刘子玉｜复旦大学｜学者主页

2026

SMS-EMOA-Driven Multiobjective Design-Technology Co-Optimization for 5-nm Gate-All-Around Transistors

Hongwei Yao, Xinyu Zou, Xingyu Shang, Jianing Zhang, Xiaojin Li, Yang Shen, Ziyu Liu, Bingyi Ye, Yuhang Zhang, Yanling Shi, Y W Sun

IEEE Transactions on Electron Devices

DOI

2026

Pre-bond Surface Treatment of Titanium for Direct Cu-Cu Bonding Applications

Nanjiang Yuan, Han Jiang, Xianlong Wang, Ziyu Liu, Jinzhu Li, Qicun Lou

IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI

2026

Process-induced thermal conductivity degradation in Cu micro pads for 3D-IC hybrid bonding revealed by spatially resolved frequency-domain thermoreflectance

Yang Lu, Rui Zhou, Han Jiang, Shuo Qiao, Jiaqi Gu, Yanguang Zhou, Baoling Huang, Lin Yang, Ziyu Liu, Qiye Zheng

Applied Thermal Engineering

DOI

2026

CMP-Free Organic Hybrid Bonding Based on Mechanical Interlock Structure via Surface Treatments for 3-D Integration

Jinzhu Li, Qicun Lou, Xinyao Wang, Mingze Ban, Wenchao Wang, Ziyu Liu, Hao Zhu, Qingqing Sun, Lin Chen, Yabin Sun, David Wei Zhang

IEEE Electron Device Letters

DOI

2026

Particle Removal by Surface Protection and Adhesion in the Wafer Dicing Applied to Chip-to-Wafer Hybrid Bonding

Hao Wang, Haoyue Song, Ziyu Liu, Jingxuan Wei, Han Jiang, Yabin Sun, Hao Zhu, Qingqing Sun, D Y Zhang

IEEE Transactions on Semiconductor Manufacturing

DOI

2026

Novel Reconfigurable Feedback Field-Effect Transistor With Single Gate for Unified RAM (URAM) and In-Memory-Computing Applications

Yuhao Zhou, Yang Shen, Yuhang Zhang, Bingyi Ye, Xiaojin Li, Ziyu Liu, Yabin Sun

IEEE Transactions on Electron Devices

DOI

2026

Assessment of Capacitorless DRAM Based on Stacked Nanosheet Feedback Field-Effect Transistors With Tree-Type Channel

Yuhao Zhou, Xinyu Zou, Yang Shen, Yuhang Zhang, Bingyi Ye, Xiaojin Li, Ziyu Liu, Yabin Sun

IEEE Transactions on Electron Devices

DOI

2026

Novel Triple-Gate Nanosheet RFET With Embedded SiGe Surrounding Channel for Enhanced On-State Current

Xinyu Zou, Yuhao Zhou, Fu Gong, Ziyu Liu, Xiaojin Li, Yang Shen, Bingyi Ye, Y. G. Zhang, Yanling Shi, Yabin Sun

IEEE Transactions on Electron Devices

DOI

2026

A Physics-Constrained Neural Network Method for Compact Modeling of Semiconductor Devices

Fu Gong, Xinyu Zou, Yuhang Zhang, Yang Shen, Bingyi Ye, Xiaojin Li, Shaoqiang Chen, Fei Lu, Xinyu Dong, Ziyu Liu, Yabin Sun

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

DOI

2026

Simulation Study on the Laser Heating Mechanism of Laser-Assisted Bonding Based on the Beer-Lambert Absorption Law

Shaoyu Ma, Yinan Li, Ziyu Liu, Juan Tao, Lin Chen, Qingqing Sun, Chengyong Zhang, Yabin Sun

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Polyimide-Based Low-Temperature Heterogeneous Bonding for Versatile Substrate Integration

Junyu Ye, Qicun Lou, Jingzhe Liu, Ziyu Liu, Lin Chen, Qingqing Sun, Yabin Sun

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Low Temperature In-PI Hybrid Bonding for Temperature-Sensitive 3D Heterogeneous Device Integration

Qicun Lou, Junyu Ye, Jingzhe Liu, Xianlong Wang, Ziyu Liu, Lin Chen, Qingqing Sun, Yabin Sun

