张柯柯｜河南科技大学｜学者主页

2026

富氧近α钛合金复合片层组织的微织构生成机制和力学行为

张海瑞，牛红志，张德良，张柯柯，陈光

《材料工程》

2026

激光熔覆钛合金粉末效率的多因素协同作用分析

秦子艺，肖笑，张柯柯，吴东升，孙康，张毅，内田成明

《材料热处理学报》

2026

激光功率对激光-电弧复合增材制造AZ31镁合金成形质量、微观组织与力学性能的影响

丁有粮，刘武猛，薛智涵，张萌，马宁，肖笑，张柯柯，李会军，SHIGEAKI Uchida，孙明非

《中国有色金属学报》

2026

通过表面改性的纳米ZrO2和微米T-ZnOw混杂增强体协同改善Sn1.0Ag0.5Cu复合焊料的强塑性（英文）

霍福鹏，陈传彤，金智，刘训达，张柯柯，Hiroshi NISHIKAWA

Transactions of Nonferrous Metals Society of China

2026

Sn2.5Ag0.7Cu0.1RE/Cu焊点电迁移组织与性能

张海洲，张柯柯，赵文嘉，张彦振，张超

《材料热处理学报》

2026

Ni/C/Al2O3增强Sn1.0Ag0.5Cu复合钎料及其钎焊接头的组织性能

吴金娜，张柯柯，王冰莹，张彦振，张超

《材料热处理学报》

DOI

2026

In-situ phase engineering strategy for enhancing the mechanical and tribological performance of AlCoCrFeNi2.1 high-entropy alloy

Wei Yang, Keke Zhang, Xiao Xiao, Daxin Zeng, Hong-Xiang Zhang, Jian-Yong Liu, Tian-Guo Wang, Hui Zhang

Journal of Materials Research and Technology

DOI

2026

Cathode jet and columnar grain suppression in oscillating arc-wire directed energy deposition of titanium alloy

K. Sun, Xiao Xiao, Shigeaki Uchida, Pengkang Zhao, Dong-Sheng Wu, Hisaya Komen, Ning Ma, Keke Zhang, Manabu Tanaka, Hui-Jun Li

Journal of Materials Processing Technology

DOI

2026

Achieving high-quality hybrid laser- arc directed energy deposition of titanium alloy

Xiao Xiao, Shuai-Jun Bai, Dong-Sheng Wu, Hisaya Komen, Keke Zhang, Yi Zhang, Shigeaki Uchida, Manabu Tanaka, Li-Jin Huang

Additive Manufacturing Frontiers

DOI

2026

Microstructural evolution, properties, and failure behavior of Sn2.5Ag0.7Cu0.1RE/Cu solder joints under electromigration conditions

Hailong Zhang, Keke Zhang, Yanzhen Zhang, Wenjia Zhao, Fupeng Huo, Chao Zhang

Journal of Materials Science Materials in Electronics

DOI

2026

Effect of Cu substrate surface modification on wettability and interfacial reaction of tin-based lead-free composite solder

Huigai Wang, Yuhui Zhao, Keke Zhang, Meng Zhang

Welding in the World

DOI

2026

Fabrication of Ni/C/Al2O3-reinforced Sn1.0Ag0.5Cu composite solder and isothermal aging behavior of soldered joints

Jina Wu, Keke Zhang, Bingying Wang, Di Zhao, Fupeng Huo, Uchida Shigeaki, Hiroshi Nishikawa

Materials Characterization

DOI

2025

(Cu-15Ti)+SiC反应-复合扩散钎焊Cf/SiC复合材料与不锈钢

王永雷，李宇航，王世国，张柯柯

《焊接》

2025

电流应力下Sn/Cu微焊点组织与阴极失效

赵文嘉，张柯柯，张海洲，张彦振，刘柱，张超

《中国有色金属学报》

2025

镍涂层Al2O3增强低银SnAgCu复合钎料的制备及钎焊性能（英文）

王冰莹，张柯柯，范玉春，吴金娜，郭李梦，王悔改，王楠楠

《稀有金属材料与工程》

2025

CeO2纳米颗粒增强Sn58Bi钎料及其钎焊接头的组织与性能

陈伟明，张柯柯，范玉春，张海洲，张超

《材料热处理学报》

2025

Influence of Al content on the microstructure and performance of AlxCoCrFeNi2.1 high-entropy alloys via laser-directed energy deposition

Wei Yang, Xiao Xiao, Daxin Zeng, Jian-Yong Liu, Feng-Guang Li, Wumeng Liu, Keke Zhang

Journal of Alloys and Compounds

DOI

2025

Volatile Alloying Elements Modulate Laser-Induced Arc Stability: A Material-Dependent Interaction Mechanism

Xiao Xiao, Chi Zhang, Shuai-Jun Bai, Dong-Sheng Wu, Hisaya Komen, Keke Zhang, Shigeaki Uchida, Manabu Tanaka

Journal of Materials Research and Technology

DOI

2025

Distribution characteristics of interfacial reaction layer and its effect in resistance spot welded Ti/Q235 joint with an interlayer of niobium

Nannan Wang, Ranfeng Qiu, Hongxin Shi, Lipeng Yan, Huai Yao, Keke Zhang

Journal of Materials Research and Technology

DOI

2025

Microstructure and Properties of Mg/Ti Joint Welded by Resistance Spot Welding with a Brass Interlayer

