陈志文｜武汉大学｜学者主页

期刊论文

2026

基于混合式教学的微组装技术与力学综合课程改革实践

苏昱太，辛莉峰，刘俐，陈志文

《高教学刊》

DOI

2026

Nitrogen Plasma Activation of SiO2 Surface for Low-Temperature Wafer-to-Wafer Bonding: Experiments and Multiscale Simulations

Yaning Lin, Shangyu Lv, Xiangyang Shi, Rong Zeng, Xiaodan Li, Zhiwen Chen

Langmuir

DOI

2026

Impact of Source Lead Structure and Material on Electro-Thermal-Mechanical Performance and Electromigration Reliability of TO-247-4 Packaged SiC MOSFETs

Chuang Yan, Jiaju Zhang, Haoze Luo, Bin Yu, Zhiwen Chen, Sheng Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Morphology and Wettability Evolution of Laser-Induced Carbon Residues during UV Laser Debonding

Yuan Yuan, Guoliang Xie, Qiunan Shi, Chenghao Ma, Zhiwen Chen, Li Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

On standardization of MEMS packaging and testing

Le Zhao, Genzi Li, Weihu Zhou, Yi Tang, Jianhong Yang, Zhiwen Chen, Kanghua Pan, Zhe Li, Jinxi Zhang, Liguo CHEN, Gaowei Xu, Zhihua Li

DOI

2024

基于VCCT理论的芯片多顶针剥离工艺参数优化

刘俐，杜松，张春华，刘胜，张适，陈志文

《电子元件与材料》

2023

Challenges and prospects for advanced packaging

Zhiwen Chen, Jia-Ju Zhang, Shi-Zhao Wang, C. Wong

Fundamental Research

DOI

2023

Low-temperature joining of alumina ceramic and nickel by Al-Ni self-propagating nanofoil

Zhenyu Liu, Shengfa Liu, Shengfa Liu, Shengfa Liu, Zhiying Zhang, Zhiwen Chen, Zhen Wang, Li Liu

Ceramics International

DOI

2023

Effects of dishing and annealing temperature on wafer to wafer hybrid bonding

Yu Li, Meng Ruan, Li Liu, Zhiwen Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by Finite Element Analysis

Xingwang Hu, Li Liu, Sheng Liu, Meng Ruan, Zhiwen Chen

Micromachines

DOI

2022

Creep behavior of intermetallic compounds at elevated temperatures and its effect on fatigue life evaluation of Cu pillar bumps

Zhiwen Chen, Fan Yang, Sheng Liu, Xingwang Hu, Changqing Liu, Zhaoxia Zhou, Zhengzhi Wang, Stuart Robertson, Li mei Liu

Intermetallics

DOI

2021

电子封装可靠性:过去、现在及未来

陈志文，梅云辉，刘胜，李辉，刘俐，雷翔，周颖，高翔

《机械工程学报》

2020

Hybrid FEM-ANN-PSO Method To Optimize The Structural Parameters Of Wafer-Level Chip Scale Package (WLCSP) For High Reliability

Zhao Zhang, Zhiwen Chen, Sheng Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2018

Rapid Transient Liquid Phase Sintering by Ag-In Solder Pastes for High-temperature Power Electronics

Dongxiao Zhang, Shengfa Liu, Zhiwen Chen, Li Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2018

Diffusion barrier properties of electroless Ni-Fe-P coatings in Zn-5Al solder joints

Han Zhang, Zhiwen Chen, Juan Pengv, Li Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

预印本

2026

Unveiling the Mechanism of Nitrogen Plasma Activated Dielectric Oxides for Low Temperature Wafer-to-Wafer Bonding

Yaning Lin, Shangyu Lv, Xiangyang Shi, Rong Zeng, Xiaodan Li, Zhiwen Chen

SSRN Electronic Journal

DOI

2024

Low Temperature Sintering Mechanism of Mod Assisted Ag Paste for Power Electronics: Experiment and Molecular Dynamic Study

Li Liu, Ma Haojie, Chuantong Chen, Zixuan Xu, Nong Liting, Yiwen Zou, Xiyu Xu, Xuanguo Wang, Zhiwen Chen

SSRN Electronic Journal

DOI

陈志文

精选作品

期刊论文

基于混合式教学的微组装技术与力学综合课程改革实践

Nitrogen Plasma Activation of SiO2 Surface for Low-Temperature Wafer-to-Wafer Bonding: Experiments and Multiscale Simulations

Impact of Source Lead Structure and Material on Electro-Thermal-Mechanical Performance and Electromigration Reliability of TO-247-4 Packaged SiC MOSFETs

Morphology and Wettability Evolution of Laser-Induced Carbon Residues during UV Laser Debonding

On standardization of MEMS packaging and testing

基于VCCT理论的芯片多顶针剥离工艺参数优化

Challenges and prospects for advanced packaging

Low-temperature joining of alumina ceramic and nickel by Al-Ni self-propagating nanofoil

Effects of dishing and annealing temperature on wafer to wafer hybrid bonding

Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by Finite Element Analysis

Creep behavior of intermetallic compounds at elevated temperatures and its effect on fatigue life evaluation of Cu pillar bumps

电子封装可靠性:过去、现在及未来

Hybrid FEM-ANN-PSO Method To Optimize The Structural Parameters Of Wafer-Level Chip Scale Package (WLCSP) For High Reliability

Rapid Transient Liquid Phase Sintering by Ag-In Solder Pastes for High-temperature Power Electronics

Diffusion barrier properties of electroless Ni-Fe-P coatings in Zn-5Al solder joints

预印本

Unveiling the Mechanism of Nitrogen Plasma Activated Dielectric Oxides for Low Temperature Wafer-to-Wafer Bonding

Low Temperature Sintering Mechanism of Mod Assisted Ag Paste for Power Electronics: Experiment and Molecular Dynamic Study

研究方向