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Non-CMP Cu/SiO 2 Hybrid Bonding Based on Interlocking Structure

Nanjiang Yuan, Han Jiang, Lin Chen, Qingqing Sun, Ziyu Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Low Temperature C2C Cu/SiO 2 Hybrid Bonding with In Passivation Layer

Xianlong Wang, Han Jiang, Qicun Lou, Ziyu Liu, Lin Chen, Qingqing Sun, Yabin Sun

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Thermal Modeling and Topology Optimization of Through-Silicon Via Arrays in 3D Integrated Chips Based on Reduced-Order Methodology

Hao Sun, Ziyu Liu, Yabin Sun, Shijiao Liu, Delong Qiu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

A Novel Polishing Slurry for CMP Process of Cu/SiO 2 Hybrid Interface

Kaiwen Luo, Han Jiang, Lin Chen, Qingqing Sun, Ziyu Liu, Yabin Sun

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

TCAD Simulations of Reconfigurable Field-Effect Transistor With Toothed Spacer to Improve On-Current

Chao Wang, Yang Shen, Yuhang Zhang, Bingyi Ye, Ziyu Liu, Xiaojin Li, Yanling Shi, Shaoqiang Chen, Fei Lu, Xinyu Dong, Yabin Sun

IEEE Transactions on Electron Devices

DOI

2025

Physical mechanism characterization and verification of High-Uniformity Ultra-Thin wafer thinning

Jinzhu Li, Ziyu Liu, Yabin Sun, Hao Zhu, Qingqing Sun, David Wei Zhang

Applied Physics A

DOI

2025

Measurement and improvement of Polyimide surface energy applied for novel PI-Cu hybrid bonding

Jinzhu Li, Qicun Lou, Ziyu Liu, Mingze Ban, Xinyao Wang, Zeyu Ning, Yang Li, Lin Chen, Qingqing Sun

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2025

Fringe gate capacitance model for nanowire reconfigurable field effect transistors

Mengge Jin, Fu Gong, Yang Shen, Yuhang Zhang, Bingyi Ye, Shaoqiang Chen, Xinyu Dong, Fei Lu, Ziyu Liu, Xiaojin Li, Yanling Shi, Yabin Sun

Micro and Nanostructures

DOI

2025

Evaluation of random process fluctuation and geometry dependence in nanosheet reconfigurable transistor

Chao Wang, Jianing Zhang, Ziyu Liu, Xiaojin Li, Yanling Shi, Shaoqiang Chen, Fei Lu, Xinyu Dong, Yang Ting Shen, Yabin Sun

Micro and Nanostructures

DOI

2025

Novel Negative Capacitance Reconfigurable Transistor With Arch-Shaped Source

Hongbo Ye, Junfeng Hu, Xinyu Zou, Zihan Sun, Xianglong Li, Yang Shen, Ziyu Liu, Xiaojin Li, Yanling Shi, Zhigang Mao, Yabin Sun

IEEE Transactions on Nanotechnology

DOI

2025

A Novel Pretreatment Approach to High-quality SiO 2 Surface Applied for C2W Cu/SiO 2 Hybrid Bonding

Han Jiang, Xianlong Wang, Ziyu Liu, Yabin Sun

IEEE International Conference on ASIC (ASICON)

DOI

2024

“硅通孔三维互连与集成技术”专题前言

刘子玉

《电子与封装》

2024

Multi-Chip 3D Integration Using Mechanical Interlock Bonding (MIB) Technology and Optimized TSV

Hao Wang, Ziyu Liu, Yang Wang, Jinzhu Li, Lin Chen, Qingqing Sun

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Modeling and Simulation of a Conical 3D Monopole Antenna Embedded in Substrate for WNoC

Junhao Wang, Ziyu Liu, Zhiyuan Zhu, Lin Chen, Qingqing Sun, Wei David Zhang

DOI

2024

A Novel Nontraditional Approach to C2W Cu/SiO2 Hybrid Bonding

Han Jiang, Ziyu Liu, Chen Lin, Chuandong Li, Zeyu Ning, Lin Chen, Jeff Xu, Qingqing Sun

