蔡坚｜清华大学｜学者主页

2026

基于玻璃基板的2.5D CoWoS封装翘曲研究

师航波，王旭，范吉磊，马海艳，章莱，张晗，曹宸瑞，王谦，蔡坚

《电子与封装》

DOI

2026

Interfacial Evolution and Electromigration Behavior of Cu–Ni–Cu–Sn Microbumps for Long-term Power Delivery in 3D IC Advanced Packaging

Zheqi Xu, Yao Zheng, Tianhao Pan, Haiyan Ma, Qian Wang, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Simulation and Design of Low-Reflection Vertical Interconnect for Differential High-Speed Serial Link in 2.5D Fan-Out Reconstituted Interposer Packaging

Weida Lin, Ziyuan Shao, Changming Song, Jian Cai, Qian Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Double-Sided Funnel-Shaped Through Silicon Via Interposer by Wet-Etching Method for Superconducting Quantum Application

J. Y. Yu, Yongbo Wu, Qian Wang, Changming Song, Kaixiang Mao, Jian Cai

IEEE Electron Device Letters

DOI

2026

Indium-capped Copper Pillar Flip-chip Scheme Compatible for 2.5D Superconducting Quantum Computing Architecture

Kaixiang Mao, J. Y. Yu, Qian Wang, Yongbo Wu, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Simulation and Structural Optimization for Process-Induced Effects in CoWoS Packaging

Hangbo Shi, Qian Wang, Lai Zhang, Jing Wang, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Manifold Integrated Cold Plate for High Power Computing Applications

Yongbo Wu, Dongmei Zhai, Changming Song, Chuan Chen, J. Y. Yu, Yikang Zhou, Kai Zheng, Qian Wang, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Warpage Simulation of Molded Wafer with Silicon Bridges and TMVs

Ziyuan Shao, Weida Lin, Yang Hu, Jian Cai, Qian Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

5 µm pitch die-to-die hybrid bonding at low temperature with protruding Cu pads

Qiyuan Qian, Yuan Fang, Yao Zheng, Yang Hu, Qian Wang, Jian Cai

IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI

2026

UV-Based Surface Activation for Morphology-Controlled Die-to-Die Cu/SiO 2 Hybrid Bonding

Xiaoheng Zhou, Yuanxun Cui, Yuting Liang, Yu Hu, Yao Zheng, Haiyan Ma, Qian Wang, Jian Cai

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2026

Superconducting Flip-chip Interconnect on Au-passivated UBM for Quantum Application

J. Y. Yu, Liangliang Yang, Yongbo Wu, Qian Wang, Kaixiang Mao, Wei Chen, Jian Cai

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2025

基于硅转接板的2.5D封装中电源地平面研究和优化

陈龙，宋昌明，周晟娟，章莱，王谦，蔡坚

《电子与封装》

DOI

2025

Ultra-Fine Pitch Microbump Bonding by Solid-State Diffusion Combined with Fast Reflow Technology

Zheqi Xu, Yao Zheng, Haiyan Ma, Qian Wang, Jian Cai

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2025

Microbump Bonding by Solid-State Diffusion Combined with Fast Reflow Technology

Zheqi Xu, Tianhao Pan, Yao Zheng, Haiyan Ma, Qian Wang, Jian Cai

IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)

DOI

2025

Electroplated In–In Flip-Chip Interconnection for Superconducting Quantum Application

J. Y. Yu, Song Chang-ming, Shuai-Peng Wang, Yongbo Wu, Qian Wang, Haiyan Ma, Zheqi Xu, Tiefu Li, Jian Cai

IEEE Transactions on Electron Devices

DOI

2025

Thermal Analysis of Multi-Chiplet Heterogeneous Integration Based on the Lidless Fan-Out Package

Yongbo Wu, J. Y. Yu, Changming Song, Zheqi Xu, Lin Tan, Qian Wang, Jian Cai

IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI

2025

Structural Evolution of Chip to Chip Hybrid Bonding Interface after Temperature Cycling and High Temperature Storage Tests

Yuting Liang, Junpeng Fang, Haiyan Ma, Yalu Chen, Yao Rui Zheng, Qian Wang, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Low temperature solid-state diffusion bonding of fine pitch Cu/Sn micro-bumps assisted with formic acid vapor for 3D integration

Hanlin Wan, Qian Wang, Jian Cai, Dejun Wang

Microelectronic Engineering

DOI

2024

三维集成堆叠结构的晶圆级翘曲仿真及应用

谭琳，王谦，郑凯，周亦康，蔡坚

《电子与封装》

2024

Indium-Based Flip-Chip Interconnection by Electroplating Method for Superconducting Quantum 3D Integration Architecture

