百晓学者学者目录

钟毅

副教授、助理教授、教授、硕导，厦门大学

精选作品

期刊论文

2026

三维集成电路通孔金属化技术研究进展

孙鹏，全雪松，杜韵辉，黎科，钟毅，于大全

《电镀与精饰》

2026

DyNeuro: A Hybrid Neuromorphic Accelerator with Dynamic Spatio-Temporal Variation Adaptations

You-Ming Yang, Yi Zhong, Lun Li, Tao Zhang, Xiao-Xin Cui, Yuan Wang

International Symposium on Circuits and Systems

DOI

2026

DualLearn: A 4.686pJ/SOP-4.026pJ/FLOP SNN-ANN Neuromorphic Inference-Training Processor with Distributed and Memory-Adaptive Architecture

Yi Zhong, Zi-Lin Wang, Zhao-Tong Zhang, Lun Li, Jin-Hao Ruan, Yi-Peng Gao, Yingying Cui, Xiao-Xin Cui, Xing Zhang, Yuan Wang

IEEE Custom Integrated Circuits Conference

DOI

2026

Brain‑inspired computing for space: a review of neuromorphic processors and aerospace opportunities

Yi Zhong, Tao Zhang, Jin-Hao Ruan, Yi-Peng Gao, Yuan Wang

Hyper

DOI

2026

EA-HWP: An Efficient CNN/SNN Accelerator With Hybrid Weight Precision

Zi-Lin Wang, Zehong Ou, Yi Zhong, Tao Zhang, You-Ming Yang, Zhao-Tong Zhang, Shuo Feng, Yi-Peng Gao, Jin-Hao Ruan, Yuan Wang

IEEE Transactions on Circuits and Systems - II - Express Briefs

DOI

2026

CHiP-NoC: A Congestion-Adaptive Dual-Mode Neuromorphic NoC with Hybrid Spike Compression

Yi-Peng Gao, Yi Zhong, Yingying Cui, Song Jia, Yuan Wang

International Symposium on Circuits and Systems

DOI

2026

A 28-nm Optical Flow Estimation Accelerator with Redundancy Speculation, Bit-Width-Aware Compression and Similarity Detection

Tao Zhang, Yi Zhong, You-Ming Yang, Jin-Hao Ruan, Yi-Peng Gao, Zhao-Tong Zhang, Yuan Wang

IEEE Custom Integrated Circuits Conference

DOI

2026

Diamond-on-Chip Integration for Enhanced Thermal Management and Warpage Control in 2.5D Chiplets Packaging

Zeming Tao, Ningning Xu, Dongchen Fan, Jinbao Zhang, Yixiong Wu, Weiyi Lin, Rongbin Xu, Dongxue Liang, Delong Qiu, Yi Zhong

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2026

Fabrication and Thermo-Mechanical Stress Optimization of High Aspect Ratio TSVs for Advanced 3D Integration

Yunhui Du, Zeming Tao, Dongchen Fan, Ke Li, Yi Zhong, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

High-Density Heterogeneous Integration of Collective Si Dies and Glass Wafers via Low-Temperature Die-to-Wafer Bonding

Shuchao Bao, Ningning Xu, Yi Zhong, Wenbiao Ruan, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Achieving robust and low thermal resistance polycrystalline diamond-Si integration by ultra-thin film AuIn bonding

Zeming Tao, Keqing Ouyang, Jinbao Zhang, Dongchen Fan, Guangyao Li, Xiangwei Wu, Yi Zhong

Diamond and Related Materials

DOI

2026

High-efficient and fast-response thermal management by heterogeneous integration of diamond on interposer-based 2.5D chiplets

Ningning Xu, Dongchen Fan, Yixiong Wu, Zeming Tao, Delong Qiu, Yi Zhong

Thermal Science and Engineering Progress

DOI

2026

Collective Die-to-Wafer Bonding of Si Dies and 4-Inch Polycrystalline Diamond Wafer with Ultralow Thermal Boundary Resistance and High Bonding Quality