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

EMIB Packages Simulation for Heterogeneous Integration of GaN and Si High-Power Devices

Nana Pan, Ziyu Liu, Yudi Ju, Han Jiang, Yun Yin, Qingqing Sun, Lin Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Electrical Simulation Model to Improve Through-Silicon Capacitor(TSC) Capacitance

Jianhang Yuan, Ziyu Liu, Yudi Ju, Han Jiang, Qingqing Sun

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Design Rule of Thick-Resist Lithography for Sidewall Perpendicularity and Critical Dimension Fidelity

Jieyu Zhou, Yabin Sun, Ziyu Liu, Yanling Shi, David Wei Zhang, Junhai Jiang, Weijie Shi

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Novel Reconfigurable Transistor With Extended Source/Drain Beyond 3 nm Technology Node

Hongbo Ye, Junfeng Hu, Ziyu Liu, Chao Wang, Xiaojin Li, Yanling Shi, Zhigang Mao, Yabin Sun

IEEE Transactions on Electron Devices

DOI

2024

The Roadmap of 2D Materials and Devices Toward Chips

Anhan Liu, Xiaowei Zhang, Ziyu Liu, Yuning Li, Xueyang Peng, Xin Li, Yue Qin, Hu Chen, Yanqing Qiu, Han Jiang, Yang Wang, Yifan Li, Jun Tang, Jun Liu, Hao Guo, Tao Deng, Songang Peng, He Tian, Tian‐Ling Ren

Nano-Micro Letters

DOI

2024

Study on Enhancing Adhesion and Reliability in Wafer-Level Fan-Out Packaging

Wenjing Cui, Ziyu Liu, Jieyu Zhou, Hongye Liu, Yabin Sun, Lin Chen, Qingqing Sun

Journal of Electrotechnology Electrical Engineering and Management

DOI

2024

Application and Optimization of Laser-Assisted Bonding (LAB) in Multi-Chip Integration

Cheng-Yong Zhang, Ziyu Liu, Shijin Ding, Jason Ho, Zhigang Zhu, Cheng Zhang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Etching scallop-less nano-TSV with F/O coupling plasma

Yang Wang, Ziyu Liu, Jinzhu Li, Qingqing Sun, Lin Chen, David Wei Zhang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Modeling and Simulation of a High Bandwidth Conical 3D Monopole Antenna for 3D IC

Yang Wang, Yudi Ju, Ziyu Liu, Qingqing Sun, Lin Chen, David Wei Zhang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

A stress evaluation approach for the silicon with nano-TSVs by Raman spectroscopy

Luchao Wu, Ziyu Liu, Jun Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

FEA study on the TSV copper filling influenced by the additives and electroplating process

Zifeng Zhao, Ziyu Liu, Lin Chen, Qingqing Sun, Hongye Liu, Yabin Sun

Microelectronic Engineering

DOI

2023

A Method for Fast Au-Sn Bonding at Low Temperature Using Thermal Gradient

Wenchao Wang, Ziyu Liu, Delong Qiu, Zhiyuan Zhu, Na Yan, Shijin Ding, David Wei Zhang

Micromachines

DOI

2023

Novel Reconfigurable Field-Effect Transistor With Surrounded Source/Drain to Improve On-State Current

Junfeng Hu, Chao Wang, Yabin Sun, Ziyu Liu, Xiaojin Li, Yanling Shi

IEEE Transactions on Electron Devices

DOI

2023

Surface Protecting and Particles Removing after Wafer Sawing for Die-to-wafer Hybrid Bonding

Hao Wang, Ziyu Liu, Wenchao Wang, Hao Zhu, Lin Chen, Qingqing Sun

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Optimization of Wafer-level TTV Using RIE Applied for the Extreme Wafer Thinning

Jinzhu Li, Ziyu Liu, Wenchao Wang, Yang Wang, Lin Chen, Qingqing Sun

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Compact Modeling of Process Variations in Nanosheet Complementary FET (CFET) and Circuit Performance Predictions

Xiaoqiao Yang, Yabin Sun, Xiaojin Li, Yanling Shi, Ziyu Liu

IEEE Transactions on Electron Devices

DOI

2023

Special Issue “Building Three-Dimensional Integrated Circuits and Microsystems”

