刘胜｜武汉大学｜学者主页

2026

升温载荷下玻璃通孔异质界面热机械可靠性评估及寿命预测

陈雨，丁笑越，李照天，梁康，杨晓锋，武晓娟，陈义强，车春城，刘胜，张召富

《电子与封装》

DOI

2026

混合键合界面力学行为的多尺度仿真：研究进展与挑战

蔡新添，舒朝玺，习杨，东芳，张适，严晗，刘胜，彭庆

《电子与封装》

2026

Dongliang Zhang, Xiang Sun, Wei Shen, Qijun Wang, Zhaofu Zhang, Chunmin Cheng, Yunfei Li Song, Jianshu Liu, Dong Fang, Zhiyin Gan, Gai Wu, Yuzheng Guo, Sheng Liu, Ching‐Ping Wong

Research

DOI

2024

微系统封装材料的时间相关特性

王诗兆，何涛，田志强，赵博，梁康，刘胜

《微电子学与计算机》

2024

2014

升温载荷下玻璃通孔异质界面热机械可靠性评估及寿命预测

混合键合界面力学行为的多尺度仿真：研究进展与挑战

半导体制造及封装中的翘曲测量方法与应用进展

Screening of Passivation Layer Materials for Low-Temperature Cu-Cu Hybrid Bonding via High-Throughput First-Principles Calculations

Warpage Bifurcation Behavior of SiC and Si Interposer Wafers: A Thermo-Mechanical Analysis via RVE Modeling

Study on the Evolution Mechanism of Micro-Bump Contact Resistance in Chiplet Packaging Considering Electro-Thermo-Mechanical Coupling

An integrated framework TSV-INet for arbitrarily distributed TSV interposer wafer warpage simulation

Wafer Warpage of Silicon Interposer in Manufacturing Processes for High Density 2.5D Advanced Packaging: Causes, Measurement, Analysis and Optimization

Monolithically Integrated Deep Ultraviolet Emitters With Electrode‐Engineered Light Polarization

Sputtered-AlN nucleation-layer engineering on patterned sapphire substrates enables highly efficient III-nitride light-emitting diodes

Facile Geometry Engineering of Deep Ultraviolet Micro‐Scale Light Emitting and Detecting Diodes for High‐Speed Free‐Space Optical Communication

Experimental and Multiphysics Simulation of Through Glass Vias Fabricated by Laser‐Induced Method: Model Prediction and Validation

Concentration-dependent suppression of thermal anisotropy in 4H-SiC by nitrogen doping

Interfacial stability and oxygen-vacancy-mediated bonding in YSZ/Si ceramic/semiconductor heterointerfaces

High-quality polycrystalline diamond fabrication from the perspective of zeta-potential-governed seeding

Tradeoff Between Quality Factor and Motional Resistance in TPoS Resonators Using Mechanically Coupled Architecture

High-Fidelity Fluid-Structure Interaction Analysis for Fragmentation Risk Assessment and Process Optimization of Wafers During Fluid Entry

Mechanism-Driven Deep Learning for Predicting the Impact of Hard Impurity Particles on Direct Wafer Bonding Performance

Machine Learning-Assisted Numerical Investigation on Multiphysics Coupling for Copper Electroplating in High-Aspect-Ratio Through-Glass Vias

Warpage Optimization for Near-Packaged Optics (NPO) in 3.2T Optical Modules for AI Computing Center Network Interconnects

Impact of Source Lead Structure and Material on Electro-Thermal-Mechanical Performance and Electromigration Reliability of TO-247-4 Packaged SiC MOSFETs

Numerical Reliability Assessment and Fatigue Life Extension of IGBT Modules Using Optimized Diamond/Metal Functionally Graded Baseplates

Reliability Simulation of Glass Substrate Modules under Mechanical Shock Loading and Optimization Design of Encapsulation Structures

Investigation of the deposition mechanism of Ta barrier layer atoms on the amorphous SiO 2 substrate from the atomic perspective

Numerical investigation on the drop impact reliability of Sn-rich solder joints: Effects of the anisotropic behaviors

Femtosecond Laser Etching for Microelectronic Chip Fabrication: Mechanisms, Applications, and Process Integration

Performance Enhancement of AlGaInP-Based Red Mini-LEDs Through Acetic Acid Chemical Treatment

Simulation-Guided Atomic Layer Deposition Enables Deterministic Interfacial Mechanics for Predictive Nanoimprint Lithography

Achieving Fermi-Level Depinning and Ideal Metal Contact in β -Ga 2 O 3 Devices via MXene Integration

High-sensitivity photothermal trace mass sensing in viscous fluids utilizing porous Cu-Ni FGM microcantilevers

Boosting External Quantum Efficiency and Thermal Stability of AlGaInP Red Mini-Light-Emitting Diodes for Active-Matrix Backlight Displays

A unified viscoelastic-viscoplastic constitutive framework for optically clear adhesives: Experiments, modeling, and FE validation

Design and topology optimization of a porous FGM micro-resonant sensor for high-sensitivity VOCs gas detection