Shuchao Bao, Ningning Xu, Ran He, Yi Zhong, Daquan Yu

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2026

Advancements in Ultra-High Aspect Ratio Via Interconnection Technology Enabled by Atomic Layer Deposition

Ke Li, Yi Zhong, Daquan Yu

DOI

2026

High thermal conductivity electroplating-assisted stitched large-area diamond substrates for high performance electronic devices

Xinshuo Zhang, Ke Li, Ningning Xu, Y Yun-Chung Wu, Yi Zhong, Weiyi Lin, Rongbin Xu, Dongxue Liang, Daquan Yu

Diamond and Related Materials

DOI

2026

Reliable thermal management of high-power semiconductor lasers based on nano-silver sintering diamonds

Ningning Xu, Dongchen Fan, Zhongliang Liu, Zeming Tao, Yi Zhong

Materials Today Communications

DOI

2026

Thermo-Mechanical Reliability Enhancement of Wafer-Level Chip-Scale Packaging for SAW Filters

Dongchen Fan, Binbin Jiang, Zeming Tao, Wenbiao Ruan, Yi Zhong, Daquan Yu

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2026

Process Development and Suppression of Stress and Warpage in embedded Glass Fan-Out Packaging

Dongchen Fan, Xuesong Quan, Jiahao Liu, Ningning Xu, 唐静晓, Yi Zhong, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

An Efficient Junction Temperature Prediction Model for Diamond-on-Chip-on-Glass (DoCoG) Packaging Based on Thermal Resistance Network

Chenghao Bei, Yu Tian, Minghao Zhou, Shuchao Bao, Yuqi Su, Yi Zhong, Xiaofeng Gu, Daquan Yu

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2025

A RISC-V based heterogeneous neuromorphic system with dynamic reconfigurable computing for edge AI

Zhao-Xiang Zhang, Yi Zhong, Zi-Lin Wang, You-Ming Yang, Tao Zhang, Jin-Hao Ruan, Yi-Peng Gao, Yuan Wang

Microelectronics Journal

DOI

2025

Cactus: A Multicore Spiking Neural Network Accelerator With Fine-Grained Structured Weight Sparsity

Zi-Lin Wang, Zehong Ou, Yi Zhong, Yuan Wang

IEEE Transactions on Very Large Scale Integration (vlsi) Systems

DOI

2025

An Efficient Fixed-Point Spiking Neural Network Training Architecture with Reconfigurable Processing Elements and Dynamic Clocks

Zhenhui Dai, Lun Li, Cheng Zhao, Tingting Zhong, Yi Zhong, Yingying Cui, Yuan Wang, Dun-Shan Yu, Xiao-Xin Cui

Biomedical Circuits and Systems Conference

DOI

2025

PAICORE: A 1.9-Million-Neuron 5.181-TSOPS/W Digital Neuromorphic Processor With Unified SNN-ANN and On-Chip Learning Paradigm

Yi Zhong, Yisong Kuang, Kefei Liu, Zi-Lin Wang, Shuo Feng, Guang Chen, You-Ming Yang, Xiu-Ping Cui, Qiankun Wang, Jian Cao, Song Jia, Y. Liang, Guangyu Sun, Xiao-Xin Cui, Ru Huang, Yuan Wang

IEEE Journal of Solid-State Circuits

DOI

2025

NeuroHexa: A 2D/3D-Scalable Model-Adaptive NoC Architecture for Neuromorphic Computing

Yi Zhong, Zi-Lin Wang, Yi-Peng Gao, Xiao-Xin Cui, Xing Zhang, Yuan Wang

Design, Automation and Test in Europe

DOI

2025

CROSSCUT: A Multi-Core Neuromorphic Accelerator Improving Resource-Utilization

You-Ming Yang, Yi Zhong, Zi-Lin Wang, Tao Zhang, Lun Li, Yingying Cui, Xiao-Xin Cui, Song Jia, Yuan Wang

International Symposium on Circuits and Systems

DOI

2025

A Reconfigurable Digital Compute-in-Memory Architecture With 2:4 Compressed Weight Storage for Highly Sparse Fusion Neural Network