J. Y. Yu, Qian Wang, Haihua Wu, Yao Rui Zheng, Junpeng Fang, Changming Song, Yongbo Wu, Tiefu Li, Jian Cai

IEEE Electron Device Letters

DOI

2024

Optimization of Bonding Methods for Controlling Sn Spillage in Fine Pitch Microbump Applications

Zheqi Xu, Yao Rui Zheng, Lin Tan, Haiyan Ma, Kai Zheng, Yikang Zhou, Qian Wang, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Electroplating Cu on ALD $\text{TiN}$ for Small Size TSV

Haiyan Ma, Qian Wang, Lin Tan, Yang Hu, Yao Rui Zheng, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Finite Element Analysis of the Effect of Structural Parameters and Misalignment on Bonding Strength in Fine-Pitch Hybrid Bonding

Jingyu Shi, Lin Tan, Yang Hu, Junpeng Fang, Jian Cai, Zheyao Wang, Qian Wang

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2024

Power Integrity Optimization by DTC for 2.5D CoWoS Package

Shengjuan Zhou, Changming Song, Qian Wang, Jian Cai

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2024

Simulation and Optimization of Low-ESR and Low-ESL Deep Trench Capacitor

Weida Lin, Changming Song, Ziyuan Shao, Haiyan Ma, Xinlu Teng, Yikang Zhou, Jian Cai, Qian Wang

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2024

Simulation Analysis on Thermal Performance of a Lidless Fan-Out Package

Yongbo Wu, Jian Cai, Changming Song, Lin Tan, Qian Wang

Electronics System-Integration Technology Conference (ESTC)

DOI

2024

A Cu/Ni/Cu/Sn1.8Ag microbump structure for void-free interface under long time high-temperature storage

Zheqi Xu, Long Zhang, Shimeng Xu, Qian Wang, Yong Wang, Jian Cai

Journal of Alloys and Compounds

DOI

2024

An Insertion-Based Mechanical Interlock Cu-Sn Bonding Structure for Three-Dimensional Integration

Qiyuan Qian, Hanlin Wan, Yao Rui Zheng, Haiyan Ma, Qian Wang, Jian Cai, Dejun Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Low Temperature Cu/SiO2 Hybrid Bonding with Protruding Copper Pads

Junpeng Fang, Qian Wang, J. Y. Yu, Ziqing Wang, Yikang Zhou, Kai Zheng, Jian Cai

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2023

面向超导量子器件的封装集成技术

俞杰勋，王谦，郑瑶，宋昌明，方君鹏，吴海华，李铁夫，蔡坚

《电子与封装》

2023

后摩尔时代芯片互连新材料及工艺革新

张思勉，邓晓楠，王宇祺，武逸飞，刘佳宁，李正操，蔡坚，王琛

《中国科学:化学》

2023

Reliability study of fine pitch Cu-Sn micro-bump structure electromigration test by Finite Element Simulation

Zheqi Xu, Qian Wang, Lin Tan, Kai Zheng, Yikang Zhou, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Through-silicon-via Architecture of 3D Integration for Superconducting Quantum Computing Application

J. Y. Yu, Qian Wang, Yao Rui Zheng, Changming Song, Junpeng Fang, Tiefu Li, Haihua Wu, Zheyao Wang, Jian Cai

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2023

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai

Journal of Electronic Packaging

DOI

2022

高算力芯片未来技术发展途径

姚鹏，宋昌明，胡杨，蔡坚，尹首一，吴华强

《前瞻科技》

2022

Design and Simulation of Deep Trench Capacitor on High-Performance Silicon Interposer

Changming Song, Qian Wang, Kai Zheng, Yikang Zhou, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Indium-based Flip-chip Interconnection for Superconducting Quantum Computing Application

J. Y. Yu, Yao Rui Zheng, Shengjuan Zhou, Qian Wang, Sishi Wu, Haihua Wu, Tiefu Li, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Fan-Out Antenna-in-Package Integration Using Heatsink Antenna

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2022

Low Temperature Fine-pitch Cu-Cu Bonding Using Au Nanoparticles as Intermediate

Junpeng Fang, Jian Cai, Qian Wang, Xiuyu Shi, Kai Zheng, Yikang Zhou

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2022

Low temperature Au-Au bonding using Ag nanoparticles as intermediate for die attachment in power device packaging

Junpeng Fang, Jian Cai, Qian Wang, Kai Zheng, Yikang Zhou, Zhiting Geng

Applied Surface Science

DOI

2022

A Wideband Antenna for mm-Wave Antenna-in-Package Application

Xuesong Zhang, Qian Wang, Jian Cai

IEEE Access

DOI

2022

Research on Low-temperature Bonding Technology Using Metal Nanoparticles Prepared by Magnetron Sputtering

