

Atomistic simulations of the thinning process of tantalum/copper heterostructure in wafer containing through silicon via

Investigation of the tribological behaviors for 4H–SiC substrate under different lubrication conditions

Design and Fabrication of Piezoresistive Pressure Sensor for Automotive Application

Optimized structure to suppress freezing damage in piezoresistive automotive pressure sensors

Shear response and deformation mechanism of boron nitride nanosheets reinforced aluminum matrix composites

Changing torque-force synchronization condition for abrasive particle improves material removal during silicon carbide abrasive machining

In Situ Warpage Measurement of Electronic Packages With Projected Speckle DIC and Deep Learning-Based ROI Identification

Effects of oxidizer concentration and abrasive type on interfacial bonding and material removal in 4H-SiC polishing processes

A full-field warpage characterization measurement method coupled with infrared information

Sn-enhanced high-temperature reliability of Cu/Nano-Ag/Cu joint via transient-liquid-phase bonding

The Effect of Filler Mass Fraction on The Physical Properties of Conductive Silver Adhesives

The Effect of Cu/SiO2 Rough Interface on TSV Electroplating Process for Electronic Packaging

Evolution of Nano-notches on the Surface of SiC with Different Crystal Forms during Cutting in the Water Environment

Investigation of the chemical action mechanism based on reactive force field in SiC chemical–mechanical polishing process

High reliability of piezoresistive pressure sensors by wafer to wafer direct bonding at room temperature

The effects of abrasive moving speed and motion mode on the thinning mechanism of SiC in three-body contact

Atomic scale investigation of notch evolution on 4H-SiC under different cutting surfaces and environments

Role of Cu/SiO2 Rough Interface in TSV for High-Power Device Under Electromigration

Specular surface deformation measurement based on projected-speckle deflectometry with digital image correlation

Rough Interface Effect on High-Temperature Reliability of TSV for Electronic Packaging

Optimized super-resolution promote accuracy for projection speckle three-dimensional digital image correlation

Femtosecond laser surface modification coupling with surface metallurgical reaction promotes surface plasticity of SiC

Understanding of the effect of wear particles removal from the surface on grinding silicon carbide by molecular dynamics simulations

Achieving excellent thermal stability in continuous three-dimensional graphene network reinforced copper matrix composites

Understanding the role of surface mechanical properties in SiC surface machining

Fabrication and Sintering Behavior of Nano Cu–Ag Composite Paste for High-Power Device

Polishing process of 4H-SiC under different pressures in a water environment

Porosity effect on the mechanical properties of nano-silver solder

Design and Optimization of a Novel MEMS Tuning Fork Gyroscope Microstructure

Porosity Dependence of Thermal and Electrical Properties in Nano-Silver Paste

A non-destructive inspection method for electronic packaging reliability incorporating mechanical and thermal information

The Effect of Porosity on Thermal Properties of Nano-Silver Solder for Electronic Packaging

The effect of BNNS distribution on the plastic deformation of BNNS/ Al composites during the nanoindentation

Effect of water film on 4H-SiC nano-indentation process

Evolution and influence of GaN/AlN heterointerface during the thinning process of GaN film

Role of boron nitride nanosheet coatings on aluminum substrates during the nanoindentation from the atomic perspective

Materials removal mechanism and multi modes feature for silicon carbide during scratching

Effect of impurity doping on 4H-SiC planarization

Effect of water film on the nano-scratching process of 4H-SiC under the constant load

Molecular Dynamics Study of Compressive Properties and Atomistic Behavior of Boron Nitride Nanosheets Reinforced in Aluminum Matrix Composites

The effect of contact types on SiC polishing process

Study on the influence of fretting wear on electrical performance of SMA connector

Deformation mechanism of copper reinforced by three-dimensional graphene under torsion and tension

Molecular dynamics study of BNNS/Al composites under compression

Mechanical Response of BNNS-reinforced Aluminum Composites under Uniaxial Compression

Effect of inclusion on 4H-SiC during nano-scratching from an atomistic perspective

Removal behavior of micropipe in 4H-SiC during micromachining

Investigation Regarding the Influence of Contact Condition on the Thermal Contact Resistance Between Copper and Indium

Accuracy optimization method of ultrasonic power measurement system based on acousto-optic effect

Investigation of the Turbulent Drag Reduction Mechanism of a Kind of Microstructure on Riblet Surface