Cheng Zhao, Lun Li, Zhenhui Dai, Tingting Zhong, Yi Zhong, Yingying Cui, Xiao-Xin Cui

IEEE Transactions on Circuits and Systems - II - Express Briefs

DOI

2025

HyNITA: A Neuromorphic Inference and Training Accelerator for Hybrid ANN-SNN Fusion Models

Yi Zhong, Lun Li, Zi-Lin Wang, Jin-Hao Ruan, Yi-Peng Gao, Xiao-Xin Cui, Xing Zhang, Yuan Wang

International Symposium on Circuits and Systems

DOI

2025

UniPRE: An SNN-ANN Accelerator With Unified Max-Pooling Prediction and Redundancy Elimination

Tao Zhang, Yi Zhong, You-Ming Yang, Zi-Lin Wang, Zhao-Tong Zhang, Yuan Wang

IEEE Transactions on Circuits and Systems - II - Express Briefs

DOI

2025

Enhancement of Low-Temperature Al-Al Bonding for Cost-Effective 3D Integration

Yixiong Wu, Xiangwei Wu, Zeming Tao, Yunhui Du, Ningning Xu, Weiyi Lin, Rongbin Xu, Dongxue Liang, Yi Zhong, Daquan Yu

IEEE Electron Device Letters

DOI

2025

Warpage Mitigation in 2.5D Chiplets Packaging through Heterogeneous Integration of Diamond Heat Spreaders

Ningning Xu, Dongchen Fan, Yixiong Wu, Zeming Tao, Yi Zhong, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Low-temperature Heterogeneous Integration of Ga 2 O 3 Devices with Diamond for Enhanced Thermal Management in High-Power Electronics

Yixiong Wu, Dongchen Fan, Yunhui Du, Ningning Xu, Yi Zhong, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Degradation Analysis of Integrated Metal–Insulator–Metal Capacitors Due to Recrystallization

Dongchen Fan, Binbin Jiang, Zeming Tao, Wenbiao Ruan, Jin Zhao, Manyu Wang, Yi Zhong, Daquan Yu

IEEE Transactions on Electron Devices

DOI

2025

Hybrid Bonding of Nonphotosensitive Dry Films and Cu/SnAg Microbumps for Multilayer Glass Packaging

Qing Zhou, Ying Tian, Yaqing Zhou, Yi Zhong, Tian Lai Yu, Miao Zhang, Daquan Yu

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2025

Development and Reliability of Wafer-Level SAW Filter Packaging Using Photosensitive Films

Wenjiao Pei, Shaocheng Wu, Jiazhe Zhang, Yi Zhong, Weiyi Lin, Dongxue Liang, Rongbin Xu, Daquan Yu

IEEE Transactions on Electron Devices

DOI

2025

A Review of Wafer-Level Packaging Technology for SAW and BAW Filters

Xinyue Liu, Wenjiao Pei, Jin Zhao, Rongbin Xu, Yi Zhong, Daquan Yu

Micromachines

DOI

2024

集成电路互连微纳米尺度硅通孔技术进展

黎科，张鑫硕，夏启飞，钟毅，于大全

《电子与封装》

2024

PAIBoard: A Neuromorphic Computing Platform for Hybrid Neural Networks in Robot Dog Application

Guang Chen, Jian Cao, Chenglong Zou, Shuo Feng, Yi Zhong, Xing Zhang, Yuan Wang

Electronics

DOI

2024

BrainQN: Enhancing the Robustness of Deep Reinforcement Learning with Spiking Neural Networks

Shuo Feng, Jian Cao, Zehong Ou, Guang Chen, Yi Zhong, Zi-Lin Wang, Juntong Yan, Jue Chen, Bingsen Wang, Chenglong Zou, Ze-Bang Feng, Yuan Wang

Advanced Intelligent Systems

DOI

2024

An all integer-based spiking neural network with dynamic threshold adaptation

Chenglong Zou, Xiao-Xin Cui, Shuo Feng, Guang Chen, Yi Zhong, Zhenhui Dai, Yuan Wang

