陈继兵｜武汉轻工大学｜学者主页

2026

Thermal/Mechanical Characteristics Simulation Analysis of Solder Layer Damage in IGBT Modules

Jianbo Zhou, Jibing Chen, Liang Ming He, Hui Tang, Xiaohu Wu

Micromachines

DOI

2026

Synergistic Effect of High Strength‐Grain Refinement and Suppression of Al 6 Fe Phase Coarsening in Additively Manufactured Al‐Fe‐Sc‐Zr Alloys via Mg Addition

Xinyu Du, Jibing Chen, Yanfeng Liu, Yue-ting Wang, Ruidi Li, Liang He, Hongze Wang

Rare Metals

DOI

2026

Synergistic effect of crystallographic orientation and porosity: multi-mode corrosion mechanism of additive manufacturing Al-Fe-Mn-Sc-Zr alloy

Yanfeng Liu, Jibing Chen, Xinyu Du, Yue Wang, Ruidi Li, Liang He, Hongze Wang

Virtual and Physical Prototyping

DOI

2026

High-temperature fatigue strength behavior of titanium alloys by laser powder bed additive manufacturing

Jianbo Zhou, Jibing Chen, Hongze Wang, Ruidi Li, Sasan Dadbakhsh, Liang He

Progress in Materials Science

DOI

2026

Additively Manufactured of Aluminum Alloy: Processes, Properties, and Applications

Yuankun Pei, Liang He, Jibing Chen

Machines

DOI

2025

激光粉末床熔化制备耐热Al-Fe-Mn合金的显微组织和高温性能（英文）

陈俊升，陈继兵，石倩玉，王悦婷，夏熙珍，李瑞迪

Transactions of Nonferrous Metals Society of China

2025

A review of development and applications of SiC power devices in packaging and interconnect technology

Jibing Chen, Yanfeng Liu, Junsheng Yang, Liang Ming He, Hui Tang, Xin Li

Soldering and Surface Mount Technology

DOI

2025

Structure and Temperature Dependence of Solder Layer and Electric Parameters in IGBT Modules

Jibing Chen, Yanfeng Liu, Bowen Liu, Yiping Wu

Micromachines

DOI

2025

Study on microstructure and mechanical properties for L-PBF iron matrix composites reinforced by epoxy resin

Yong She, Jibing Chen, Yanfeng Liu, Xinyu Du, Yang Yang

Journal of Reinforced Plastics and Composites

DOI

2024

Simulation and Assessment of Thermal-Stress Analysis of Welding Materials in IGBT

Yang Yang, Jibing Chen, Bowen Liu, Yiping Wu

Micromachines

DOI

2024

Additively manufactured fine-grained Al–Fe–Cu-Sc-Zr alloy with resistance to brittleness under high temperature

Qianyu Shi, Jibing Chen, Jibing Chen, Junsheng Chen, Junsheng Chen, Yueting Wang, Xizhen Xia, Ruidi Li

Journal of Materials Research and Technology

DOI

2024

Restraint of intermetallic compound and improvement of mechanical performance of Ti/Al dissimilar alloy by rotary friction welding based on laser powder bed fusion

Maohui Hu, Shengxing Zhi, Jibing Chen, Ruidi Li, Bowen Liu, Liang He, Huihui Yang, Hongze Wang

Journal of Manufacturing Processes

DOI

2024

Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review

Lei Li, Xinyu Du, Jibing Chen, Yiping Wu

Materials

DOI

2024

Application of additively manufactured bone scaffold: a systematic review

Qianyu Shi, Jibing Chen, Junsheng Chen, Yanfeng Liu, Hongze Wang

Biofabrication

DOI

2024

The Effect of Epoxy Resin on the Infiltration of Porous Metal Parts Formed through Laser Powder Bed Fusion

Jibing Chen, Yanfeng Liu, Yong She, Yang Yang, Xinyu Du, Junsheng Yang, Yiping Wu

Journal of Composites Science

DOI

2024

Polystyrene powder materials for selective laser sintering

Jibing Chen, Jibing Chen, Qianyu Shi, Junsheng Chen, Junsheng Chen, Bowen Liu, Maohui Hu

Iranian Polymer Journal

DOI

2024

Influence of oxygen content on selective laser melting leading to the formation of spheroidization in additive manufacturing technology

Jibing Chen, Yong She, Xinyu Du, Yanfeng Liu, Yang Yang, Junsheng Yang

RSC Advances

DOI

2023

Solder Selection Simulation Of IGBT Module Based On Thermal - Mechanical Coupling Field

Bowen Liu, Jibing Chen, Maohui Hu, Junsheng Chen, Qianyu Shi, Yifei Hong

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Study of the Solder Characteristics of IGBT Modules Based on Thermal–Mechanical Coupling Simulation