Nannan Wang, Jing Zhe Wang, Yanling Hu, Ranfeng Qiu, Hongxin Shi, Keke Zhang

Journal of Materials Engineering and Performance

DOI

2025

Effect of Sn grain orientation on microstructure and mechanical properties of pure Sn solder joints under thermoelectric coupling

Wenjia Zhao, Keke Zhang, Yanzhen Zhang, Zhu Liu, Haizhou Zhang, Chao Zhang

Scientific Reports

DOI

2025

The Performance of Ti/Steel Joints Welded by Resistance Spot Welding with a Nickel Interlayer

Nannan Wang, Gang Li, Yanling Hu, Hongxin Shi, Ranfeng Qiu, Keke Zhang

Materials

DOI

2025

Microstructure and properties of electroless Ni–P/Sn2.5Ag0.7Cu0.1RE micro-joints during thermomigration

Ruiqing Hou, Keke Zhang, Wenjia Zhao, Haizhou Zhang, Chao Zhang, Yonglei Wang

Scientific Reports

DOI

2025

Study on the Electromigration Organization and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints

Yuming Wang, Keke Zhang, Chao Zhang, Fupeng Huo, Yijie Gao

Metals

DOI

2025

Correction: Fabrication and properties of NiO-modified Al2O3 reinforced Sn1.0Ag0.5Cu composite solder and soldering performance

Bingying Wang, Yongjin Wu, Wan Wu, Huigai Wang, Keke Zhang

Journal of Materials Science

DOI

2025

Transient liquid phase diffusion bonding of C/C composite and Cobalt based superalloys with eutectic Co-34.6Fe-4.5B filler

Yonglei Wang, Zilun Yan, Keke Zhang, Danqing Yin, Xu Guo, Ze Zhao, Zhe Yu

Materials Characterization

DOI

2024

Ni改性GNSs对SnAgCuRE/Cu钎焊接头热老化特性的影响（英文）

王悔改，张柯柯，王冰莹，王要利

《稀有金属材料与工程》

2024

钛合金增材成形件的粉末细化晶粒机理研究进展

白帅军，肖笑，王雪晴，马宁，张柯柯，古免久弥

《材料热处理学报》

2024

Ni纳米颗粒增强Sn58Bi复合钎料/Cu微焊点的组织与性能

范玉春，张柯柯，陈伟明，吴金娜，张超

《材料热处理学报》

2024

化学镀Ni-P/Sn2.5Ag0.7Cu0.1RE微连接焊点热时效过程组织与性能

张柯柯，侯瑞卿，赵文嘉，张海洲，张超

《河南科技大学学报(自然科学版)》

2024

Microstructure Evolution and Wear Behavior of Stellite12 Coating Prepared by Laser-Directed Energy Deposition on H13 Steel

Wei Yang, Keke Zhang, Daxin Zeng, Jian-Yong Liu, Feng-Guang Li, Wumeng Liu

Materials Today Communications

DOI

2024

Stabilising mechanism of cathode jet and droplet transfer in hybrid-laser–GMAW-based directed energy deposition of titanium alloy

Xiao Xiao, Chi Zhang, Dong-Sheng Wu, Hisaya Komen, Junfeng Gou, Yongkang Zhang, Keke Zhang, Shigeaki Uchida, Manabu Tanaka

Virtual and Physical Prototyping

DOI

2024

Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints

Weiming Chen, Keke Zhang, Yuchun Fan, Chao Zhang, Nannan Wang

Scientific Reports

DOI

2024

Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties

Fupeng Huo, Chuantong Chen, Zheng Zhang, Yicheng Zhang, Aiji Suetake, Kazutaka Takeshita, Yoshiji Yamaguchi, Yashima Momose, Keke Zhang, Katsuaki Suganuma

Journal of Materials Research and Technology

DOI

2024

Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint

Yuchun Fan, Keke Zhang, Weiming Chen, Jinna Wu, Yonglei Wang

Metals

DOI

2023

6061铝合金搅拌摩擦焊曲线接头的组织与性能

曲来鹏，马宁，肖笑，张柯柯

《材料热处理学报》

2023

热解还原法制备镀镍ZrO2增强低银SnAgCu系复合钎料及其钎焊

吴咏锦，张柯柯，吴婉，王冰莹，高一杰，刘鹏

《稀有金属材料与工程》

2023

Ni-rGO增强Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头的电迁移组织与性能

张超，张柯柯，王钰茗，高一杰，高岩

《材料热处理学报》

2023

Ni-GNSs增强Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头电迁移特性研究

张超，张柯柯，高一杰，王钰茗

《河南科技大学学报(自然科学版)》

2023

A review of welding simulation methods for large components

Shuai Liu, Zhiqiang Wu, Wenhao Zhou, Honggang Zhou, Keke Zhang, Danqing Yin, Yongping Lei, Yongfeng Qiu

Progress in Natural Science Materials International

DOI

2023

Microstructure and stress relief mechanism of C/C composite and GH3044 superalloy joints using (Cu)+Ti 5 Si 3 foil filler

Yonglei Wang, Keke Zhang, Danqing Yin

International Journal of Applied Ceramic Technology

DOI

2023

Study on the properties of low silver Sn1.0Ag0.5Cu composite solder reinforced with nickel-plated zinc oxide and its soldering joint

Peng Liu, Keke Zhang, Bingying Wang, Ruiqing Hou, Huigai Wang, Yan Gao

Materials Today Communications

DOI

2023

Study on Ni-GNSs enhanced Sn2.5Ag0.7Cu0.1RE/Cu solder joints β-Sn grain orientation and interfacial IMC growth kinetics under constant temperature thermomigration