Frontiers in Neuroscience

DOI

2024

A Hybrid Heterogeneous Neural Network Accelerator based on Systolic Array

Zi-Lin Wang, Yi Zhong, Guang Chen, Shuo Feng, You-Ming Yang, Xiao-Xin Cui, Yuan Wang

International Conference on Artificial Intelligence Circuits and Systems

DOI

2024

An End-to-End SoC for Brain-Inspired CNN-SNN Hybrid Applications

Zhao-Tong Zhang, Yi Zhong, Yingying Cui, Yawei Ding, Yu-Kun Xue, Qibin Li, Rui Yang, Jian Cao, Yuan Wang

International Symposium on Circuits and Systems

DOI

2024

NeuroREC: A 28-nm Efficient Neuromorphic Processor for Radar Emitter Classification

Zi-Lin Wang, Zehong Ou, Yi Zhong, You-Ming Yang, Lun Li, Hu-Fei Li, Jian Cao, Xiao-Xin Cui, Song Jia, Yuan Wang

IEEE Transactions on Circuits and Systems Part 1: Regular Papers

DOI

2024

An Energy-Efficient Differential Frame Convolutional Accelerator with on-Chip Fusion Storage Architecture and Pixel-Level Pipeline Data Flow

Zhenhui Dai, Jiawei Wang, Yi Zhong, Kunyu Feng, Cheng Zhao, Yuanyuan Jiang, Peiyu Chen, Yuan Wang, Dun-Shan Yu, Xiao-Xin Cui

International Symposium on Circuits and Systems

DOI

2024

On-Chip Incremental Learning based on Unsupervised STDP Implementation

Guang Chen, Jian Cao, Shuo Feng, Zi-Lin Wang, Yi Zhong, Qibin Li, Xiongbo Zhao, Xing Zhang, Yuan Wang

International Conference on Artificial Intelligence Circuits and Systems

DOI

2024

How the Brain Achieves Real-Time Vision: A Spiking Position Perception Model

Kefei Liu, Jing-Jie Shang, Xiaoxin Cui, Chenglong Zou, Yisong Kuang, Kanglin Xiao, Yi Zhong, Yuan Wang

IEEE Transactions on Cognitive and Developmental Systems

DOI

2024

Marmotini: A Weight Density Adaptation Architecture With Hybrid Compression Method for Spiking Neural Network

Zi-Lin Wang, Yi Zhong, Zehong Ou, You-Ming Yang, Shuo Feng, Guang Chen, Xiao-Xin Cui, Song Jia, Yuan Wang

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

DOI

2024

Heterogeneous Integration of Diamond-on-Chip-on-Interposer for High-Performance Thermal Management in Supercomputing 2.5D Chiplets Packaging

Zeming Tao, Ningning Xu, Yixiong Wu, Yi Zhong, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management

Yi Zhong, Shuchao Bao, Yimin He, Ran He, Xiaofan Jiang, Hengbo Zhang, Yuchun Zhao, Yang Wang, Lu Zhao, Wenbiao Ruan, Yu Chen, Mingchuan Zhang, Daquan Yu

IEEE Electron Device Letters

DOI

2024

Failure Analysis on Abnormal Cracking of Flip-Chip Au Bumps During the High Temperature and Humidity Testing

Yi Zhong, Zhongliang Liu, Binbin Jiang, Dongxiao Yang, Weidong Zhong, Peiheng Wu, Tengteng He

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2024

Study of the Delamination Mechanism at the Interfaces Between Cu and Polyimide Layers for WLCSP

Binbin Jiang, Jiuhui Gan, Shuai Liu, Daquan Yu, Ruiyi Yu, Yi Zhong

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Significantly enhanced bonding strength in Al2O3/HfO2 using nanolaminate interfaces

Shangtong Zhou, Xiao‐Fan Jiang, Yi Zhong, Daquan Yu, Qijin Cheng

Surfaces and Interfaces

DOI

2024

Interdiffusion mechanism and thermal conductance at the interfaces in Cu-to-Cu bonds achieved by coating nanolayers