Jibing Chen, Bowen Liu, Maohui Hu, Shisen Huang, Shanji Yu, Yiping Wu, Junsheng Yang

Materials

DOI

2023

Effect of forming angle on the microstructure and properties of GH3536 nickel-based superalloy formed by SLM

Jibing Chen, Shisen Huang, Nan Chen, Chengze Yu, Shanji Yu, Bowen Liu, Maohui Hu, Ruidi Li

Rapid Prototyping Journal

DOI

2023

Effect of process parameter optimization on morphology and mechanical properties of Ti6Al4V alloy produced by selective laser melting

Xinyu Du, Jibing Chen, Yong She, Yanfeng Liu, Yang Yang, Junsheng Yang, Shijie Dong

Progress in Natural Science Materials International

DOI

2023

Research on the Microstructure and Mechanical Properties of Repaired 7N01 Aluminum Alloy by Laser-Directed Energy Deposition with Sc Modified Al-Zn-Mg

Jibing Chen, Shanji Yu, Junsheng Yang, Rong Xu, Ruidi Li, Shisen Huang, Hongbin Zhu, Xinyan Liu

Metals

DOI

2022

Study On The Failure Mechanism Of IGBT Module Solder Layer Based On Temperature Field

Bowen Liu, Jibing Chen, Maohui Hu, Qiange Li, Shanji Yu, Shishen Huang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2020

Research on thermal impact properties of single solder joint by RTC

Jibing Chen, Zhanwen He, Juying Li

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2020

Research on microstructures of high-power LED chip based on rapid thermal impact

Jibing Chen, Zhanwen He, Juying Li

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2019

Analysis on the Thermal Fatigue Behavior of Single SnAgCu Solder Joint

Jibing Chen, Yu Xie, Zhanwen He, Nong Wan, Yiping Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2019

Study on Performance of Metal and Polymer Composites Parts Based by Additive Manufacturing

Jibing Chen, Guangsong Wu, Yu Xie, Zhanwen He, Nong Wan, Yiping Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2019

Study on Performances of High-power LED Based on RTC by Electromagnetic Induced Heating

Zhanwen He, Guangsong Wu, Jibing Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2018

Study on the polymer material infiltrating metallic parts by selective laser sintering of 3D printing

Jibing Chen, Nong Wan, Juying Li, Zhanwen He

Rapid Prototyping Journal

DOI

2018

Effect of rapid inducted heating on the microstructure of solder joint in IC

Jibing Chen, Nong Wan, Juying Li, Zhanwen He, Yiping Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2018

Effect of eddy current inducted heating on optical property and thermostability of high power LED

Jibing Chen, Nong Wan, Juying Li, Zhanwen He, Yiping Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2017

Research on microstructures of double interfaces SAC305 solder joint by RPC

Jibing Chen, Nong Wan, Juying Li, Zhanwen He, Yiping Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2017

Performances and microstructures of a high-power LED based on rapid thermal cycling

Jibing Chen, Nong Wan, Juying Li, Zhanwen He, Yiping Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2016

A comparative study of properties and microstructures on thermal fatigue testing of a high-power LED

Jibing Chen, Nong Wan, Juying Li, Zhanwen He, Yiping Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2016

Study on thermal fatigue characteristics of lead-free SAC305 solder joint by RPC

Jibing Chen, Nong Wan, Juying Li, Zhanwen He, Yiping Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2015

Influence of properties and microstructures on thermal fatigue testing of high-power LED

Jibing Chen, Nong Wan, Juying Li, Zhanwen He, Yanfang Yin, Yiping Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2015

Effect of microstructure and IMC on single SnAgCu solder joint by rapid thermal cycles

Jibing Chen, Nong Wan, Juying Li, Zhanwen He, Yanfang Yin, Yiping Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2015

Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling

Jibing Chen, Yanfang Yin, Jianping Ye, Yiping Wu

Soldering and Surface Mount Technology

DOI

2014

Investigation of microstructure and optical property of high power LED based on rapid thermal cycling

Jibing Chen, Yanfang Yin, YE Jian-ping, Bing An, Yiping Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2013

快速热疲劳对无铅微焊点性能和微观组织的影响

陈继兵

《华中科技大学》

2013

激光制造微细规则可控多孔金属方法

刘锦辉，李锐，张丹青，陈继兵，李瑞迪，张海军，张佳

《辽宁工程技术大学学报(自然科学版)》

2013

Influence of rapid thermal cycling on the microstructures of single SnAgCu and SnPb solder joints

Jibing Chen, Weiwen Lv, Bing An, Longzao Zhou, Yiping Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2013

