陈佳鹏｜上海工程技术大学｜学者主页

2026

基于分子动力学的离子注入辅助磨削4H-SiC机理研究

吴毅博，吴淑晶，王大中，陈佳鹏，宋宜润，姜峰

《中国表面工程》

2026

Traditional and Energy-Field-Assisted Methods for Chemical Mechanical Polishing of Silicon Carbide: Mechanisms and Processability

Yibo Wu, Shu-Jing Wu, Da-Zhong Wang, Yirun Song, Jiapeng Chen, Jian-Bao Wu, T. Akiyama

International Journal of Precision Engineering and Manufacturing

DOI

2026

Influences of Polishing Slurry Components on Material Removal and Surface Morphology of 4H-SiC C-Face Based on Fenton Reaction CMP

Ying Liang Wei, Ruhao Meng, Yongqi Huang, Guoyan Huo, Haitao Wu, Jiapeng Chen, Guizhong Guo, Yanan Peng, Nannan Zhu, Jianxiu Su

Crystals

DOI

2026

Force-induced photocatalytic abrasive in-situ photochemical mechanical polishing 4H-SiC wafers

Yongchi Qi, Jiapeng Chen, Yanan Peng, Zhenlin Jiang, Xue Li, Shusheng Xu, Jianxiu Su

Journal of Alloys and Compounds

DOI

2026

A novel sphere-like diamond abrasive for quartz substrate polishing

Wenkun Lin, Jiapeng Chen, Yanan Peng, Jianxiu Su

Diamond and Related Materials

DOI

2026

Influence of preparation process on force-induced photocatalytic abrasive microstructure

Yongchi Qi, Jiapeng Chen, Yanan Peng, Zhenlin Jiang, Xue Li, Shusheng Xu, Jianxiu Su

Tribology International

DOI

2026

Influences of Solvent and Abrasive in Polishing Slurry on Material Removal, Surface Roughness, and Acoustic Emission Signal of 4H-SiC Si-Face in Chemical Mechanical Polishing

Kerong Wang, Jiapeng Chen, Yanan Peng, Bing Liu, Guizhong Guo, Nannan Zhu, Jianxiu Su

Journal of Materials Engineering and Performance

DOI

2026

A 3D-Printed Compliant Polishing Tool for High-Efficiency Finishing of P20 Mold Steel

Kerong Wang, X.Q. Liu, Mingyu Zhu, Changfei Tang, Jianxiu Su, Jiapeng Chen, Yongwei Zhu

Materials

DOI

2026

Effect of oxidants in non-aqueous polishing slurries on fixed abrasive polishing of 4H-silicon carbide (4H-SiC) substrates

Tianyu Zhang, Anjie He, Jiapeng Chen, Tao Sun

Materials Science in Semiconductor Processing

DOI

2026

Force-induced electrocatalytic abrasives in-situ electrochemical mechanical polishing 4H–SiC wafers

Xueju Zhang, Jiapeng Chen, Yanan Peng, Zhenlin Jiang, Baoxiu Wang, Xue Li, Shusheng Xu, Jianxiu Su

Journal of Materials Research and Technology

DOI

2026

Lapping of Soft-Brittle Lithium Niobate Crystal with Fixed Abrasive Pad

Nannan Zhu, Xiaojun Gao, Chao Tang, Jiapeng Chen, Yongwei Zhu

Materials

DOI

2026

Influence of Ferric Chloride–Oxalic Acid Polishing Slurry on the Chemical Mechanical Polishing of 304 Stainless Steel

Nannan Zhu, Kerong Wang, Bing Liu, Jiejing Li, Jianxiu Su, Yongwei Zhu, Jiapeng Chen

Metals

DOI

2026

Categorization of acoustic emission signals in fixed abrasive chemical mechanical lapping based on frequency band features

Jiapeng Chen, Kerong Wang, Yanan Peng, Xue Li, Shusheng Xu, Jianxiu Su

Results in Engineering

DOI

2026

Influences of pH environment on abrasive features and performance in chemical mechanical polishing Si-faces of SiC substrates