Zhiyuan Zhu, Sixiang Zhang, Shenglin Ma, Ziyu Liu

Processes

DOI

2023

Thermal Finite Element Simulation of Ultrafine Pitch Chip-to-Wafer Hybrid Bonding

Weimin Liu, Ziyu Liu, Yang Wang, Lin Chen, Qingqing Sun, David Wei Zhang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

Fast low-temperature–pressure Cu-Sn mechanical interlock bonding (MIB) applied for 3D integration

Hao Wang, Ziyu Liu, Lin Chen, Qingqing Sun, Yabin Su, David Wei Zhang

Materials Letters

DOI

2022

Thermal–Mechanical and Signal Reliability of a New Differentiated TSV

Ziyu Liu, Han Jiang, Zhiyuan Zhu, Lin Chen, Qingqing Sun, Yabin Sun, David Wei Zhang

IEEE Transactions on Electron Devices

DOI

2022

Stress Analysis and Layout Optimization of Nano-TSV in an Advanced Packaging

Luchao Wu, Ziyu Liu, Jun Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Crosstalk Noise of Octagonal TSV Array Arrangement Based on Different Input Signal

Ziyu Liu, Han Jiang, Ziyuan Zhu, Lin Chen, Qingqing Sun, Wei Zhang

Processes

DOI

2022

Novel 3-D Fin-RFET With Dual-Doped Source/Drain to Improve ON-State Current

Rui Zhang, Y.-J. Yang, Yabin Sun, Ziyu Liu, Yun Liu, Xiaojin Li, Yanling Shi

IEEE Transactions on Electron Devices

DOI

2022

3-D Modeling of Fringe Gate Capacitance in Complementary FET (CFET)

Xiaoqiao Yang, Yabin Sun, Ziyu Liu, Yun Liu, Xiaojin Li, Yanling Shi

IEEE Transactions on Electron Devices

DOI

2022

Equivalent Circuit and Parasitic Parameter Extraction of 3D comb-like Redistribution Layer Applied for FOWLP

Long Bai, Zhiyuan Zhu, Ziyu Liu, Lin Chen, Qingqing Sun, Wei David Zhang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Low Temperature Au/Sn Solid-Liquid Diffusion Chip-to-Chip Bonding for MEMS Encapsulation

Wenchao Wang, Ziyu Liu, Zhu Zhiyuan, Lin Chen, Sun Qingqing

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Sub-THz Small-Signal Equivalent Circuit Model and Parameter Extraction for 3 nm Gate-All-Around Nanosheet Transistor

Yabin Sun, Hengbin Gao, Shaojian Hu, Ziyu Liu, Xiaojin Li, Yun Liu, Yanling Shi

Processes

DOI

2022

Impact of Process Variation on Nanosheet Gate-All-Around Complementary FET (CFET)

Xiaoqiao Yang, Xianglong Li, Ziyu Liu, Yabin Sun, Yun Liu, Xiaojin Li, Yanling Shi

IEEE Transactions on Electron Devices

DOI

2022

Design and simulation to reduce the crosstalk of ultra-fine line width/space in the redistribution layer

Ziyu Liu, Long Bai, Ziyuan Zhu, Lin Chen, Qingqing Sun

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2022

Design Optimization of Nanotube Tunnel Field-Effect Transistor with Bias-Induced Electron-Hole Bilayer

Xueke Wang, Yabin Sun, Ziyu Liu, Yun Liu, Xiaojin Li, Yanling Shi

Silicon

DOI

2021

Crosstalk of octagonal TSV array arrangement based on differential signal

Han Jiang, Ziyu Liu, Ziyuan Zhu, Lin Chen, Qingqing Sun

IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI

2021

Improved MEOL and BEOL Parasitic-Aware Design Technology Co-Optimization for 3 nm Gate-All-Around Nanosheet Transistor

Yabin Sun, Meng Wang, Xianglong Li, Shaojian Hu, Ziyu Liu, Yun Liu, Xiaojin Li, Yanling Shi

IEEE Transactions on Electron Devices

DOI

2021

Impact of Process Fluctuations on RF Small-Signal Parameter of Gate-All-Around Nanosheet Transistor Beyond 3 nm Node