FANG Junpeng, Qian Wang, Jian Cai, WAN Hanlin, SONG Changming, ZHENG Kai, ZHOU Yikang

Journal of Mechanical Engineering

DOI

2021

面向异质集成的纳米修饰互连技术

方君鹏，王谦，郑凯，周亦康，贾松良，王水弟，蔡坚

《微纳电子与智能制造》

DOI

2021

面向窄节距倒装互连的预成型底部填充技术

王瑾，石修瑀，王谦，蔡坚，贾松良

《电子与封装》

DOI

2021

晶圆级多层堆叠技术

郑凯，周亦康，宋昌明，蔡坚，高颖，张昕

《半导体技术》

DOI

2021

A Hybrid Antenna in Package Solution Using FOWLP Technology

Xuesong Zhang, Qian Wang, Bo Wang, Gang Wang, Xin Gu, Yu Chen, Lin Tan, Shengjuan Zhou, Jian Cai

Journal of Electronic Packaging

DOI

2020

高纯锗探测器低本底硅前端电路基板设计

宋天骁，蔡坚，何力，邓智，王谦

《核电子学与探测技术》

2020

Experimental and computational investigation of low temperature Cu Sn solid-state-diffusion bonding for 3D integration

Jian Cai, Junqiang Wang, Qian Wang

Microelectronic Engineering

DOI

2020

A Low loss feed line for patch antenna based on silicon in millimeter-wave applications

Shengjuan Zhou, Huang Chen, Xuesong Zhang, Qian Wang, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2017

干冰表面处理技术在系统级封装的应用

隋春飞，蔡坚，石振东

《表面技术》

2017

Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition

Zijian Wu, Jian Cai, Junqiang Wang, Zhiting Geng, Qian Wang

Journal of Electronic Materials

DOI

2017

Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness

Zijian Wu, Jian Cai, Qian Wang, Junqiang Wang, Dejun Wang

Journal of Electronic Materials

DOI

2017

Low temperature Cu-Cu bonding using tin nanoparticles fabricated by high pressure magnetron sputtering

Zijian Wu, Qian Wang, Jian Cai

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2017

Drop performance evaluation for application of different underfill processes

Zhichao Wu, Jian Cai, Yu Chen, Jinwei Li

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2017

Copper and graphene composite material prepared by electrodeposition and its potential application for 3D integration

Xin Wang, Qian Wang, Yang Hu, Lin Tan, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2017

Effects of Current Stress for Low Temperature Cu/Sn/Cu Solid-State-Diffusion Bonding

Jian Cai, Junqiang Wang, Qian Wang, Zijian Wu, Dejun Wang

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2017

Corrections to “A 3-D Assembled Silicon-Embedded Transformer for 10-MHz, Ultra-High-Isolation, Compact Chip-to-Chip Power Transfer” [Mar 17 356-358]

Rongxiang Wu, Niteng Liao, Xiangming Fang, Jian Cai, Qian Wang, J.K.O. Sin

IEEE Electron Device Letters

DOI

2017

Low temperature Cu-Cu bonding using copper nanoparticles fabricated by high pressure PVD

Zijian Wu, Jian Cai, Qian Wang, Junqiang Wang

AIP Advances

DOI

2017

Plasma combined self-assembled monolayer pretreatment on electroplated-Cu surface for low temperature Cu–Sn bonding in 3D integration

Junqiang Wang, Qian Wang, Zijian Wu, Lin Tan, Jian Cai, Dejun Wang

Applied Surface Science

DOI

2017

A 3D Assembled Silicon-Embedded Transformer for 10-MHz, Ultra-High-Isolation, Compact Chip-to-Chip Power Transfer

Rongxiang Wu, Niteng Liao, Xiangming Fang, Jian Cai, Qian Wang, J.K.O. Sin

IEEE Electron Device Letters

DOI

2016

Effects of post-CMP annealing on TSV Cu protrusion and leakage current

Hai Jin, Jian Cai, Qian Wang, Yang Hu, ZiYu Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2016

Significantly enhanced shear strength of Sn-Ag-Cu/Co-P ball grid array solder joints by CoSn3 intermetallic compound

Donghua Yang, Jian Cai, Qian Wang, Jingwei Li, Yang Hu, Liangliang Li

Electronic System-Integration Technology Conference (ESTC)

DOI

2016

Low temperature Cu-Cu bonding using Ag nanoparticles by PVD

Zijian Wu, Qian Wang, Lin Tan, Ziyu Liu, Sun-Kyoung Seo, Tae-Je Cho, Jian Cai

Electronic System-Integration Technology Conference (ESTC)

DOI

2016

Warpage simulation for multilayered MIS substrate by application of image recognition method

Xi He, Lin Tan, Lidong Zhang, Lingzhi Chen, Chuan Chen, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2016