Ying Wei, Ruhao Meng, Ke Fang Dai, Guoyan Huo, Haitao Wu, Bing Liu, Wenbo Bie, Jianxiu Su, Yanan Peng, Jiapeng Chen

The International Journal of Advanced Manufacturing Technology

DOI

2026

Grinding performance of the improved body-armor-like wheel during high-shear and low-pressure grinding for Inconel 718

Bing Liu, Yebing Tian, Guizhong Guo, Lei Zhang, Zhankui Wang, Ning Zhou, Xiaojie Suo, Jiapeng Chen, Yanan Peng, Zihan Gao, Jianxiu Su

Journal of Materials Research and Technology

DOI

2025

Effect mechanism of diamond content on tribo-chemical processing of sapphire wafers using developed clusters of diamond and ceria chemically agglomerated abrasive cluster

Zhankui Wang, Shangci Huang, Kuncheng Liu, Zhicheng Zhao, YiHang Fan, Jiapeng Chen, Yunlong Yao, Minghua Pang, Lijie Ma, Jianxiu Su

Ceramics International

DOI

2025

Influence of colloidal silica properties on chemical mechanical polishing of zirconia ceramics

Wenkun Lin, Yuxuan Qi, Xueju Zhang, Yunyun Gu, Yue Wang, Hongwei Qian, Hui Luo, Jiapeng Chen

Ceramics International

DOI

2024

Simulation of chemical reactions with methanol and oxalic acid on 4H-SiC surfaces before and after nanoabrasion

Wei Jiang, Jiapeng Chen, Xiongjie Wu, Lin Wu, Jiangfan Yi, Zhenlin Jiang, Baoxiu Wang, Wenjun Wang, Ying Wei, Tao Sun

Applied Surface Science

DOI

2024

Application of the Fenton reaction in silicon carbide polishing and its oxidative active center

Xiaodong Hao, Jiapeng Chen, Xiongjie Wu, Lin Jie, Anjie He, Zhenlin Jiang, Wenjun Wang, Baoxiu Wang, Tao Sun

Ceramics International

DOI

2024

Effect of Oxidant Concentration on the Oxide Layer Thickness of 304 Stainless Steel

Kerong Wang, Haixu Liu, Ning Liu, Xiaoming Chen, Jiapeng Chen

Materials

DOI

2024

Effect of Secondary Foaming on the Structural Properties of Polyurethane Polishing Pad

Minxuan Chen, Zhenlin Jiang, Min Zhu, Baoxiu Wang, Jiapeng Chen, Wenjun Wang

Materials

DOI

2024

In-situ reconditioning mechanism for fixed abrasive pads based on the wear behavior of loose grains

Jiapeng Chen, Yanan Peng, Zhankui Wang, Zhenlin Jiang, Baoxiu Wang, Wenjun Wang, Fan Chen, Tao Sun

Precision Engineering

DOI

2023

三氯化铁-草酸体系不锈钢化学机械抛光液设计与优化

王泽宇，彭亚男，苏建修，陈佳鹏

《金刚石与磨料磨具工程》

2023

ReaxFF molecular dynamics simulation and experimental validation about chemical reactions of water and alcohols on SiC surface

Haibo Chen, Jiapeng Chen, Jiapeng Chen, Jiexiong Wu, Juanfen Shen, Yunyun Gu, Tao Sun

Ceramics International

DOI

2023

Influence of Fenton-like reactions between hydrogen peroxide and ferric chloride on chemical mechanical polishing 304 stainless steel

Jiapeng Chen, Yanan Peng, Zhankui Wang, Fenggang Lv

The International Journal of Advanced Manufacturing Technology

DOI

2023

Influences of Nonaqueous Slurry Components on Polishing 4H-SiC Substrate with a Fixed Abrasive Pad

Jiyuan Zhong, Jiapeng Chen, Hanqiang Wang, Haibo Chen, Yunyun Gu, Juanfen Shen, Tao Sun