Chao Zhang, Keke Zhang, Yijie Gao, Yuming Wang, Ruiqing Hou

Materials Characterization

DOI

2023

Microstructure and Properties of Nonlinear Lap Joint of 6061 Aluminum Alloy by Friction Stir Welding

Laipeng Qu, Ning Ma, Xiao Xiao, Keke Zhang, Huijun Li

Metals

DOI

2023

Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties

Yijie Gao, Keke Zhang, Chao Zhang, Yuming Wang, Weiming Chen

Metals

DOI

2023

Composite brazing of high thermal mismatched Cf/SiC and 304 stainless steel with foil (Cu) + Ti5Si3 alloy as filler

Yonglei Wang, Keke Zhang, Danqing Yin

Materials Letters

DOI

2023

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints

Chao Zhang, Keke Zhang, Yijie Gao, Yuming Wang

Materials

DOI

2023

Synthesis and analysis of the structure of modified-Al2O3 particles used to increase the strength and electrical conductivity of lead-free solder based on Sn–Ag–Cu

Bingying Wang, Keke Zhang, Yijie Gao, Peng Liu, Bo Liu, Zhansheng Zhang

Journal of Materials Science

DOI

2022

电弧增材制造的热源光谱分析

李晨星，肖笑，孟令燃，张柯柯

《材料热处理学报》

2022

镀铜氧化锆增强低银Sn1.0Ag0.5Cu复合钎料的性能及其钎焊接头性能

吴婉，张柯柯，吴咏锦，王冰莹，刘鹏，肖娜

《材料热处理学报》

2022

Ni-GNSs增强Sn2.5Ag0.7Cu0.1RE复合钎料/Cu钎焊接头热迁移组织与性能

李世杰，张柯柯，张超，李俊恒，吴婉

《河南科技大学学报(自然科学版)》

2022

Novel interface regulation of Sn1.0Ag0.5Cu composite solders reinforced with modified ZrO2: Microstructure and mechanical properties

Fupeng Huo, Zhi Hao Jin, Duy Le Han, Jiahui Li, Keke Zhang, Hiroshi Nishikawa

Journal of Material Science and Technology

DOI

2022

Fabrication and properties of NiO-modified Al2O3 reinforced Sn1.0Ag0.5Cu composite solder and soldering performance

Bingying Wang, Yongjin Wu, Wan Wu, Huigai Wang, Keke Zhang

Journal of Materials Science

DOI

2021

TC4钛合金激光熔覆路径选择数值模拟研究

梁广冰，朱锦洪，尹丹青，周杨凯，马宁，张柯柯

《河南科技大学学报(自然科学版)》

DOI

2021

Study on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder

Huigai Wang, Keke Zhang, Yongjin Wu, Bingying Wang

Materials & Design

DOI

2021

Strengthening mechanism of Ni-modified graphene nanosheets reinforced SnAgCuRE composite solder/Cu joints

Huigai Wang, Keke Zhang, Yongjin Wu, Bingying Wang

Journal of Materials Science Materials in Electronics

DOI

2021

Interface design and the strengthening-ductility behavior of tetra-needle-like ZnO whisker reinforced Sn1.0Ag0.5Cu composite solders prepared with ultrasonic agitation

Fupeng Huo, Zhi Hao Jin, Duy Le Han, Keke Zhang, Hiroshi Nishikawa

Materials & Design

DOI

2021

Surface Modification of Tetra-needle like ZnO (T-ZnO) and Characterization of Interface Between Sn1.0Ag0.5Cu and NiO Decorated T-ZnO

Fupeng Huo, Keke Zhang, Hiroshi Nishikawa

International Conference on Electronics Packaging (ICEP)

DOI

2021

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

Jianguo Cui, Keke Zhang, Di Zhao, Yibo Pan

Scientific Reports

DOI

2020

TIG电弧增材熔池行为的数值模拟研究现状

李春凤，肖笑，尹玉祥，李晨，张柯柯

《材料热处理学报》

DOI

2020

Ni-rGO增强Sn2.5Ag0.7Cu0.1RE复合钎料/Cu钎焊接头电迁移组织与性能

潘毅博，张柯柯，张超，王悔改，李俊恒，钟时雨

《河南科技大学学报(自然科学版)》

DOI

2020

微连接用碳基纳米颗粒增强无铅复合钎料的研究新进展

王悔改，张柯柯，尹宸翔，吴咏锦

《材料热处理学报》

DOI

2020

超音速火焰喷涂细晶WC-12Co涂层的组织性能

马宁，张柯柯，尹丹青，肖笑，叶福兴

《河南科技大学学报(自然科学版)》

DOI

2020

TIG电弧增材316L不锈钢中的热行为对其组织演变的影响

肖笑，尹玉祥，李春凤，李晨星，张柯柯

《材料热处理学报》

DOI

2020

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Di Zhao, Keke Zhang, Ning Ma, Shijie Li, Chenxiang Yin, Fupeng Huo

Materials

DOI

2019

基于光谱诊断的氩氮TIG焊电弧物理特性分析

肖笑，张柯柯，李芳，华学明

《焊接学报》

2019

Ni-rGO增强Sn2.5Ag0.7Cu0.1RE复合钎料钎焊接头显微组织与性能

霍福鹏，张柯柯，张萌，王悔改

《河南科技大学学报(自然科学版)》

DOI

2019

基于光谱诊断的氩-氮P-TIG焊引弧的动态电弧物理特性研究

肖笑，李芳，华学明，张柯柯

《光谱学与光谱分析》

2019

316L不锈钢TIG焊增材电弧物理特性分析

尹玉祥，肖笑，邱然锋，张柯柯

《电焊机》

2019

Environmentally Friendly and Controllable Pyrolysis Method to Synthesize Ni-Modified Graphene Nanosheets as Reinforcement of Lead-Free Solder

