王增林

2026

Rethinking Catalyst Design for Hydrogen Evolution Reaction: Single-Phase or Multi-Phase?

Journal of Materials Chemistry A

DOI

2026

A MOF-Derived Z-Scheme BiOCl/Bi 2 O 3 Heterojunction Photocatalyst with Enhanced Oxygen Vacancies for CO 2 Reduction

ACS Applied Energy Materials

DOI

2026

A ZrO2-Based Ternary Photocatalyst with Highly Reduced Defects for Visible-Light-Driven Hydrogen Production.

Inorganic Chemistry

DOI

2025

化学镀钴过程中添加剂糖精对结晶取向的调控（英文）

《电化学(中英文)》

2025

Gram-Scale Synthesis of N-NiMo/MoO2 Heterostructures to Boost Hydrogen Evolution in Low-Alkalinity Anion Exchange Membrane Water Electrolysis

Nano Energy

DOI

2025

Dynamic synergy of interfacial water driven by a conjugated-polymer leveler for void-free cu microvia filling

Journal of Electroanalytical Chemistry

DOI

2025

Recent Advances in the Design and Structure–Activity Relationships of Oxygen Evolution Catalysts for Alkaline Water Electrolysis

Molecules

DOI

2025

Facilitating charge utilization via semi-embedding cocatalyst adjacent to the interfacial region in composite photocatalyst

Chemical Engineering Journal

DOI

2025

Effect of Saccharin on Crystallization Behavior of Electroless Cobalt Plating

Journal of Electrochemistry

DOI

2024

Study of the Effects of Additives on an EDTA-2Na Electroless Ni-P Plating System

Journal of Electronic Materials

DOI

2024

A ternary-structured NiCo-LDH/Ni/BiVO4 photoanode with enhanced charge dynamics for photoelectrochemical water splitting

Surfaces and Interfaces

DOI

2024

A facile N-doped NiFe(B) (Oxy)hydroxide monolithic electrode for enhanced water oxidation.

Chemical Communications

DOI

2024

Tungsten Carbide/Tungsten Oxide Catalysts for Efficient Electrocatalytic Hydrogen Evolution

Molecules

DOI

2024

Surficial Engineering of Cathodic Protection Strategy via P‐Doped NiCuV Monolithic Electrode for Enhanced Hydrogen Evolution Reaction in Alkaline Media

Advanced Sustainable Systems

DOI

2023

Acceleration Mechanism of Triethanolamine in Electroless Bath for Pure Cobalt Deposition

Journal of the Electrochemical Society

DOI

2023

Modulation of active site environment in an embedded CuOx@TiO2 photocatalyst for enhanced hydrogen evolution and CO2 reduction

Molecular Catalysis

DOI

2023

Enhancing Adhesion of Electroless Copper Film on Smooth Polyimide Surfaces by Photocatalytic Oxidation

Journal of The Electrochemical Society

DOI

2022

化学镀钴和超级化学镀填充的研究进展（英文）

《电化学(中英文)》

2022

Multi-Function of the Ni Interlayer in the Design of a BiVO4-Based Photoanode for Photoelectrochemical Water Splitting

ACS Applied Materials & Interfaces

DOI

2022

Optimizing the charge migration pathways via embedding Pd NPs in porous TiO2 for boosting photocatalytic H2 production

Microporous and Mesoporous Materials

DOI

2021

Adhesion improvement of ABS resin by MnO2-H3PO4-H2SO4 colloid with ultrasound-assisted etching treatment

Journal of Adhesion Science and Technology

DOI

2021

Electrodeposited of ultrathin VOx-doped NiFe layer on porous NiCo phosphide for efficient overall water splitting

Applied Physics Letters

DOI

2021

Highly isolated Pt NPs embedded in porous TiO2 derived from MIL-125 with enhanced photocatalytic hydrogen production activity

Journal of Catalysis

DOI

2021

Ni-based 3D hierarchical heterostructures achieved by selective electrodeposition as a bifunctional electrocatalyst for overall water splitting

Electrochimica Acta

DOI

2020

镍铜合金立方体纳米晶的脉冲电沉积及电催化析氢性能

《高等学校化学学报》

2020

多孔枝晶镍铜合金的制备及其电催化析氢、肼氧化性能

《无机化学学报》

2020

HF promoted increased nitrogen doping in TiO2(B) photocatalyst.