Crystals

DOI

2023

Super hard and brittle material removal mechanism in fixed abrasive lapping: Theory and modeling

Jiapeng Chen, Yanan Peng

Tribology International

DOI

2022

Mechanistic difference between Si-face and C-face polishing of 4H–SiC substrates in aqueous and non-aqueous slurries

Juanfen Shen, Haibo Chen, Jiapeng Chen, Lin Lin, Yunyun Gu, Zhenlin Jiang, Jun Li, Tao Sun

Ceramics International

DOI

2022

An interactive water lubrication mechanism of γ-LiAlSi2O6 glass-ceramics in friction and wear

Yanan Peng, Zeyu Wang, Yuantao Fu, Xiaoqin Zhang, Jiapeng Chen

Wear

DOI

2022

In-situ manifestation of lapping mechanisms by rapid intelligent pattern recognition analysis (RIPRA) of acoustic emission via a point density fuzzy C-means (PD-FCM) method

Jiapeng Chen, Jun Li, Yanan Peng, Zhankui Wang, Tao Sun, Yongwei Zhu

Journal of Manufacturing Processes

DOI

2022

Tribological effects of loose alumina abrasive assisted sapphire lapping by a fixed agglomerated diamond abrasive pad (FADAP)

Jiapeng Chen, Yanan Peng, Zhankui Wang, Tao Sun, Jianxiu Su, Dunwen Zuo, Yongwei Zhu

Materials Science in Semiconductor Processing

DOI

2021

Single crystal silicon wafer polishing by pretreating pad adsorbing SiO2 grains and abrasive-free slurries

Zhengzheng Bu, Fengli Niu, Jiapeng Chen, Zhenlin Jiang, Wenjun Wang, Xuehan Wang, Hanqiang Wang, Zefang Zhang, Yongwei Zhu, Tao Sun

Materials Science in Semiconductor Processing

DOI

2021

High efficiency polishing of silicon carbide by applying reactive non-aqueous fluids to fixed abrasive pads

Hanqiang Wang, Fengli Niu, Jiapeng Chen, Zhenlin Jiang, Wenjun Wang, Zhengzheng Bu, Xuehan Wang, Jun Li, Yongwei Zhu, Tao Sun

Ceramics International

DOI

2021

Accelerated C-face polishing of silicon carbide by alkaline polishing slurries with Fe3O4 catalysts

Xuehan Wang, Jiapeng Chen, Zhengzheng Bu, Hanqiang Wang, Wenjun Wang, Weimin Li, Tao Sun

Journal of environmental chemical engineering

DOI

2020

固结磨料高效稳定研磨蓝宝石的机理及关键技术研究

陈佳鹏

《南京航空航天大学》

2017

固结金刚石聚集体磨料垫高效研磨氧化锆陶瓷背板

王子琨，凌顺志，黄道万，陈佳鹏，李军，朱永伟

《金刚石与磨料磨具工程》

2016

用碱性抛光液化学机械抛光304不锈钢片研究

陈佳鹏，陈绍坤，李庆，秦洪权，苏建修

《金刚石与磨料磨具工程》

2016

化学机械抛光超薄SUS304不锈钢抛光液研究

秦洪权，王永胜，李庆，陈佳鹏，刘振辉，苏建修

《金刚石与磨料磨具工程》

2016

超薄304不锈钢片Roll-to-Roll化学机械抛光液研究

陈佳鹏

《河南科技学院》

精选作品

期刊论文

基于分子动力学的离子注入辅助磨削4H-SiC机理研究

Traditional and Energy-Field-Assisted Methods for Chemical Mechanical Polishing of Silicon Carbide: Mechanisms and Processability

Influences of Polishing Slurry Components on Material Removal and Surface Morphology of 4H-SiC C-Face Based on Fenton Reaction CMP

Force-induced photocatalytic abrasive in-situ photochemical mechanical polishing 4H-SiC wafers