Yabin Sun, Hengbin Gao, Xianglong Li, Xiaoqiao Yang, Ziyu Liu, Yun Liu, Xiaojin Li, Yanling Shi

IEEE Transactions on Electron Devices

DOI

2021

Vertically Stacked Nanosheets Tree-Type Reconfigurable Transistor With Improved ON-Current

Yabin Sun, Xianglong Li, Ziyu Liu, Yun Liu, Xiaojin Li, Yanling Shi

IEEE Transactions on Electron Devices

DOI

2021

Evaluation of Single-Event-Transient Effects in Reconfigurable Field Effect Transistor Beyond 3 nm Technology Node

Yabin Sun, Jingyan Shao, Ziyu Liu, Xiaojin Li, Yun Liu, Yanling Shi

IEEE Transactions on Electron Devices

DOI

2021

Low Temperature and Short Time Au/Sn Solid-liquid Diffusion Bonding for 3D Integration

Ziyu Liu, Wenchao Wang, Zhu Zhiyuan, Lin Chen, Qingqing Sun

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2021

Design and Simulation of 3D Antenna Based on Conical Via Structure

Ziyu Liu, Junhao Wang, Zhiyuan Zhu, Lin Chen, Qingqing Sun

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2021

Enhanced logic gates and SRAM based on reconfigurable field-effect transistor with asymmetric spacer engineering

Zihan Sun, Xianglong Li, Yan Yao, Yabin Sun, Ziyu Liu, Yun Liu, Xiaojin Li, Yanling Shi

Semiconductor Science and Technology

DOI

2021

Evaluation of total-ionizing-dose effects on reconfigurable field effect transistors and SRAM circuits

Jingyan Shao, Xianglong Li, Ziyu Liu, Teng Wang, Yabin Sun, Yun Liu, Xiaojin Li, Yanling Shi

Semiconductor Science and Technology

DOI

2021

Performance Trade-offs in Complementary FET (CFET) Device Architectures for 3nm-node and Beyond

Xiaoqiao Yang, Yabin Sun, Ziyu Liu, Yanling Shi, Xiaojin Li

IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI

2021

Performance Evaluation of Negative Capacitance Reconfigurable Field Effect Transistor for Sub 10 nm Integration

Zihan Sun, Xianglong Li, Yabin Sun, Ziyu Liu, Yanling Shi, Xiaojin Li

IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI

2021

Simulation of fast room-temperature bonding by mechanical interlock structure applied for 3D integration

Ziyu Liu, Yaomin Gong, Lin Chen, Qingqing Sun, Wei Zhang

IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI

2021

Impact of Process Fluctuations on Reconfigurable Silicon Nanowire Transistor

Xianglong Li, Xiaoqiao Yang, Zhe Zhang, Teng Wang, Yabin Sun, Ziyu Liu, Xiaojin Li, Yanling Shi, Jun Xu

IEEE Transactions on Electron Devices

DOI

2020

Analysis of gate-induced drain leakage in gate-all-around nanowire transistors

Yabin Sun, Yaxin Tang, Xiaojin Li, Yanling Shi, Teng Wang, Jun Xu, Ziyu Liu

Journal of Computational Electronics

DOI

2020

Analysis of Metal Work-Function Modulation Effect in Reconfigurable Field-Effect Transistor

Xianglong Li, Yabin Sun, Ziyu Liu, Xiaojin Li, Yanling Shi, Teng Wang, Jun Xu

IEEE Transactions on Electron Devices

DOI

2020

Electronic Assessment of Novel Arch-Shaped Asymmetrical Reconfigurable Field-Effect Transistor

Xianglong Li, Yabin Sun, Xiaojin Li, Yanling Shi, Ziyu Liu

IEEE Transactions on Electron Devices

DOI

2020

Simulation of location and size effects on performance adjustment in hybrid N-type MOSFETs

Renhua Liu, Yabin Sun, Qin Huang, Xiaojin Li, Yanling Shi, Changfeng Wang, Duanquan Liao, Ming Li Tian, Ziyu Liu

Materials Science in Semiconductor Processing

DOI

2020

Novel Reconfigurable Field-Effect Transistor With Asymmetric Spacer Engineering at Drain Side