A design of a multi-sensor platform by System-Level integration in the package

Cheng Li, Han Guo, Xuesong Zhang, Qian Wang, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2016

Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection

Junqiang Wang, Qian Wang, Ziyu Liu, Zijian Wu, Jian Cai, Dejun Wang

Applied Surface Science

DOI

2016

Study on Ar(5%H2) Plasma Pretreatment for Cu/Sn/Cu Solid-State-Diffusion Bonding in 3D Interconnection

Junqiang Wang, Qian Wang, Dejun Wang, Jian Cai

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2016

Measurement of direct current and high frequency electrical characteristics for Through-Silicon-Via

Cheng Li, Han Guo, Ziyu Liu, Qian Wang, Jian Cai

China Semiconductor Technology International Conference (CSTIC)

DOI

2016

Detection and formation mechanism of micro-defects in ultrafine pitch Cu—Cu direct bonding

Zi-Yu Liu, Jian Cai, Qian Wang, Yu Chen

Chinese Physics B

DOI

2015

LCD驱动芯片CoF封装技术的现状及发展

胡张琪，王健，郭函，陈瑜，崔成强，王锋伟，蔡坚

《电子与封装》

2015

数模混合高速集成电路封装基板协同设计与验证

陈珊，蔡坚，王谦，陈瑜，邓智

《半导体技术》

2015

FBGA封装翘曲的黏弹性仿真与验证

谭琳，陈钏，李金睿，程熙云，王谦，蔡坚

《半导体技术》

2015

Electroplating Cu on ALD TiN for high aspect ratio TSV

Lu Wang, Jian Cai, Qian Wang, Yang Hu, Wenqi Zhang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2015

Cu-Cu bonding by Ag nanostructure at low temperature of 180 °C

Ziyu Liu, Qian Wang, Jian Cai, Guisheng Zou, Lei Liu, Daozhi Shen, Lin Tan

DOI

2015

Room temperature direct Cu-Cu bonding with ultrafine pitch Cu pads

Ziyu Liu, Jian Cai, Qian Wang, Hai Jin, Lin Tan

DOI

2015

Interfacial morphology and grain orientation during bumpless direct Cu bonding

Ziyu Liu, Jian Cai, Qian Wang

Thin Solid Films

DOI

2015

WITHDRAWN: Low temperature Cu–Cu bonding using Ag nanostructure for 3D integration

Ziyu Liu, Jian Cai, Qian Wang, Lin Tan, Yang Hu

Materials Letters

DOI

2015

Low Temperature Cu-Cu Bonding Using Ag Nanostructure for 3D Integration

Z. Liu, Jian Cai, Qiong Wang, Lin Tan, Yaowen Hu

ECS Solid State Letters

DOI

2015

Ultra-thin chip on flex by Solder-on-Pad (SoP) technology

HU Zhangqi, Qian Wang, Han Guo, Yu Chen, C.Q. Cui, Jian Wang, Fengwei Wang, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2015

Kinetics of interfacial reaction between Sn-3.0Ag-0.5Cu solder and Co-4.0P or Co-8.0P metallization

Donghua Yang, Guoshuai Yang, Jian Cai, Qian Wang, Jingwei Li, Yang Hu, Liangliang Li

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2015

Study on electrical performance of stacking die package with silicon interposer

Shan Chen, Cheng Li, Yu Chen, Wenjie Zhang, Jianhua Zhong, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2015

Development of fine line build-up organic substrate using thin film RDL technology

Xinyu Wang, Jian Cai, Yu Chen, Cheng Li, Xi He, Shuidi Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2015

Au-Ag bonding for 3D stacked package

Long Zhang, Jian Cai, Lin Tan, Qian Wang, Songliang Jia

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2015

Low temperature solid-state-diffusion bonding for fine-pitch Cu/Sn/Cu interconnect

Jian Cai, Junqiang Wang, Qian Wang, Ziyu Liu, Dejun Wang, Sun-Kyoung Seo, Tae-Je Cho

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2014

第64届国际电子元件与技术会议参会报道

蔡坚

《电子与封装》

2014

有关QFN72和CQFN72的热阻计算

贾松良，蔡坚，王谦，丁荣峥

《电子与封装》

2014

Surface activated bonding method applied in MEMS pressure sensor with TSV structures

Zijian Wu, Yinghui Wang, Jian Cai, Qian Wang, Tadatomo Suga

IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

DOI

2014

Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil Printing

Ziyu Liu, Jian Cai, Qian Wang, Xi He, Yu Chen

Journal of Electronic Materials

DOI

2014

The miniaturization of a micro-ball endoscope by SiP approach

Xunxun Zhu, Jian Cai, Yu Chen, Yingke Gu, Xiang Xie, Qian Wang, Zhihua Wang, Xiaofeng Sun, Lixi Wan