Huigai Wang, Keke Zhang, Chenxiang Yin, Meng Zhang

Metals

DOI

2019

Spreading and Wetting Behaviors of Sn2.5Ag0.7Cu0.1RE0.05Ni Solder on the Surface of Cu Substrate under Ultrasonic Vibration

Chenxiang Yin, Keke Zhang, Shijie Li, Junheng Li

IOP Conference Series Materials Science and Engineering

DOI

2019

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Congcong Cao, Keke Zhang, Baojin Shi, Huigai Wang, Di Zhao, Mengmeng Sun, Chao Zhang

Metals

DOI

2019

Microstructures and Properties of Sn2.5Ag0.7Cu0.1RE Composite Solders Reinforced with Cu-Coated Graphene Nanosheets Synthesized by Pyrolysis

Meng Zhang, Keke Zhang, Fupeng Huo, Huigai Wang, Yang Wang

Materials

DOI

2018

外能辅助下Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头组织与性能

崔建国，张柯柯，赵迪，马宁，曹聪聪，潘毅博

《稀有金属材料与工程》

2018

无钯镀镍碳纤维增强Sn-3.0Ag-0.5Cu复合钎料的制备

王悔改，张柯柯，霍福鹏，张萌

《稀有金属材料与工程》

2018

TIG熔覆原位自生TiC-TiB2/Fe复合涂层

马宁，赵迪，张柯柯，杨跃，尹丹青

《焊接学报》

2018

Fabrication and properties of Ni-modified graphene nanosheets reinforced Sn-Ag-Cu composite solder

Huigai Wang, Keke Zhang, Meng Zhang

Journal of Alloys and Compounds

DOI

2018

Effect of ultrasonic vibration on the interfacial IMC three-dimensional morphology and mechanical properties of Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu halogen free solder joints

Di Zhao, Keke Zhang, Jianguo Cui, Ning Ma, Yibo Pan, Chenxiang Yin

Journal of Materials Science Materials in Electronics

DOI

2018

Influence of Ultrasonic Vibration Power on the Wettability and Interfacial Microstructure of Sn2.5Ag0.7Cu0.1RE0.05Ni Solder Alloy on Cu Substrate

Di Zhao, Keke Zhang, Jianguo Cui, Chenxiang Yin

IOP Conference Series Materials Science and Engineering

DOI

2018

Electro-Superplastic Solid State Welding of 40Cr/QCr0.5

Yaoli Wang, Guangxin Wang, Keke Zhang

Materials

DOI

2018

The Interfacial Intermetallic and Shear Strength of Ni Nanoparticle‐Decorated Reduced Graphene Oxide Reinforced Sn2.5Ag0.5Cu Lead‐Free Composite Soldering Joints

Fupeng Huo, Keke Zhang, Meng Zhang, Huigai Wang

Advanced Engineering Materials

DOI

2017

热冲击下Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头组织与性能

张柯柯，郭兴东，王悔改

《稀有金属材料与工程》

2017

钨极氩弧熔覆原位自生铁基复合涂层组织与性能

赵迪，马宁，张柯柯，杨跃

《表面技术》

2017

水洗钎剂下SnAgCuRExNi与铜引线的润湿适配性

王要利，宋克兴，王广欣，张柯柯

《焊接学报》

2017

Effect of Ni addition on the wettability and microstructure of Sn2.5Ag0.7Cu0.1RE solder alloy

Yaoli Wang, Guangxin Wang, Kexing Song, Keke Zhang

Materials & Design

DOI

2016

SnAgCu系软钎料钎焊接头性能研究

张鑫，刘敏，张柯柯，石红信

《焊接技术》

2016

电场作用下40Cr/QCr0.5的超塑性固态压接

王要利，程光辉，张柯柯，于华

《焊接学报》

2016

TA2表面电火花沉积Zr/WC复合涂层特性及界面行为研究

吴公一，张占领，孙凯伟，于华，邱然锋，石红信，张柯柯

《表面技术》

2016

热循环下Sn2.5Ag0.7Cu0.1RExNi/Cu钎焊焊点组织与性能研究

曹聪聪，张柯柯，王悔改，孙萌萌，张超

《焊接》

2016

Wettability of SACR–xNi solder alloy on Cu leading wire with no-clean flux

Yaoli Wang, Zonghui Fang, Ning Ma, Keke Zhang

Journal of Materials Science Materials in Electronics

DOI

2015

铝合金/不锈钢电阻点焊工艺与接头性能研究

李国伟，王楠楠，邱然锋，石红信，张柯柯

《轻合金加工技术》

2015

基于电场作用下的40Cr/40Cr钢的超塑性固态焊接接头性能及组织研究

张青，丁世伟，孙凯伟，张柯柯，吴公一，于华，邱然锋

《热加工工艺》

2015

钛合金航空发动机叶片高温疲劳行为的研究现状

利孝杰，尹丹青，张柯柯，邱然锋

《电焊机》

2015

铝合金与低碳钢的夹层电阻点焊接头特性

王楠楠，邱然锋，石红信，张柯柯

《材料热处理学报》

2015

Interfacial Contact Process Controlled by Superplastic Flow in Solid-state Bonding of Superplastic High Carbon Steel