Yan Yao, Yabin Sun, Xiaojin Li, Yanling Shi, Ziyu Liu

IEEE Transactions on Electron Devices

DOI

2016

Detection and formation mechanism of micro-defects in ultrafine pitch Cu Cu direct bonding

刘子玉，蔡坚，王谦，陈瑜

Chinese Physics B

2012

系统级封装(SiP)技术研究现状与发展趋势

胡杨，蔡坚，曹立强，陈灵芝，刘子玉，石璐璐，王谦

精选作品

期刊论文

SMS-EMOA-Driven Multiobjective Design-Technology Co-Optimization for 5-nm Gate-All-Around Transistors

Pre-bond Surface Treatment of Titanium for Direct Cu-Cu Bonding Applications

Process-induced thermal conductivity degradation in Cu micro pads for 3D-IC hybrid bonding revealed by spatially resolved frequency-domain thermoreflectance

CMP-Free Organic Hybrid Bonding Based on Mechanical Interlock Structure via Surface Treatments for 3-D Integration

Particle Removal by Surface Protection and Adhesion in the Wafer Dicing Applied to Chip-to-Wafer Hybrid Bonding

Novel Reconfigurable Feedback Field-Effect Transistor With Single Gate for Unified RAM (URAM) and In-Memory-Computing Applications

Assessment of Capacitorless DRAM Based on Stacked Nanosheet Feedback Field-Effect Transistors With Tree-Type Channel

Novel Triple-Gate Nanosheet RFET With Embedded SiGe Surrounding Channel for Enhanced On-State Current

A Physics-Constrained Neural Network Method for Compact Modeling of Semiconductor Devices

Simulation Study on the Laser Heating Mechanism of Laser-Assisted Bonding Based on the Beer-Lambert Absorption Law

Polyimide-Based Low-Temperature Heterogeneous Bonding for Versatile Substrate Integration

Low Temperature In-PI Hybrid Bonding for Temperature-Sensitive 3D Heterogeneous Device Integration

Non-CMP Cu/SiO 2 Hybrid Bonding Based on Interlocking Structure

Low Temperature C2C Cu/SiO 2 Hybrid Bonding with In Passivation Layer

Thermal Modeling and Topology Optimization of Through-Silicon Via Arrays in 3D Integrated Chips Based on Reduced-Order Methodology

A Novel Polishing Slurry for CMP Process of Cu/SiO 2 Hybrid Interface

TCAD Simulations of Reconfigurable Field-Effect Transistor With Toothed Spacer to Improve On-Current

Physical mechanism characterization and verification of High-Uniformity Ultra-Thin wafer thinning

Measurement and improvement of Polyimide surface energy applied for novel PI-Cu hybrid bonding

Fringe gate capacitance model for nanowire reconfigurable field effect transistors

Evaluation of random process fluctuation and geometry dependence in nanosheet reconfigurable transistor

Novel Negative Capacitance Reconfigurable Transistor With Arch-Shaped Source

A Novel Pretreatment Approach to High-quality SiO 2 Surface Applied for C2W Cu/SiO 2 Hybrid Bonding

“硅通孔三维互连与集成技术”专题前言

Multi-Chip 3D Integration Using Mechanical Interlock Bonding (MIB) Technology and Optimized TSV

Modeling and Simulation of a Conical 3D Monopole Antenna Embedded in Substrate for WNoC

A Novel Nontraditional Approach to C2W Cu/SiO2 Hybrid Bonding

EMIB Packages Simulation for Heterogeneous Integration of GaN and Si High-Power Devices

Electrical Simulation Model to Improve Through-Silicon Capacitor(TSC) Capacitance

Design Rule of Thick-Resist Lithography for Sidewall Perpendicularity and Critical Dimension Fidelity

Novel Reconfigurable Transistor With Extended Source/Drain Beyond 3 nm Technology Node

The Roadmap of 2D Materials and Devices Toward Chips

Study on Enhancing Adhesion and Reliability in Wafer-Level Fan-Out Packaging

Application and Optimization of Laser-Assisted Bonding (LAB) in Multi-Chip Integration