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2014

Reliability of Sn-Pb solder joints with Cu and Co-P surface finishes under thermal cycling

Donghua Yang, Guoshuai Yang, Jian Cai, Qian Wang, Yang Hu, Jingwei Li, Liangliang Li

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

Performance and reliability study of TGV interposer in 3D integration

Tiwei Wei, Qian Wang, Jian Cai, Le Chen, Jones Yu-Cheng Huang, Lu Wang, Long Zhang, Cheng Li

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2014

IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling

Donghua Yang, Jian Cai, Qian Wang, Jingwei Li, Yang Hu, Liangliang Li

Journal of Materials Science Materials in Electronics

DOI

2014

Numerical analysis on MUF process for flip chip packaging

Xiyun Cheng, Qian Wang, Lin Tan, Guanhua Li, Yu Chen, Jian Cai

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

Characterization of after-reflow misalignment on Head-in-Pillow defect in BGA assembly

Chuan Chen, Jian Cai, Qian Wang, Yuming Wang, Guisheng Zou, Zhengyu Zhao, Chang Yong Park

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

Characterization of stencil printing parameters for fine pitch wafer bumping

Xi He, Ziyu Liu, Jian Cai, Yu Chen, Lin Tan, Qian Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

Optimization and evaluation of sputtering barrier/seed layer in through silicon via for 3-D integration

Tiwei Wei, Jian Cai, Qian Wang, Yang Hu, Lu Wang, Ziyu Liu, Zijian Wu

Tsinghua Science & Technology

DOI

2014

Properties and morphology of TiN films deposited by atomic layer deposition

Siyi Xie, Jian Cai, Qian Wang, Lu Wang, Ziyu Liu

Tsinghua Science & Technology

DOI

2014

(Invited) Study on Two Types of Embedded Components in Substrate Technology

Ferlee Gunawan, Bin Luo, Jian Cai, Lingwen Kong, Kunpeng Ding

ECS Transactions

DOI

2014

Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

Rui Zhang, Jian Cai, Qian Wang, Jingwei Li, Yang Hu, Hongda Du, Liangliang Li

Journal of Electronic Packaging

DOI

2013

Integrated passive filters based on silicon substrate for SiP application

Tongyu Zhao, Jian Cai, Yinan Li, Qian Wang, Dejun Wang

IEEE Electronics Packaging Technology Conference (EPTC)

DOI

2013

Study of viscoelastic effect of EMC on FBGA block warpage by FEA simulation

Lin Tan, Jingrui Li, Xiyun Cheng, Qian Wang, Jian Cai, Haijun Shen, Guoliang Yu, Tonglong Zhang, Shuidi Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2013

Study of glass metallization and adhesion evaluation for TGV application

Le Chen, Qian Wang, Jian Cai, Guangrui Ma, Yang Hu, Taekoo Lee

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2013

Performance and reliability study of Pd-coated copper wire bonding on ENEPIG substrate

Lulu Shi, Qian Wang, Yu Chen, Lin Tan, Jian Cai, Xin Gu, Shuidi Wang, Jingwei Li, Yang Hu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2013

Evaluation of the effect of stress relief slots on QFN strip warpage using finite element analysis

Xiyun Cheng, Lin Tan, Qian Wang, Jian Cai, Honghui Wang, Xiaojiang Wang, Tonglong Zhang, Shuidi Wang, Jingrui Li

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2012

硅通孔电镀铜填充工艺优化研究

李轶楠，蔡坚，王德君，王谦，魏体伟

《电子工业专用设备》

2012

系统级封装(SiP)技术研究现状与发展趋势

胡杨，蔡坚，曹立强，陈灵芝，刘子玉，石璐璐，王谦

《电子工业专用设备》

2012

A 3D integration testing vehicle with TSV interconnects

Tiwei Wei, Qian Wang, Ziyu Liu, Yinan Li, Dejun Wang, Tao Wang, Jian Cai

International Conference on Electronic Materials and Packaging

DOI

2012

Copper filling process for small diameter, high aspect ratio Through Silicon Via (TSV)

Tiwei Wei, Jian Cai, Qian Wang, Ziyu Liu, Yinan Li, Tao Wang, Dejun Wang

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2012

Assembly and testing of thermal test chip on silicon interposer with Through Silicon Via

Ziyu Liu, Jian Cai, Qian Wang, Xi He, Shuidi Wang

International Conference on Electronic Materials and Packaging

DOI

2012

Investigation on FBGA block warpage by Finite Element Simulation

Jingrui Li, Lin Tan, Qian Wang, Jian Cai, Guoliang Yu, Shuidi Wang, Xiyun Cheng

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2012

Copper chemical mechanical polishing and wafer thinning with temporary bonding for Through Silicon Via interconnect