Zhonghao Heng, Touma Matsushima, Yusuke Nashiki, Masakatsu Maeda, Keke Zhang, Yasuo Takahashi

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY

DOI

2014

铝合金与钢的异种材料点连接研究现状

石红信，陈艳平，邱然锋，戴路，张柯柯

《电焊机》

2014

铝合金/钢熔钎焊的研究现状

王楠楠，邱然锋，崔立虎，侯龙龙，张柯柯

《轻合金加工技术》

2014

Joining steel to aluminum alloy by resistance spot welding with a rivet

Ranfeng Qiu, Nannan Wang, Hongxin Shi, Lihu Cui, Longlong Hou, Keke Zhang

International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde)

DOI

2014

Solid-state bonding of superplastic ultra-high carbon steel and structure steel with an interlayer

Keke Zhang, Zhonghao Heng, Ranfeng Qiu, Hongxin Shi, Yasuo Takahashi

IOP Conference Series Materials Science and Engineering

DOI

2014

Microstructure and properties of Sn2.5Ag0.7Cu0.1RE lead-free soldering joints with ultrasonic assisted

Yujie Liu, Keke Zhang, Xiaojiao Zhang, Kai Zhao, Ranfeng Qiu, Hongxin Shi

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

Study on fracture mechanism of the aged Sn2.5Ag0.7Cu0.1RE/Cu soldering joint with external energy

Guo Xingdong, Keke Zhang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

The combined effects of ultrasonic wave and electric field on the microstructure and properties of Sn2.5Ag0.7Cu0.1RE/Cu soldered joints

Keke Zhang, Xiaojiao Zhang, Ranfeng Qiu, Hongxin Shi, Yujie Liu

Journal of Materials Science Materials in Electronics

DOI

2014

Joining phenomena of stainless steel/aluminium alloy joint welded by thermal compensation resistance spot welding

Ranfeng Qiu, Hongxin Shi, Hua Yu, Keke Zhang

International Journal of Materials and Product Technology

DOI

2013

铝合金与钢的异种材料离焦激光焊研究现状

尹丹青，邱然锋，王楠楠，石红信，张柯柯

《电焊机》

2013

铝合金与异种金属真空压延接合技术研究现状

邱然锋，尹丹青，王楠楠，石红信，张柯柯，戴路

《轻合金加工技术》

2012

RE对Sn2.5Ag0.7Cu/Cu焊点性能的影响

王要利，张柯柯，乔新贺，钱娜娜，潘红，吕杰，吕昆育，阮月飞

《中国有色金属学报》

2012

铝合金与钢的点连接技术

杜宜乐，张柯柯，邱然峰，石宏信

《焊接技术》

2012

A6061铝合金与Q235钢电阻点焊接头组织与性能

张柯柯，杜宜乐，邱然锋，石红信，李臣阳

《材料热处理学报》

2012

Ni元素对Sn2.5Ag0.7Cu0.1RE/Cu无铅微焊点界面IMC和力学性能的影响

李臣阳，张柯柯，王要利，赵恺，杜宜乐

《焊接学报》

2011

超细晶超高碳钢的制备工艺

孙敬，张柯柯，张占领，吴志伟

《热加工工艺》

2011

铝合金与不锈钢电阻点焊接合界面区的组织特性

邱然锋，于华，石红信，张柯柯，涂益民，里中忍

《焊接学报》

2011

电场作用下1.6%C-UHCS/40Cr钢的超塑性焊接

张柯柯，孙敬，吴志伟，马宁，邱然锋，张占领

《焊接学报》

2010

微连接用Sn-2.5Ag-0.7Cu（0.1RE）钎料焊点界面Cu6Sn5的长大行为

王要利，张柯柯，刘帅，赵国际

《稀有金属材料与工程》

2010

钎焊温度与时间对急冷型Sn2.5Ag0.7Cu钎料合金钎焊接头性能及界面IMC生长行为的影响

张鑫，袁浩，熊毅，张柯柯，闫焉服

《焊接技术》

2010

汽车车身用铝合金与钢的异种材料电阻点焊技术研究现状

邱然锋，石红信，张柯柯，朱锦洪，李建军

《电焊机》

2010

快速凝固Sn2.5Ag0.7Cu钎料中金属间化合物的形态及对焊点性能的影响

赵国际，张柯柯，罗键

《中国有色金属学报》

2010

静电场对金属材料塑性变形及组织和性能的影响

吴志伟，张柯柯，张占领，孙敬

《热加工工艺》

2010

30钢-硅青铜QSi3-1异种金属钨极氩弧焊工艺及接头性能研究

张鑫，涂益民，张柯柯，熊毅

《热加工工艺》

2010

钢恒温超塑焊接过程中原子的动态扩散行为

张柯柯，岳云，马宁，吴志伟，孙敬，杨蕴林

《焊接学报》

2010

Effects of Electrode Force on the Characteristic of Magnesium Alloy Joint Welded by Resistance Spot Welding with Cover Plates

Ranfeng Qiu, Hongxin Shi, Hua Yu, Keke Zhang, Yimin Tu, Shinobu Satonaka

Materials and Manufacturing Processes

DOI

2010

Influence of Welding Parameters on the Tensile Shear Strength of Aluminum Alloy Joint Welded by Resistance Spot Welding