Overcoming nanoscale roughness: Achieving near-bulk strength in direct diamond interface bonding

Mechanical modeling of wafer probe testing based on nanoindentation inverse identification

An Investigation into the Footing Profile Suppression in (110) Si Anisotropic Etching

Fabrication of diamond diaphragms by femtosecond laser etching for pressure sensing

Electronic, Dielectric, and Optical Properties of High- κ Oxides and Their Interfaces with Silicon

Defect-controlled Ir adsorption and interfacial responses on YSZ(001) surfaces

Near-junction thermal management for GaN/diamond HEMTs in extreme environments based on multiscale thermal simulation

Multi-Scale Modeling and Experimental Validation of Thermo-Mechanical Responses in Femtosecond Laser Micromachining of Copper

Mechanistic Study of FS Layer in IGBT: Exploring the Effects of Hydrogen and Phosphorus Implantation on Performance

Exploring the synergic effect of thermal tuning and mode-coupling for frequency stabilization in micromechanical resonators

Triggering avalanche-like ultraviolet photomultiplication phenomena in ultrathin amorphous/crystalline gallium nitride heterostructures

Temperature Dependence Modeling and Design Optimization of VCEsat in Carrier-Storage Trench-Gate IGBTs

A Novel FPC-Integrated SiC MOSFET Power Module With Ultralow Parasitic Inductance and Balanced Dynamic Current

Size-dependent vibration and frequency reversal mechanism in porous Ni-Al 2 O 3 microplates: a modified couple stress theory approach

A New Packaging Design Method for IGBT Modules Based on a Common-Emitter Inductance Decoupling Technology

Theoretical insights into β-Ga2O3/diamond heterojunction interfaces: Surface selection, band alignment, and interfacial interaction

Ultra‐Transparent Epitaxy Architecture Enabling High‐Efficiency AlGaN‐Based Deep‐Ultraviolet Light‐Emitting Diodes

Multiscale investigation of thermal transport in β-Ga2O3-based heterointerfaces enabled by machine learning potential: cross-scale parameter

Machine learning assisted multiphysics simulation for electroplating copper in high aspect ratio through silicon via

High‐Quality Silicon‐Based Diamond Growth Based on a Femtosecond Laser‐Induced Diamond Nucleation

Enhancing film bulk acoustic resonators performance by optimizing AlN seed layer crystallinity and polarity alignment

High-reliability backside absolute piezoresistive pressure sensors for automotive applications

Mechanistic Study of Front-Side Structural in IGBT: Exploring the Effects of True Gate and Contact Proportions on Performance

Systematic investigation of temperature dependences of elastic constants of heavily doped silicon via machine learning-based molecular dynamics

The effect of metal doping on the piezoelectric response of AlN film ultrasonic transducers

Atomic Insights of Irradiation-Induced Thermal Conductivity Degradation in β-Ga 2 O 3

Explainable Analysis and Optimization of the Thermal Field in Gallium Oxide Single Crystal Growth Based on Machine Learning

Numerical Analysis of Hydrogen Implant Process on Performance of Field-Stop-IGBT

Mechanism of Laser Stealth Dicing in Single-Crystal Silicon: Insights from Molecular Dynamics and Experiments

Modeling and Simulation of Thermal Stress in Deep Trench Capacitors Based on Three-Dimensional Elasticity and Shell Theory

Robustness of GaN/SiC Cascode Devices under Repetitive Unclamped Inductive Switching

基于试验与仿真的CBGA焊点寿命预测技术

Doped LiNbO3:Me (Me = V, Zn, Ti, Zr, Al, Cr, Co, Mo, Fe, Y, Ta) piezoelectric films for ultrasonic transducers

A microcantilever biosensor based on functionally graded materials: achieving highly sensitive detection of cell mass in various fluid environments

Study on the influence of different pattern structures and densities of AlN substrates on the crystalline quality of GaN epitaxial thin films based on molecular dynamics simulation

Experimental evaluation of a hyperelastic-viscoplastic constitutive model for packaging adhesives: Comparison with deep learning methods

A comprehensive exploration of thermal transport at Cu/diamond interfaces via machine learning potentials

Exploring atomic structural evolution and mechanical properties of AlN during laser stealth dicing through molecular dynamics

Polarization-engineered electron transport in β -Ga2O3/SiC heterojunctions: Atomic-scale modulation via SiC polymorphic selection

Design and performance of a bistable AlN thick film piezoelectric energy harvester

High-performance AlGaInP-based red flip-chip mini-LEDs with AlN passivation layer

A temperature-dependent viscoelastic model for silicone adhesives with comparative verification via deep learning

Junction Temperature Monitoring of IGBT Module Using Industrial Digital Twin

Band Alignment Engineering in β-Ga2O3/4H-SiC Polar Heterojunctions via Orientation Selection: Interfacial Band Edge States and Hole Trapping

Efficiency enhancement of AlGaInP-based red mini-LEDs by a HfO 2 -based hybrid passivation layer