Ziyu Liu, Jian Cai, Qian Wang, Tao Wang, Tiwei Wei, Li Li

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2012

A quick turn packaging solution and its application

Han Guo, Jian Cai, Yuanyuan Pu, Yu Chen, Qian Wang, Zhi Deng, Jing Jiang, Lingwen Kong

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2012

Impact of soldering terminal solderability of component and PCB on solder joint interface

Yuming Wang, Beibei Wang, Jian Cai, Tianxi Wang

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2011

Development of a BGA package based on Si interposer with through silicon via

Hao Zhang, Jian Cai, Qian Wang, Tao Wang, Shuidi Wang

Tsinghua Science & Technology

DOI

2011

Reliability of lead-free fine pitch BGA under thermal and mechanical impact

Mingzhi Dong, Qian Wang, Jian Cai, Jingrui Li, Shuidi Wang

International Microsystems, Packaging, Assembly and Circuits Technology Conference

DOI

2011

Design and Fabrication of WLP Compatible Miniaturized Pressure Sensor System with Through Silicon Via (TSV) Interconnects

Tao Wang, Jian Cai, Qian Wang, Hao Zhang, Zheyao Wang

IMAPSource Proceedings

DOI

2011

The reliability investigation of capacitors embedded PCB

Qinwei Peng, Xin Gu, Pinghua Bao, Dali Huang, Jianchao Zhang, Lingwen Kong, Jian Cai

DOI

2010

Electromigration and thermomigration in Sn3Ag0.5Cu solder joints

Xin Gu, Kunpeng Ding, Jian Cai, Lingwen Kong

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2010

Finite Element Method based stress analysis and warpage prediction of SIM card packaging

Mingzhi Dong, Jian Cai, Yigao Chen, Qian Wang, Xinyu Dou, Shuidi Wang

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2010

A BGA package design of a read-out ASIC for GEM imaging detector

Yuanyuan Pu, Jian Cai, Zhi Deng, Yulan Li, Xiaocui Zheng, Shuidi Wang

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2009

环境法规对无铅以及无卤电子产业的影响

聂磊，蔡坚，Michael Pecht，Richard Ciocci

《电子与封装》

2009

MEMS圆片级封装用Cu-Sn低温键合机理与工艺研究

荣毅博，蔡坚，王水弟，贾松良

《半导体技术》

2009

陶瓷基板上的集成微电感模型与制作

王建卫，蔡坚，窦新玉，王水弟

《半导体技术》

2009

Low temperature Cu-Sn bonding by isothermal solidification technology

Yibo Rong, Jian Cai, Shuidi Wang, Songliang Jia

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2009

Study of stencil printing technology for fine pitch flip chip bumping

Jin Long Yang, Jian Cai, Shuidi Wang, Songliang Jia

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2009

Effects of nitrogen on wettability and reliability of lead-free solder in reflow soldering

Mingzhi Dong, Yuming Wang, Jian Cai, Tao Feng, Yuanyuan Pu

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2009

Solderability of flash gold surface finish

Yuming Wang, Mingzhi Dong, Jian Cai

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2009

Interfacial reaction of reballed BGAs under isothermal aging conditions

Lei Nie, Mingzhi Dong, Jian Cai, Michael D. Osterman, MICHAEL G. PECHT

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2009

A PCB-based package structure

Na Wang, Jian Cai, Weikang Yang, Xinyu Dou

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2009

Integrated inductors on silicon and planarized ceramic substrates

Jianwei Wang, Jian Cai, Xinyu Dou, Shuidi Wang

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2008

High-Q on-chip inductors embedded in wafer-level package for RFIC applications

Tao Feng, Jian Cai, Henri H.K. Kwon, Qian Wang, Xinyu Dou

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2007

硅通孔互连技术的开发与应用

封国强，蔡坚，王水弟

《中国集成电路》

2007

Microstructure of Ag-Sn Bonding for MEMS Packaging

Xiaogang Li, Jian Cai, Yoonchul Sohn, Qian Wang, Woonbae Kim, Shuidi Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2007

Evaluation of the Thermal Resistance of CSOP24 Ceramic Package

Xiao Peng, Shuidi Wang, Songliang Jia, Jian Cai, Qiang Huang, Rongzhen Ding

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2007

Simulation-Aided Thermal Design of Intermittent Power Transistor Packages

Ying Xiao, Xinyu Dou, Jian Cai, Tao Feng

International Workshop on Electron Devices and Semiconductor Technology (EDST)