A novel sphere-like diamond abrasive for quartz substrate polishing

Influence of preparation process on force-induced photocatalytic abrasive microstructure

Influences of Solvent and Abrasive in Polishing Slurry on Material Removal, Surface Roughness, and Acoustic Emission Signal of 4H-SiC Si-Face in Chemical Mechanical Polishing

A 3D-Printed Compliant Polishing Tool for High-Efficiency Finishing of P20 Mold Steel

Effect of oxidants in non-aqueous polishing slurries on fixed abrasive polishing of 4H-silicon carbide (4H-SiC) substrates

Force-induced electrocatalytic abrasives in-situ electrochemical mechanical polishing 4H–SiC wafers

Lapping of Soft-Brittle Lithium Niobate Crystal with Fixed Abrasive Pad

Influence of Ferric Chloride–Oxalic Acid Polishing Slurry on the Chemical Mechanical Polishing of 304 Stainless Steel

Categorization of acoustic emission signals in fixed abrasive chemical mechanical lapping based on frequency band features

Influences of pH environment on abrasive features and performance in chemical mechanical polishing Si-faces of SiC substrates

Grinding performance of the improved body-armor-like wheel during high-shear and low-pressure grinding for Inconel 718

Effect mechanism of diamond content on tribo-chemical processing of sapphire wafers using developed clusters of diamond and ceria chemically agglomerated abrasive cluster

Influence of colloidal silica properties on chemical mechanical polishing of zirconia ceramics

Simulation of chemical reactions with methanol and oxalic acid on 4H-SiC surfaces before and after nanoabrasion

Application of the Fenton reaction in silicon carbide polishing and its oxidative active center

Effect of Oxidant Concentration on the Oxide Layer Thickness of 304 Stainless Steel

Effect of Secondary Foaming on the Structural Properties of Polyurethane Polishing Pad

In-situ reconditioning mechanism for fixed abrasive pads based on the wear behavior of loose grains

三氯化铁-草酸体系不锈钢化学机械抛光液设计与优化

ReaxFF molecular dynamics simulation and experimental validation about chemical reactions of water and alcohols on SiC surface

Influence of Fenton-like reactions between hydrogen peroxide and ferric chloride on chemical mechanical polishing 304 stainless steel

Influences of Nonaqueous Slurry Components on Polishing 4H-SiC Substrate with a Fixed Abrasive Pad

Super hard and brittle material removal mechanism in fixed abrasive lapping: Theory and modeling

Mechanistic difference between Si-face and C-face polishing of 4H–SiC substrates in aqueous and non-aqueous slurries

An interactive water lubrication mechanism of γ-LiAlSi2O6 glass-ceramics in friction and wear

In-situ manifestation of lapping mechanisms by rapid intelligent pattern recognition analysis (RIPRA) of acoustic emission via a point density fuzzy C-means (PD-FCM) method

Tribological effects of loose alumina abrasive assisted sapphire lapping by a fixed agglomerated diamond abrasive pad (FADAP)

Single crystal silicon wafer polishing by pretreating pad adsorbing SiO2 grains and abrasive-free slurries

High efficiency polishing of silicon carbide by applying reactive non-aqueous fluids to fixed abrasive pads

Accelerated C-face polishing of silicon carbide by alkaline polishing slurries with Fe3O4 catalysts

固结磨料高效稳定研磨蓝宝石的机理及关键技术研究

固结金刚石聚集体磨料垫高效研磨氧化锆陶瓷背板

用碱性抛光液化学机械抛光304不锈钢片研究

化学机械抛光超薄SUS304不锈钢抛光液研究

超薄304不锈钢片Roll-to-Roll化学机械抛光液研究

预印本

Probing the Two-Step Scratching of Silicon Carbide Atomic Layers via Molecular Dynamics: The Roles of Mechanical Pre-Damage and Chemical Reactions

Influence of Binding Agent on the Cutting Performance and Wear Characteristics of Catalytic Composite Abrasive Cluster

研究方向