Etching scallop-less nano-TSV with F/O coupling plasma

Modeling and Simulation of a High Bandwidth Conical 3D Monopole Antenna for 3D IC

A stress evaluation approach for the silicon with nano-TSVs by Raman spectroscopy

FEA study on the TSV copper filling influenced by the additives and electroplating process

A Method for Fast Au-Sn Bonding at Low Temperature Using Thermal Gradient

Novel Reconfigurable Field-Effect Transistor With Surrounded Source/Drain to Improve On-State Current

Surface Protecting and Particles Removing after Wafer Sawing for Die-to-wafer Hybrid Bonding

Optimization of Wafer-level TTV Using RIE Applied for the Extreme Wafer Thinning

Compact Modeling of Process Variations in Nanosheet Complementary FET (CFET) and Circuit Performance Predictions

Special Issue “Building Three-Dimensional Integrated Circuits and Microsystems”

Thermal Finite Element Simulation of Ultrafine Pitch Chip-to-Wafer Hybrid Bonding

Fast low-temperature–pressure Cu-Sn mechanical interlock bonding (MIB) applied for 3D integration

Thermal–Mechanical and Signal Reliability of a New Differentiated TSV

Stress Analysis and Layout Optimization of Nano-TSV in an Advanced Packaging

Crosstalk Noise of Octagonal TSV Array Arrangement Based on Different Input Signal

Novel 3-D Fin-RFET With Dual-Doped Source/Drain to Improve ON-State Current

3-D Modeling of Fringe Gate Capacitance in Complementary FET (CFET)

Equivalent Circuit and Parasitic Parameter Extraction of 3D comb-like Redistribution Layer Applied for FOWLP

Low Temperature Au/Sn Solid-Liquid Diffusion Chip-to-Chip Bonding for MEMS Encapsulation

Sub-THz Small-Signal Equivalent Circuit Model and Parameter Extraction for 3 nm Gate-All-Around Nanosheet Transistor

Impact of Process Variation on Nanosheet Gate-All-Around Complementary FET (CFET)

Design and simulation to reduce the crosstalk of ultra-fine line width/space in the redistribution layer

Design Optimization of Nanotube Tunnel Field-Effect Transistor with Bias-Induced Electron-Hole Bilayer

Crosstalk of octagonal TSV array arrangement based on differential signal

Improved MEOL and BEOL Parasitic-Aware Design Technology Co-Optimization for 3 nm Gate-All-Around Nanosheet Transistor

Impact of Process Fluctuations on RF Small-Signal Parameter of Gate-All-Around Nanosheet Transistor Beyond 3 nm Node

Vertically Stacked Nanosheets Tree-Type Reconfigurable Transistor With Improved ON-Current

Evaluation of Single-Event-Transient Effects in Reconfigurable Field Effect Transistor Beyond 3 nm Technology Node

Low Temperature and Short Time Au/Sn Solid-liquid Diffusion Bonding for 3D Integration

Design and Simulation of 3D Antenna Based on Conical Via Structure

Enhanced logic gates and SRAM based on reconfigurable field-effect transistor with asymmetric spacer engineering

Evaluation of total-ionizing-dose effects on reconfigurable field effect transistors and SRAM circuits

Performance Trade-offs in Complementary FET (CFET) Device Architectures for 3nm-node and Beyond

Performance Evaluation of Negative Capacitance Reconfigurable Field Effect Transistor for Sub 10 nm Integration

Simulation of fast room-temperature bonding by mechanical interlock structure applied for 3D integration

Impact of Process Fluctuations on Reconfigurable Silicon Nanowire Transistor

Analysis of gate-induced drain leakage in gate-all-around nanowire transistors

Analysis of Metal Work-Function Modulation Effect in Reconfigurable Field-Effect Transistor

Electronic Assessment of Novel Arch-Shaped Asymmetrical Reconfigurable Field-Effect Transistor

Simulation of location and size effects on performance adjustment in hybrid N-type MOSFETs

Novel Reconfigurable Field-Effect Transistor With Asymmetric Spacer Engineering at Drain Side

Detection and formation mechanism of micro-defects in ultrafine pitch Cu Cu direct bonding

系统级封装(SiP)技术研究现状与发展趋势

预印本