DOI

2006

一种低成本的硅垂直互连技术

封国强，蔡坚，王水弟，贾松良

《半导体技术》

2006

系统级封装(SiP)集成技术的发展与挑战

蔡坚，王水弟，贾松良

《中国集成电路》

2006

Ag-Sn Fluxless Wafer Bonding Technology

Xiao Li, Jian Cai, Yoonchul Sohn, Qian Wang, Woonbae Kim

International Conference on Electronic Materials and Packaging

DOI

2006

Bonding Packaging of a SP4T RF MEMS Switch

Guangwei Hu, Zewen Liu, Yi Qiao, Zhihao Hou, Jian Cai, Litian Liu, Zhjian Li

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2006

A Study of Intermetallic Compounds in Tin Bumps during Multi-Reflows

Lei Nie, Jian Cai, Xiao Peng, Nan Zhang, Shuidi Wang, Songliang Jia

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2006

Polymer Flip Chip Bumping and Its Application for CdZnTe Detectors

Xue Lin, Jian Cai, Lei Lü, Lan Zhang, Shuidi Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2006

Electroless Plating Ni-based Barrier Layers for Silicon Vertical Interconnects

Guoqiang Feng, Jian Cai, Xiao Peng, Shuidi Wang, Songliang Jia

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2006

Through wafer via technology for 3-D packaging

Guoqiang Feng, Xiao Peng, Jian Cai, Shuidi Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2006

Microstructure of AuSn Wafer Bonding for RF-MEMS Packaging

Jian Cai, Qian Wang, Xiaogang Li, Woonbae Kim, Shuidi Wang, Junsik Hwang, Changyoul Moon

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2006

The impact of zincation on the electroless nickel UBM for low cost flip chip technology

Yu Yang, Jian Cai, Shuidi Wang, Songliang Jia

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2005

Comparative studies on interconnect techniques for RF applications

Yu Yang, Jian Cai, Shuidi Wang, Songliang Jia

International Conference on Microwave and Millimeter Wave Technology (ICMMT)

DOI

2004

微电子封装中等离子体清洗及其应用

聂磊，蔡坚，贾松良，王水弟

《半导体技术》

2004

RF-MEMS的系统级封装

杨宇，蔡坚，刘泽文，王水弟，贾松良

《半导体技术》

2004

用于圆片级封装的金凸点研制

王水弟，蔡坚，谭智敏，胡涛，郭江华，贾松良

《半导体技术》

2003

一种低成本倒装芯片用印刷凸焊点技术的研究

蔡坚，陈正豪，贾松良，肖国伟，王水弟

《电子元件与材料》

2003

先进的MEMS封装技术

王海宁，王水弟，蔡坚，贾松良

《半导体技术》

2003

系统芯片(SOC)与系统级封装(SIP)

王水弟，蔡坚，贾松良

《中国集成电路》

精选作品

期刊论文

基于玻璃基板的2.5D CoWoS封装翘曲研究

Interfacial Evolution and Electromigration Behavior of Cu–Ni–Cu–Sn Microbumps for Long-term Power Delivery in 3D IC Advanced Packaging

Simulation and Design of Low-Reflection Vertical Interconnect for Differential High-Speed Serial Link in 2.5D Fan-Out Reconstituted Interposer Packaging

Double-Sided Funnel-Shaped Through Silicon Via Interposer by Wet-Etching Method for Superconducting Quantum Application

Indium-capped Copper Pillar Flip-chip Scheme Compatible for 2.5D Superconducting Quantum Computing Architecture

Simulation and Structural Optimization for Process-Induced Effects in CoWoS Packaging

Manifold Integrated Cold Plate for High Power Computing Applications

Warpage Simulation of Molded Wafer with Silicon Bridges and TMVs

5 µm pitch die-to-die hybrid bonding at low temperature with protruding Cu pads

UV-Based Surface Activation for Morphology-Controlled Die-to-Die Cu/SiO 2 Hybrid Bonding

Superconducting Flip-chip Interconnect on Au-passivated UBM for Quantum Application

基于硅转接板的2.5D封装中电源地平面研究和优化

Ultra-Fine Pitch Microbump Bonding by Solid-State Diffusion Combined with Fast Reflow Technology

Microbump Bonding by Solid-State Diffusion Combined with Fast Reflow Technology

Electroplated In–In Flip-Chip Interconnection for Superconducting Quantum Application

Thermal Analysis of Multi-Chiplet Heterogeneous Integration Based on the Lidless Fan-Out Package

Structural Evolution of Chip to Chip Hybrid Bonding Interface after Temperature Cycling and High Temperature Storage Tests

Low temperature solid-state diffusion bonding of fine pitch Cu/Sn micro-bumps assisted with formic acid vapor for 3D integration

三维集成堆叠结构的晶圆级翘曲仿真及应用

Indium-Based Flip-Chip Interconnection by Electroplating Method for Superconducting Quantum 3D Integration Architecture