Ranfeng Qiu, Zhanling Zhang, Keke Zhang, Hongxin Shi, Gaojian Ding

Journal of Materials Engineering and Performance

DOI

2010

Effects of welding parameters on the characteristics of magnesium alloy joint welded by resistance spot welding with cover plates

Hongxin Shi, Ranfeng Qiu, Jinhong Zhu, Keke Zhang, Hua Yu, Gaojian Ding

Materials & Design (1980-2015)

DOI

2010

Interfacial characterization of joint between mild steel and aluminum alloy welded by resistance spot welding

Ranfeng Qiu, Hongxin Shi, Keke Zhang, Yimin Tu, Chihiro Iwamoto, Shinobu Satonaka

Materials Characterization

DOI

2009

快速凝固Sn2.5Ag0.7Cu钎料合金凝固组织特征

赵国际，张柯柯，王要利，祝要民

《金属热处理》

2009

Ag颗粒增强复合钎料钎焊接头蠕变断裂及强化机理研究

闫焉服，纪莲清，张柯柯，贺俊光，赵丹娜

《材料科学与工艺》

2009

急冷型SnAgCu系钎料合金钎焊工艺及接头性能研究

张鑫，张柯柯，涂益民，赵国际

《热加工工艺》

2009

Sn-2.5Ag-0.7Cu（0.1RE）/Cu焊点界面区微观组织与Cu6Sn5的生长动力学

王要利，张柯柯，韩丽娟，温洪洪

《中国有色金属学报》

2009

工具钢超塑性固态焊焊接面断口特征区域分析

张柯柯，刘帅，岳云，马宁，杨蕴林，张占领，于华

《焊接》

2009

超高碳钢与表面改性后40Cr的超塑连接

岳云，张占领，马宁，刘帅，张柯柯，杨蕴林

《河南科技大学学报(自然科学版)》

2009

大体积分数碳化物钢W6Mo5Cr4V2Al的压缩超塑性

温洪洪，王要利，丁龙飞，张欢，张柯柯

《热加工工艺》

2009

Ag和Ni元素对Sn-Sb-Cu无铅钎料熔化温度和铺展性能的影响

冯丽芳，杨莉，闫焉服，郭晓晓，张柯柯

《焊接学报》

2008

微量RE对Sn-2.5Ag-0.7Cu钎料合金润湿性的影响

王要利，张柯柯，程光辉，韩丽娟，赵国际，刘帅

《特种铸造及有色合金》

2008

异种钢恒温超塑焊接头特征区域分析

张柯柯，石红信，于华，杨蕴林

《焊接学报》

2008

铜/铝合金冷压-扩散复合焊接接头的显微组织

洪丽玲，辛选荣，张柯柯，刘汀

《机械工程材料》

2008

Sn-2.5Ag-0.7Cu-0.1RE/Cu钎焊界面区IMC及接头性能

韩丽娟，张柯柯，王要利，方宗辉，祝要民

《特种铸造及有色合金》

2008

Sn-2.5Ag-0.7Cu-0.1RE/Cu时效点界面IMC的生长行为

韩丽娟，张柯柯，王要利，祝要民，赵国际

《特种铸造及有色合金》

2008

1.31%C超高碳钢的压缩超塑性研究

刘帅，张柯柯，任伟，杨蕴林，张占领

《热加工工艺》

2008

急冷型SnAgCu系钎料箔带制备及物理性能测试

张鑫，黄笑宇，张柯柯，赵国际，王辉

《热加工工艺》

2008

快速凝固对Sn2.5Ag0.7Cu钎料合金熔化与铺展特性的影响

赵国际，张柯柯，张鑫

《热加工工艺》

2008

Effect of RE on physical properties of Sn-0.2Ag-0.7Cu solder alloy

Keke Zhang

Electronic Components and Materials

2007

SnCu钎焊接头稳态蠕变本构方程建立

闫焉服，纪莲清，张柯柯，闫红星，冯丽芳

《焊接学报》

2007

RE含量及环境条件对SnAgCu钎焊接头蠕变断裂寿命的影响

张柯柯，王要利，樊艳丽，祝要民，张鑫，阎焉服

《稀有金属材料与工程》

2007

Ag颗粒含量对SnCu基复合钎料性能的影响

闫焉服，陈拂晓，朱锦洪，张柯柯

《材料研究学报》

2007

微量稀土对SnAgCu无铅钎料力学及润湿性能的影响

王要利，张柯柯，樊艳丽，韩丽娟，杨洁，程光辉

《热加工工艺》

2007

Ni对SnAgCuRE钎料及其钎焊接头性能的影响

樊艳丽，张柯柯，王要利，祝要民，张鑫，闫焉服

《特种铸造及有色合金》

2007

Effect of Ni on Performances of Sn2.5Ag0.7Cu0.1RE Solder Alloy and Its Creep Properties of the solder Joints for SMT

Keke Zhang, Yanli Fan, Yaoli Wang, Yaomin Zhu, Xin Zhang, Yanfu Yan

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2007

Influence of temperature on creep behavior of ag particle enhancement SnCu based composite solder

Yanfu Yan, Li-fang Feng, Keke Zhang, Jiuba Wen

Tsinghua Science & Technology

DOI

2007

Microstructure and mechanic properties of soldering joints for SnAgCuRE solder alloys