Chemical Communications

DOI

2020

Electrochemical modification and tuning Ni/Ni(OH)2–Ag heterogeneous interface for efficient electrocatalytic hydrogen and oxygen evolution reactions

Electrochimica Acta

DOI

2020

Pulsed electrodeposition of well-ordered nanoporous Cu-doped Ni arrays promotes high-efficiency overall hydrazine splitting

Journal of Materials Chemistry A

DOI

2019

Fabrication of TiO2(B)/Anatase Heterophase Junctions at High Temperature via Stabilizing the Surface of TiO2(B) for Enhanced Photocatalytic Activity

Journal of Physical Chemistry C

DOI

2019

Monodispersed silver-palladium nanoparticles for ethanol oxidation reaction achieved by controllable electrochemical synthesis from ionic liquid microemulsions

Journal of Colloid and Interface Science

DOI

2019

Surface Assistant Charge Separation in PEC Cu 2 S–Ni/Cu 2 O Cathode

ACS Applied Materials & Interfaces

DOI

2019

Hierarchical nanoporous Ni(Cu) alloy anchored on amorphous NiFeP as efficient bifunctional electrocatalysts for hydrogen evolution and hydrazine oxidation

Journal of Catalysis

DOI

2019

Noble-metal-free electrocatalyst based on a mixed CoNi metal-organic framework for oxygen evolution reaction

Journal of Alloys and Compounds

DOI

2019

Fabrication of 3D microporous amorphous metallic phosphides for high-efficiency hydrogen evolution reaction

Electrochimica Acta

DOI

2019

Ultralow FeIII Ion Doping Triggered Generation of Ni3S2 Ultrathin Nanosheet for Enhanced Oxygen Evolution Reaction

ChemCatChem

DOI

2019

Improved electrochemical performance of nickel-cobalt hydroxides by electrodeposition of interlayered reduced graphene oxide

International Journal of Hydrogen Energy

DOI

2018

2,6-二氨基吡啶对EDTA体系低温化学镀铜的影响

《应用化工》

2018

Fabrication of TiO 2 (B)/anatase heterophase junctions in nanowires via a surface-preferred phase transformation process for enhanced photocatalytic activity

Chinese Journal of Catalysis

DOI

2018

Surface modification of polyimide by combining swelling and TiO2 photocatalytic treatments for adhesion improvement of electroless Cu

Journal of Adhesion Science and Technology

DOI

2018

Bifunctional Copper-Doped Nickel Catalysts Enable Energy-Efficient Hydrogen Production via Hydrazine Oxidation and Hydrogen Evolution Reduction

ACS Sustainable Chemistry & Engineering

DOI

2018

Soft Template‐Directed Reactions: One‐Pot Synthetic Route for Bimetallic Core–Satellite–Shell Structured Electrocatalytic Nanospheres

ChemCatChem

DOI

2018

Synergistic Nanotubular Copper‐Doped Nickel Catalysts for Hydrogen Evolution Reactions

Small

DOI

2018

Copper (0) Doping Makes Cobalt-Nickel Hydroxide a High-Efficiency Catalyst for Hydrogen Evolution Reaction

Journal of The Electrochemical Society

DOI

2018

Photocatalytic Surface Modification of PI Film for Electroless Copper Plating

Advances in Condensed Matter Physics

DOI

2017

Electrodeposition of porous MoO42--doped NiFe nanosheets for highly efficient electrocatalytic oxygen evolution reactions

Electrochimica Acta

DOI

2017

Fabrication of Nanoporous Nickel–Iron Hydroxylphosphate Composite as Bifunctional and Reversible Catalyst for Highly Efficient Intermittent Water Splitting

ACS Applied Materials & Interfaces

DOI

2017

Electrodeposition of Cobalt Nickel Hydroxide Composite as a High-Efficiency Catalyst for Hydrogen Evolution Reactions

Journal of The Electrochemical Society

DOI

2016

Ionic Liquid-Assisted Electron Transfer in Micelles for Simultaneous Deposition of Uniform Ag Nanoparticles at Electrode Surface and in Bulk Microemulsions

ECS Meeting Abstracts

DOI

2016

2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating

Electrochimica Acta

DOI

2016

Electrochemical Research of a Stable Electroless Silver Bath

Journal of The Electrochemical Society

DOI

2016

Electrochemical Synthesis of Continuous Controllable Ag Nanoparticles from Quaternary Ionic Liquid Microemulsions and Electrocatalytic Activity

Journal of The Electrochemical Society

DOI

2015

Tetrazole Derived Levelers for Filling Electroplated Cu Microvias: Electrochemical Behaviors and Quantum Calculations

Electrochimica Acta

DOI

2015

Controllable electrochemical synthesis of Ag nanoparticles in ionic liquid microemulsions

Electrochemistry Communications

DOI

2015

The effect of TiO2morphology on the surface modification of poly (ethylene terephthalate) for electroless plating

Journal of Adhesion Science and Technology

DOI

2015

Investigation of Nitrogen Heterocyclic Compounds as Levelers for Electroplating Cu Filling by Electrochemical Method and Quantum Chemical Calculation