Optimization of Bonding Methods for Controlling Sn Spillage in Fine Pitch Microbump Applications

Electroplating Cu on ALD $\text{TiN}$ for Small Size TSV

Finite Element Analysis of the Effect of Structural Parameters and Misalignment on Bonding Strength in Fine-Pitch Hybrid Bonding

Power Integrity Optimization by DTC for 2.5D CoWoS Package

Simulation and Optimization of Low-ESR and Low-ESL Deep Trench Capacitor

Simulation Analysis on Thermal Performance of a Lidless Fan-Out Package

A Cu/Ni/Cu/Sn1.8Ag microbump structure for void-free interface under long time high-temperature storage

An Insertion-Based Mechanical Interlock Cu-Sn Bonding Structure for Three-Dimensional Integration

Low Temperature Cu/SiO2 Hybrid Bonding with Protruding Copper Pads

面向超导量子器件的封装集成技术

后摩尔时代芯片互连新材料及工艺革新

Reliability study of fine pitch Cu-Sn micro-bump structure electromigration test by Finite Element Simulation

Through-silicon-via Architecture of 3D Integration for Superconducting Quantum Computing Application

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

高算力芯片未来技术发展途径

Design and Simulation of Deep Trench Capacitor on High-Performance Silicon Interposer

Indium-based Flip-chip Interconnection for Superconducting Quantum Computing Application

Fan-Out Antenna-in-Package Integration Using Heatsink Antenna

Low Temperature Fine-pitch Cu-Cu Bonding Using Au Nanoparticles as Intermediate

Low temperature Au-Au bonding using Ag nanoparticles as intermediate for die attachment in power device packaging

A Wideband Antenna for mm-Wave Antenna-in-Package Application

Research on Low-temperature Bonding Technology Using Metal Nanoparticles Prepared by Magnetron Sputtering

面向异质集成的纳米修饰互连技术

面向窄节距倒装互连的预成型底部填充技术

晶圆级多层堆叠技术

A Hybrid Antenna in Package Solution Using FOWLP Technology

高纯锗探测器低本底硅前端电路基板设计

Experimental and computational investigation of low temperature Cu Sn solid-state-diffusion bonding for 3D integration

A Low loss feed line for patch antenna based on silicon in millimeter-wave applications

干冰表面处理技术在系统级封装的应用

Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition

Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness

Low temperature Cu-Cu bonding using tin nanoparticles fabricated by high pressure magnetron sputtering

Drop performance evaluation for application of different underfill processes

Copper and graphene composite material prepared by electrodeposition and its potential application for 3D integration

Effects of Current Stress for Low Temperature Cu/Sn/Cu Solid-State-Diffusion Bonding

Corrections to “A 3-D Assembled Silicon-Embedded Transformer for 10-MHz, Ultra-High-Isolation, Compact Chip-to-Chip Power Transfer” [Mar 17 356-358]

Low temperature Cu-Cu bonding using copper nanoparticles fabricated by high pressure PVD

Plasma combined self-assembled monolayer pretreatment on electroplated-Cu surface for low temperature Cu–Sn bonding in 3D integration

A 3D Assembled Silicon-Embedded Transformer for 10-MHz, Ultra-High-Isolation, Compact Chip-to-Chip Power Transfer

Effects of post-CMP annealing on TSV Cu protrusion and leakage current

Significantly enhanced shear strength of Sn-Ag-Cu/Co-P ball grid array solder joints by CoSn3 intermetallic compound

Low temperature Cu-Cu bonding using Ag nanoparticles by PVD

Warpage simulation for multilayered MIS substrate by application of image recognition method

A design of a multi-sensor platform by System-Level integration in the package

Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection

Study on Ar(5%H2) Plasma Pretreatment for Cu/Sn/Cu Solid-State-Diffusion Bonding in 3D Interconnection

Measurement of direct current and high frequency electrical characteristics for Through-Silicon-Via

Detection and formation mechanism of micro-defects in ultrafine pitch Cu—Cu direct bonding

LCD驱动芯片CoF封装技术的现状及发展

数模混合高速集成电路封装基板协同设计与验证

FBGA封装翘曲的黏弹性仿真与验证

Electroplating Cu on ALD TiN for high aspect ratio TSV

Cu-Cu bonding by Ag nanostructure at low temperature of 180 °C

Room temperature direct Cu-Cu bonding with ultrafine pitch Cu pads

Interfacial morphology and grain orientation during bumpless direct Cu bonding

WITHDRAWN: Low temperature Cu–Cu bonding using Ag nanostructure for 3D integration

Low Temperature Cu-Cu Bonding Using Ag Nanostructure for 3D Integration