Keke Zhang

Electronic Components and Materials

2006

SnAgCuRE系无铅钎料与表面贴装元器件的润湿适配性

张柯柯，王双其，余阳春，王要利，樊艳丽，程光辉，韩丽娟

《中国有色金属学报》

2006

水洗钎剂下SnAgCu系钎料对不同基板的润湿特性

樊艳丽，张柯柯，王双其，程光辉，王要利，余阳春

《特种铸造及有色合金》

2006

不同组织超细化预处理下的异种钢超塑焊接

张柯柯，杨蕴林，赵宁，王长生，王要利

《焊接学报》

2006

Ag、RE对Sn-Ag-Cu-RE无铅钎料润湿性的影响

王双其，张柯柯，樊艳丽，王要利，杨洁，程光辉，韩丽娟

《热加工工艺(焊接版)》

2006

RE对微连接用SnAgCuRE钎料合金组织及性能的影响

张金勇，白钢，张柯柯，何宇航，杨舜

《热加工工艺(焊接版)》

2006

Research on Creep Properties of SnAgCuRE Lead-Free Soldered Joints

Keke Zhang, Jie Yang, Yaoli Wang, Yanli Fan, Xin Zhang, Yanfu Yan

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2006

Activation Energy for Superplastic Flow Above Critical Temperature of Die Steels

Jiuba Wen, Keke Zhang, Fuxiao Chen, Yongshun Yang

Journal of Iron and Steel Research International

DOI

2005

热输入对A517、A537钢冲击性能的影响

于华，张柯柯，陈天杰，崔慧君

《热加工工艺》

2005

Prediction of HAZ tribological properties of fusion welded zinc-based alloy by means of artificial neural network

Keke Zhang

2004

金属型预热温度对微连接用铸造SnAgCu钎料合金性能影响

满华，张柯柯，刘亚民，黄金亮，倪锋

《热加工工艺》

2004

KBF4对Zn-28.4%Al合金变质作用的研究

倪锋，徐晓峰，张柯柯，龙锐

《热加工工艺》

2004

T10A钢组织超细化预处理后的超塑性压缩试验

杨蕴林，张柯柯，王长生，赵宁，徐翔民

《钢铁研究学报》

2003

同质焊缝球墨铸铁焊条的研制

何柏林，于影霞，张柯柯

《热加工工艺》

2003

钢与铜及铜合金的焊接研究现状

韩彩霞，张柯柯，杨蕴林，徐东

《热加工工艺》

2002

锌基合金焊丝铝含量对其熔化焊熔敷金属耐磨性的影响

张柯柯，涂益民，陈大柔

《热加工工艺》

2001

组织超细化预处理工艺对超塑焊接头变形的影响

张柯柯，杨蕴林，王长生，石红信，薛锦

《热加工工艺》

2001

钛、锆变质处理对高铝锌合金凝固特性的影响

倪锋，张柯柯，侯平均，陈大柔

《热加工工艺》

2001

基于铬青铜超塑变形的铬青铜/钨合金固相焊接

杨蕴林，马峰，王长生，张柯柯

《焊接学报》

2000

ZA12合金氩弧焊HAZ组织模拟及摩擦学性能

张柯柯，涂益民，陈跃，张永振，陈大柔，薛锦

《中国有色金属学报》

2000

恒温超塑固相焊接防氧化加热装置的研制

王长生，张柯柯，杨蕴林

《热加工工艺》

1999

钢的恒温超塑性固相焊接研究

张柯柯，杨蕴林，王长生，李红克，马奎，薛锦

《材料科学与工艺》

1999

新型锌铝合金焊接研究的现状

张柯柯，薛锦，陈大柔，涂益民，杨蕴林

《焊接技术》

精选作品

期刊论文

富氧近α钛合金复合片层组织的微织构生成机制和力学行为

激光熔覆钛合金粉末效率的多因素协同作用分析

激光功率对激光-电弧复合增材制造AZ31镁合金成形质量、微观组织与力学性能的影响

通过表面改性的纳米ZrO2和微米T-ZnOw混杂增强体协同改善Sn1.0Ag0.5Cu复合焊料的强塑性（英文）

Sn2.5Ag0.7Cu0.1RE/Cu焊点电迁移组织与性能

Ni/C/Al2O3增强Sn1.0Ag0.5Cu复合钎料及其钎焊接头的组织性能

In-situ phase engineering strategy for enhancing the mechanical and tribological performance of AlCoCrFeNi2.1 high-entropy alloy

Cathode jet and columnar grain suppression in oscillating arc-wire directed energy deposition of titanium alloy

Achieving high-quality hybrid laser- arc directed energy deposition of titanium alloy

Microstructural evolution, properties, and failure behavior of Sn2.5Ag0.7Cu0.1RE/Cu solder joints under electromigration conditions

Effect of Cu substrate surface modification on wettability and interfacial reaction of tin-based lead-free composite solder

Fabrication of Ni/C/Al2O3-reinforced Sn1.0Ag0.5Cu composite solder and isothermal aging behavior of soldered joints

(Cu-15Ti)+SiC反应-复合扩散钎焊Cf/SiC复合材料与不锈钢

电流应力下Sn/Cu微焊点组织与阴极失效

镍涂层Al2O3增强低银SnAgCu复合钎料的制备及钎焊性能（英文）

CeO2纳米颗粒增强Sn58Bi钎料及其钎焊接头的组织与性能

Influence of Al content on the microstructure and performance of AlxCoCrFeNi2.1 high-entropy alloys via laser-directed energy deposition

Volatile Alloying Elements Modulate Laser-Induced Arc Stability: A Material-Dependent Interaction Mechanism

Distribution characteristics of interfacial reaction layer and its effect in resistance spot welded Ti/Q235 joint with an interlayer of niobium