Xiao‐Fan Jiang, Zeming Tao, Yuan Li, Fangyuan Sun, Daquan Yu, Yi Zhong

Surfaces and Interfaces

DOI

2024

Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers

Yi Zhong, Shuchao Bao, Ran He, Xiao‐Fan Jiang, Hengbo Zhang, Wenbiao Ruan, Mingchuan Zhang, Daquan Yu

Journal of Material Science and Technology

DOI

2023

An Efficient Neuromorphic Implementation of Temporal Coding-Based On-Chip STDP Learning

Yi Zhong, Zi-Lin Wang, Xiaoxin Cui, Jian Cao, Yuan Wang

IEEE Transactions on Circuits and Systems - II - Express Briefs

DOI

2023

Real-Time Target Tracking System With Spiking Neural Networks Implemented on Neuromorphic Chips

Kefei Liu, Xiaoxin Cui, Xiang Ji, Yisong Kuang, Chenglong Zou, Yi Zhong, Kanglin Xiao, Yuan Wang

IEEE Transactions on Circuits and Systems - II - Express Briefs

DOI

2023

An Efficient Spiking Neural Network Accelerator with Sparse Weight

Zi-Lin Wang, Yi Zhong, You-Ming Yang, Xiao-Xin Cui, Yuan Wang

Biomedical Circuits and Systems Conference

DOI

2023

A Spiking Neural Network Accelerator based on Ping-Pong Architecture with Sparse Spike and Weight

Zi-Lin Wang, Yi Zhong, Xiaoxin Cui, Yisong Kuang, Yuan Wang

International Symposium on Circuits and Systems

DOI

2023

Unsupervised Learning of Spike-Timing-Dependent Plasticity Based on a Neuromorphic Implementation

Yi Zhong, Zi-Lin Wang, Xiaoxin Cui, Jian Cao, Yuan Wang

International Conference on Artificial Intelligence Circuits and Systems

DOI

2023

Development of Low Cost Glass-Based Deep Trench Capacitor for 3D Packaging

Zhihui Hu, Qing Jie Zhou, Haozhe Ma, Manyu Wang, Yi Zhong, Yuhang Dou, Daquan Yu

IEEE Electron Device Letters

DOI

2023

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Yu Chen, Shaocheng Wu, Yi Zhong, Rongbin Xu, Tian Yu, Jin Zhao, Daquan Yu

Sensors

DOI

2023

Fine Pitch Wafer-to-Wafer Hybrid Bonding for Three-Dimensional Integration

Xiaofan Jiang, Zeming Tao, Tian Yu, Binbin Jiang, Yi Zhong, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

On the optimization of molding warpage for wafer-level glass interposer packaging

Shuchao Bao, Wei Li, Yimin He, Yi Zhong, Long Zhang, Daquan Yu

Journal of Materials Science Materials in Electronics

DOI

2022

An Event-driven Spiking Neural Network Accelerator with On-chip Sparse Weight

Yisong Kuang, Xiaoxin Cui, Chenglong Zou, Yi Zhong, Zhenhui Dai, Zi-Lin Wang, Kefei Liu, Dun-Shan Yu, Yuan Wang

International Symposium on Circuits and Systems

DOI

2022

ESSA: Design of a Programmable Efficient Sparse Spiking Neural Network Accelerator

Yisong Kuang, Xiaoxin Cui, Zi-Lin Wang, Chenglong Zou, Yi Zhong, Kefei Liu, Zhenhui Dai, Dun-Shan Yu, Yuan Wang, Ru Huang

IEEE Transactions on Very Large Scale Integration (vlsi) Systems

DOI

2022

A Full-Neuron Memory Model Designed for Neuromorphic Systems

Kefei Liu, Xiaoxin Cui, Chenglong Zou, Yisong Kuang, Yi Zhong, Kanglin Xiao, Yuan Wang

International Conference on Artificial Intelligence Circuits and Systems

DOI

2022

An All-Neuron Spiking 2-D Path Integration and Map Representation Model Implemented on Neuromorphic Chips