Journal of The Electrochemical Society

DOI

2013

Surface modification of ABS by photocatalytic treatment for electroless copper plating

Journal of Adhesion Science and Technology

DOI

2013

A study of bottom-up electroplated copper filling by the potential difference between two rotating speeds of a working electrode

Journal of Electroanalytical Chemistry

DOI

2013

Improvement in the Etching Performance of the Acrylonitrile–Butadiene–Styrene Resin by MnO 2 –H 3 PO 4 –H 2 SO 4 Colloid

Langmuir

DOI

2013

A Study of Low Temperature and Low Stress Electroless Copper Plating Bath

International Journal of Electrochemical Science

DOI

2013

Study of an environment-friendly surface pretreatment of ABS-polycarbonate surface for adhesion improvement

International Journal of Adhesion and Adhesives

DOI

2013

Chromium-free Etching Method for Polycarbonate Engineering Plastics

Plating and Finishing

2013

Effect of Additives on the Copper Filling Microvia in an High Acid and Low Copper Plating Solution

Plating and Finishing

2012

A study of the environmentally friendly polycarbonate surface etching system containing H2SO4–MnO2colloid

Journal of Adhesion Science and Technology

DOI

2012

Preparation and capacitance of graphene/multiwall carbon nanotubes/MnO2 hybrid material for high-performance asymmetrical electrochemical capacitor

Electrochimica Acta

DOI

2012

Adhesion improvement of electroless copper to PC substrate by a low environmental pollution MnO2–H3PO4–H2SO4–H2O system

International Journal of Adhesion and Adhesives

DOI

2012

Achievement of Bottom-Up Electroless Nickel Filling on the SiO2 Surface with Pd-Activated SAM

ECS Electrochemistry Letters

DOI

2012

A New Surface Etching Method Using MnO 2 /H 2 SO 4 Colloid for Adhesion Improvement of Epoxy Polymer

Journal of Adhesion Science and Technology

DOI

2012

Effect of additive triblock copolymer PEP-3100 on bottom-up filling in electroless copper plating

Russian Journal of Electrochemistry

DOI

2012

Effects of Ionic Liquid Namely 1-ethyl-3-methyl Imidazolium Fluoroboric Acid Solvent to Electroless Copper Plating

Plating and Finishing

2011

Preparation of Ag-Nanoparticle-Loaded MnO2Nanosheets and Their Capacitance Behavior

Energy & Fuels

DOI

2011

Graphene–MnO2 and graphene asymmetrical electrochemical capacitor with a high energy density in aqueous electrolyte

Journal of Power Sources

DOI

2011

Design and achievement of a complete bottom-up electroless copper filling for sub-micrometer trenches

Electrochimica Acta

DOI

2011

Study of an Environmentally Friendly Surface Etching System of ABS for Improving Adhesion of Electroless Cu film

Journal of The Electrochemical Society

DOI

2011

Adhesion Improvement of ABS Resin to Electroless Copper by H2SO4–MnO2 Colloid with Ultrasound-Assisted Treatment

Journal of Adhesion Science and Technology

DOI

2011

A Synergy Effect of 2-MBT and PE-3650 on the Bottom-Up Filling in Electroless Copper Plating

Electrochemical and Solid-State Letters

DOI

2011

Effects of Etching Conditions on the Surface Roughening Effect of Polycarbonate Substrate

Plating and Finishing

2010

Fabrication of a hybrid graphene/layered double hydroxide material

Carbon

DOI

2010

Preparation and capacitive property of manganese oxide nanobelt bundles with birnessite-type structure

Journal of Power Sources

DOI

2010

Preparation and capacitance property of MnO2-pillared Ni2+–Fe3+ layered double hydroxides nanocomposite

Journal of Colloid and Interface Science

DOI

2010

Bottom-Up Filling in Electroless Plating with an Addition of PEG–PPG Triblock Copolymers

Electrochemical and Solid-State Letters

DOI

2010

First Synergy Effects of SPS and PEG-4000 on the Bottom-Up Filling in Electroless Copper Plating

Journal of The Electrochemical Society

DOI

2010

Effects of Triethanolamine and K[sub 4][Fe(CN)[sub 6]] upon Electroless Copper Plating

Journal of The Electrochemical Society

DOI

2010

Advance in Research of Chromium-free Etching Method for Plastics Surface

Plating and Finishing

2009

超级化学镀铜填充微道沟的研究

《化学学报》

2009

Crystal structure of (3,5-pyrazoledicarboxylato)-bis(diethylenediamine) cobalt(II) hexahydrate, [Co(C5H2N2O4)(C2H8N2)2] ·6H2O

Zeitschrift für Kristallographie - New Crystal Structures

DOI

2009

Synthesis and capacitive property of hierarchical hollow manganese oxide nanospheres with large specific surface area