Influence of rapid thermal cycling on optical property and microstructure of high power LED

Jibing Chen, Bing An, Longzao Zhou, Yiping Wu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2012

LED光源的结温测量方法

郭威，陈继兵，安兵

《电子工艺技术》

2011

微连接焊点热循环可靠性的研究进展

李聪，陈继兵，安兵，吴懿平

《电子工艺技术》

2009

树脂增强选择性激光烧结多孔金属件的研究

陈继兵，史玉升，刘锦辉

《哈尔滨工业大学学报》

2006

金属/高分子复合粉末激光烧结成形及后处理研究

陈继兵

《华中科技大学》

精选作品

期刊论文

Thermal/Mechanical Characteristics Simulation Analysis of Solder Layer Damage in IGBT Modules

Synergistic Effect of High Strength‐Grain Refinement and Suppression of Al 6 Fe Phase Coarsening in Additively Manufactured Al‐Fe‐Sc‐Zr Alloys via Mg Addition

Synergistic effect of crystallographic orientation and porosity: multi-mode corrosion mechanism of additive manufacturing Al-Fe-Mn-Sc-Zr alloy

High-temperature fatigue strength behavior of titanium alloys by laser powder bed additive manufacturing

Additively Manufactured of Aluminum Alloy: Processes, Properties, and Applications

激光粉末床熔化制备耐热Al-Fe-Mn合金的显微组织和高温性能（英文）

A review of development and applications of SiC power devices in packaging and interconnect technology

Structure and Temperature Dependence of Solder Layer and Electric Parameters in IGBT Modules

Study on microstructure and mechanical properties for L-PBF iron matrix composites reinforced by epoxy resin

Simulation and Assessment of Thermal-Stress Analysis of Welding Materials in IGBT

Additively manufactured fine-grained Al–Fe–Cu-Sc-Zr alloy with resistance to brittleness under high temperature

Restraint of intermetallic compound and improvement of mechanical performance of Ti/Al dissimilar alloy by rotary friction welding based on laser powder bed fusion

Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review

Application of additively manufactured bone scaffold: a systematic review

The Effect of Epoxy Resin on the Infiltration of Porous Metal Parts Formed through Laser Powder Bed Fusion

Polystyrene powder materials for selective laser sintering

Influence of oxygen content on selective laser melting leading to the formation of spheroidization in additive manufacturing technology

Solder Selection Simulation Of IGBT Module Based On Thermal - Mechanical Coupling Field

Study of the Solder Characteristics of IGBT Modules Based on Thermal–Mechanical Coupling Simulation

Effect of forming angle on the microstructure and properties of GH3536 nickel-based superalloy formed by SLM

Effect of process parameter optimization on morphology and mechanical properties of Ti6Al4V alloy produced by selective laser melting

Research on the Microstructure and Mechanical Properties of Repaired 7N01 Aluminum Alloy by Laser-Directed Energy Deposition with Sc Modified Al-Zn-Mg

Study On The Failure Mechanism Of IGBT Module Solder Layer Based On Temperature Field

Research on thermal impact properties of single solder joint by RTC

Research on microstructures of high-power LED chip based on rapid thermal impact

Analysis on the Thermal Fatigue Behavior of Single SnAgCu Solder Joint

Study on Performance of Metal and Polymer Composites Parts Based by Additive Manufacturing

Study on Performances of High-power LED Based on RTC by Electromagnetic Induced Heating

Study on the polymer material infiltrating metallic parts by selective laser sintering of 3D printing

Effect of rapid inducted heating on the microstructure of solder joint in IC

Effect of eddy current inducted heating on optical property and thermostability of high power LED

Research on microstructures of double interfaces SAC305 solder joint by RPC

Performances and microstructures of a high-power LED based on rapid thermal cycling

A comparative study of properties and microstructures on thermal fatigue testing of a high-power LED

Study on thermal fatigue characteristics of lead-free SAC305 solder joint by RPC

Influence of properties and microstructures on thermal fatigue testing of high-power LED

Effect of microstructure and IMC on single SnAgCu solder joint by rapid thermal cycles

Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling

Investigation of microstructure and optical property of high power LED based on rapid thermal cycling

快速热疲劳对无铅微焊点性能和微观组织的影响

激光制造微细规则可控多孔金属方法

Influence of rapid thermal cycling on the microstructures of single SnAgCu and SnPb solder joints

Influence of rapid thermal cycling on optical property and microstructure of high power LED

LED光源的结温测量方法

微连接焊点热循环可靠性的研究进展

树脂增强选择性激光烧结多孔金属件的研究

金属/高分子复合粉末激光烧结成形及后处理研究

研究方向