Kefei Liu, Xiaoxin Cui, Yisong Kuang, Chenglong Zou, Yi Zhong, Kanglin Xiao, Yuan Wang

IEEE International Conference on Solid-State and Integrated Circuit Technology

DOI

2022

Study on Warpage of Interposer by Chip Distribution

Yimin He, Xiangjun Lu, Shuchao Bao, Yi Zhong, Mingchuan Zhang, Kai Feng Xue

International Conference on Integrated Circuits and Microsystems (ICICM)

DOI

2022

Study on the cracking mechanism of Au Bump during temperature-humidity test

Zhongliang Liu, Yi Zhong, Scott Chen, Xiao‐Yong Miao

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Low - Temperature Die to Glass Wafer Bonding Based on Au-Au Atomic Diffusion

Shuchao Bao, Yi Zhong, Yimin He, Ke Li, Daquan Yu

China Semiconductor Technology International Conference (CSTIC)

DOI

2022

Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter

Zuohuan Chen, Daquan Yu, Yi Zhong

Sensors

DOI

2022

Stress Issues in 3D Interconnect Technology Using Through Glass Vias

Jin Zhao, Wei Li, Yi Zhong, Daquan Yu, QIN Fei

Journal of Mechanical Engineering

DOI

2021

A 28-nm 0.34-pJ/SOP Spike-Based Neuromorphic Processor for Efficient Artificial Neural Network Implementations

Yisong Kuang, Xiaoxin Cui, Yi Zhong, Kefei Liu, Chenglong Zou, Zhenhui Dai, Dun-Shan Yu, Yuan Wang, Ru Huang

International Symposium on Circuits and Systems

DOI

2021

A 64K-Neuron 64M-1b-Synapse 2.64pJ/SOP Neuromorphic Chip With All Memory on Chip for Spike-Based Models in 65nm CMOS

Yisong Kuang, Xiaoxin Cui, Yi Zhong, Kefei Liu, Chenglong Zou, Zhenhui Dai, Yuan Wang, Dun-Shan Yu, Ru Huang

IEEE Transactions on Circuits and Systems - II - Express Briefs

DOI

2021

A fully asynchronous QDI mesh router based on 28nm standard cells

Qingyun Zou, Xiaoxin Cui, Yi Zhong, Zhenhui Dai, Yisong Kuang

International Conference on ASIC

DOI

2021

A Spike-Event-Based Neuromorphic Processor with Enhanced On-Chip STDP Learning in 28nm CMOS

Yi Zhong, Xiaoxin Cui, Yisong Kuang, Kefei Liu, Yuan Wang, Ru Huang

International Symposium on Circuits and Systems

DOI

2021

Low Temperature Bonding Polycrystalline Diamond to Si by Using Au Thin-layer for High-power Semiconductor Devices

Yi Zhong, Shuchao Bao, Ke Li, Mingchuan Zhang, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2019

A Hardware Implementation of SNN-Based Spatio-Temporal Memory Model

Kefei Liu, Xiaoxin Cui, Yi Zhong, Yisong Kuang, Yuan Wang, Hua-Jin Tang, Ru Huang

Frontiers in Neuroscience

DOI

PAICar : A prototype of embodied neuromorphic intelligent robot platform

Shuo Feng, Mingkai Liu, Jingyi Zhong, Guang Chen, Yi Zhong, Zi-Lin Wang, Chenglong Zou, Xiao-Xin Cui, Jian Cao, Yuan Wang

预印本

2023

Low Temperature Cu-to-Cu Bonding with High Thermal Boundary Conductance Achieved by Coating Metal Nanolayers

Xiaofan Jiang, Zeming Tao, Yuan Li, Fangyuan Sun, Daquan Yu, Yi Zhong

SSRN Electronic Journal

DOI

研究方向

三维集成电路芯粒集成芯片集成仿真设计 - 工艺流片宽禁带半导体集成材料科学与工程光电信息工程集成电路科学与工程

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