Microstructure and Properties of Mg/Ti Joint Welded by Resistance Spot Welding with a Brass Interlayer

Effect of Sn grain orientation on microstructure and mechanical properties of pure Sn solder joints under thermoelectric coupling

The Performance of Ti/Steel Joints Welded by Resistance Spot Welding with a Nickel Interlayer

Microstructure and properties of electroless Ni–P/Sn2.5Ag0.7Cu0.1RE micro-joints during thermomigration

Study on the Electromigration Organization and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints

Correction: Fabrication and properties of NiO-modified Al2O3 reinforced Sn1.0Ag0.5Cu composite solder and soldering performance

Transient liquid phase diffusion bonding of C/C composite and Cobalt based superalloys with eutectic Co-34.6Fe-4.5B filler

Ni改性GNSs对SnAgCuRE/Cu钎焊接头热老化特性的影响（英文）

钛合金增材成形件的粉末细化晶粒机理研究进展

Ni纳米颗粒增强Sn58Bi复合钎料/Cu微焊点的组织与性能

化学镀Ni-P/Sn2.5Ag0.7Cu0.1RE微连接焊点热时效过程组织与性能

Microstructure Evolution and Wear Behavior of Stellite12 Coating Prepared by Laser-Directed Energy Deposition on H13 Steel

Stabilising mechanism of cathode jet and droplet transfer in hybrid-laser–GMAW-based directed energy deposition of titanium alloy

Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints

Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties

Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint

6061铝合金搅拌摩擦焊曲线接头的组织与性能

热解还原法制备镀镍ZrO2增强低银SnAgCu系复合钎料及其钎焊

Ni-rGO增强Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头的电迁移组织与性能

Ni-GNSs增强Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头电迁移特性研究

A review of welding simulation methods for large components

Microstructure and stress relief mechanism of C/C composite and GH3044 superalloy joints using (Cu)+Ti 5 Si 3 foil filler

Study on the properties of low silver Sn1.0Ag0.5Cu composite solder reinforced with nickel-plated zinc oxide and its soldering joint

Study on Ni-GNSs enhanced Sn2.5Ag0.7Cu0.1RE/Cu solder joints β-Sn grain orientation and interfacial IMC growth kinetics under constant temperature thermomigration

Microstructure and Properties of Nonlinear Lap Joint of 6061 Aluminum Alloy by Friction Stir Welding

Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties

Composite brazing of high thermal mismatched Cf/SiC and 304 stainless steel with foil (Cu) + Ti5Si3 alloy as filler

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints

Synthesis and analysis of the structure of modified-Al2O3 particles used to increase the strength and electrical conductivity of lead-free solder based on Sn–Ag–Cu

电弧增材制造的热源光谱分析

镀铜氧化锆增强低银Sn1.0Ag0.5Cu复合钎料的性能及其钎焊接头性能

Ni-GNSs增强Sn2.5Ag0.7Cu0.1RE复合钎料/Cu钎焊接头热迁移组织与性能

Novel interface regulation of Sn1.0Ag0.5Cu composite solders reinforced with modified ZrO2: Microstructure and mechanical properties

Fabrication and properties of NiO-modified Al2O3 reinforced Sn1.0Ag0.5Cu composite solder and soldering performance

TC4钛合金激光熔覆路径选择数值模拟研究

Study on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder

Strengthening mechanism of Ni-modified graphene nanosheets reinforced SnAgCuRE composite solder/Cu joints

Interface design and the strengthening-ductility behavior of tetra-needle-like ZnO whisker reinforced Sn1.0Ag0.5Cu composite solders prepared with ultrasonic agitation

Surface Modification of Tetra-needle like ZnO (T-ZnO) and Characterization of Interface Between Sn1.0Ag0.5Cu and NiO Decorated T-ZnO

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

TIG电弧增材熔池行为的数值模拟研究现状

Ni-rGO增强Sn2.5Ag0.7Cu0.1RE复合钎料/Cu钎焊接头电迁移组织与性能

微连接用碳基纳米颗粒增强无铅复合钎料的研究新进展

超音速火焰喷涂细晶WC-12Co涂层的组织性能

TIG电弧增材316L不锈钢中的热行为对其组织演变的影响

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

基于光谱诊断的氩氮TIG焊电弧物理特性分析

Ni-rGO增强Sn2.5Ag0.7Cu0.1RE复合钎料钎焊接头显微组织与性能

基于光谱诊断的氩-氮P-TIG焊引弧的动态电弧物理特性研究

316L不锈钢TIG焊增材电弧物理特性分析

Environmentally Friendly and Controllable Pyrolysis Method to Synthesize Ni-Modified Graphene Nanosheets as Reinforcement of Lead-Free Solder

Spreading and Wetting Behaviors of Sn2.5Ag0.7Cu0.1RE0.05Ni Solder on the Surface of Cu Substrate under Ultrasonic Vibration

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Microstructures and Properties of Sn2.5Ag0.7Cu0.1RE Composite Solders Reinforced with Cu-Coated Graphene Nanosheets Synthesized by Pyrolysis

外能辅助下Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头组织与性能

无钯镀镍碳纤维增强Sn-3.0Ag-0.5Cu复合钎料的制备

TIG熔覆原位自生TiC-TiB2/Fe复合涂层

Fabrication and properties of Ni-modified graphene nanosheets reinforced Sn-Ag-Cu composite solder

Effect of ultrasonic vibration on the interfacial IMC three-dimensional morphology and mechanical properties of Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu halogen free solder joints