Journal of Power Sources

DOI

2009

Crystal structure of (3,5-pyrazoledicarboxylato)-bis(diethyleneiiamine) cobalt(II) hexahydrate, [Co(C5H2N2O4)(C2H8N2)2] · 6H2O

Zeitschrift für Kristallographie - New Crystal Structures

DOI

2009

Syntheses, characterization, and crystal structures of coordination polymers: {NH4 · [Ln(OVA)4]} n (Ln=Pr, Nd, Gd, and Ho; OVA=2-hydroxy-3-methoxybenzoate)

Journal of Coordination Chemistry

DOI

2009

Cu Filling Characteristics in Through-Si Via Holes by Electroless Plating with Addition of Inhibitors

ECS Transactions

DOI

2009

Phase coexistence and high electrical properties in (KxNa0.96−xLi0.04)(Nb0.85Ta0.15)O3 piezoelectric ceramics

Journal of Applied Physics

DOI

2009

An Environment-Friendly Surface Pretreatment of ABS Resin Prior to Electroless Plating

Electrochemical and Solid-State Letters

DOI

2008

不同分子量PEG的铜电镀液对电化学沉积铜行为的研究

《电化学(中英文)》

2008

Crystal structure of tetra[(3,5-pyrazoledicarboxylic)(tripyridine)- nickel(II)] —pyridine—methanol —water (1:2:5:3), [Ni(C5H2N2O4)(C5H5N)3]4 · 2C5H5N·5CH3OH·3H2O

Zeitschrift für Kristallographie - New Crystal Structures

DOI

2008

Effect of PEG molecular weight on Bottom-up Filling of Copper Electrodeposition for PCB

ECS Meeting Abstracts

DOI

2008

Phase structure, morphology, and Raman characteristics of NaNbO3 particles synthesized by different methods

Materials Research Bulletin

DOI

2008

Phase transitional behavior, microstructure, and electrical properties in Ta-modified [(K0.458Na0.542)0.96Li0.04] NbO3 lead-free piezoelectric ceramics

Journal of Applied Physics

DOI

2008

Synthesis and morphology of anisotropic NaNbO3 seed crystals

Materials Chemistry and Physics

DOI

2008

Phase Structure, Microstructure, and Electrical Properties of Sb‐Modified (K, Na, Li) (Nb, Ta) O 3 Piezoelectric Ceramics

Journal of the American Ceramic Society

DOI

2008

Synthesis and characterization of N,N′-bis(o-vanillyidene)-2,6-pyridinediamine(H2L) Schiff base complexes

Journal of Shaanxi Normal University

2008

Latest progress of electroless copper deposition

Electroplating & Finishing

2007

Characterization of sputtered tungsten nitride film and its application to Cu electroless plating

Microelectronic Engineering

DOI

2007

Effects of Li content on the phase structure and electrical properties of lead-free (K0.46−x∕2Na0.54−x∕2Lix)(Nb0.76Ta0.20Sb0.04)O3 ceramics

Applied Physics Letters

DOI

2006

化学镀技术在超大规模集成电路互连线制造过程的应用

《电化学(中英文)》

2006

New Rare Earth(III) Complexes with H2tmtaa

Chinese Journal of Chemistry

DOI

2006

Preparation of a polymer-intercalated layered manganese oxide nanocomposite through a delamination/reassembling process

Journal of materials research/Pratt's guide to venture capital sources

DOI

2006

Bottom-up fill mechanisms of electroless copper plating with addition of mercapto alkyl carboxylic acid

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena

DOI

2005

Bottom-up copper fill with addition of mercapto alkyl carboxylic acid in electroless plating

Electrochimica Acta

DOI

2005

Characterization of Electroless-Plated Cu Film over Pd Catalytic Layer Formed by an Ionized Cluster Beam

Journal of The Electrochemical Society

DOI

Highly enhanced photoelectrocatalytic activity of NiFe/Ni/BiVO4 photoanode by a facile photoelectron-activation process in neutral solution

Journal of Photochemistry and Photobiology A: Chemistry

DOI

2017

电沉积法制备镍钴铜催化剂用于催化水分解

《“一带一路，引领西部发展”——2017年中西部地区无机化学化工学术研讨会论文摘要》

2017

高活性泡沫镍负载镍铜合金电极的制备及电催化析氢

《“一带一路，引领西部发展”——2017年中西部地区无机化学化工学术研讨会》

2007

电化学研究化学镀铜溶液中三乙醇胺和亚铁氰化钾的作用机理

《2007年上海市电子电镀学术年会论文集》

2025

Study on Activating an Inactive Electroplating Formula by Tailoring the Potential Difference with 2-Aminobenzothiazole as a Leveler for Bottom-Up Filling

SSRN Electronic Journal

DOI