于大全｜厦门大学｜学者主页

2026

玻璃基先进封装关键电镀工艺及其电镀质量控制综述

贾照伟，王其强，吴勐，李宁，马盛林，于大全

《电子与封装》

DOI

2026

“玻璃基板及其封装技术”专题前言

于大全

《电子与封装》

2026

三维集成电路通孔金属化技术研究进展

孙鹏，全雪松，杜韵辉，黎科，钟毅，于大全

《电镀与精饰》

2026

玻璃通孔技术 = Through glass via technology

于大全

《清华大学出版社》

2026

Wafer-level self-packaged MEMS infrared emitters with high-emissivity black silicon surface

Zhiwei Li, Hong-Liang Zu, Hongyu Chen, Minghao Liu, H. San, Daquan Yu

Microsystems & Nanoengineering

DOI

2026

High thermal conductivity electroplating-assisted stitched large-area diamond substrates for high performance electronic devices

Xinshuo Zhang, Ke Li, Ning-Ning Xu, Yixiong Wu, Yi Zhong, Weiyi Lin, Rong-Bin Xu, Dongxue Liang, Daquan Yu

Diamond and related materials

DOI

2026

Fabrication and Thermo-Mechanical Stress Optimization of High Aspect Ratio TSVs for Advanced 3D Integration

Yunhui Du, Zeming Tao, Dongchen Fan, Ke Li, Yi Zhong, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Research on Thermal Simulation and Analysis of High-Power Digital SiP Chips

Ying Tian, GuangTao Hu, Shiyuan Wang, Li Yan, Daquan Yu, Xiuwei Zhou, Miao Zhang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Fluorine-Free Alkaline Laser-Induced Deep Etching Technology for High Aspect Ratio Through-Glass Vias in 3D Integration

Xuesong Quan, Xiaoting Chen, Chen Yu, Peng Sun, Dongchen Fan, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Wafer-Level Packaging of a V-Band Air-Filled 3-dB Directional Coupler Using TGV Technologies

Qing Zhou, Daquan Yu, Miao Zhang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

High-Density Heterogeneous Integration of Collective Si Dies and Glass Wafers via Low-Temperature Die-to-Wafer Bonding

Shuchao Bao, Ningning Xu, Yi Zhong, Wenbiao Ruan, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Silicon-Based Three-Dimensional Deep Trench Capacitors with Multilayer Dielectric Structures

Zhiqiao Ye, Ruijie Zhan, Xuesong Quan, Yuhang Dou, Rongbin Xu, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Process Development and Suppression of Stress and Warpage in embedded Glass Fan-Out Packaging

Dongchen Fan, Xuesong Quan, Jiahao Liu, Ningning Xu, 唐静晓, Yi Zhong, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

High Performance Phosphor‐in‐Glass Film on Grating Structure Sapphire Substrate for Laser Lighting

Mingchao Fang, Wenting Ding, Cihao Huang, Baoping Zhang, Mei Yang, 应磊莹, Daquan Yu, Rongbin Xu

Journal of the American Ceramic Society

DOI

2025

“玻璃通孔技术进展和应用”专题前言

崔成强，于大全

《电子与封装》

2025

玻璃通孔化学镀金属化研究进展

孙鹏，钟毅，于大全

《电子与封装》

DOI

2025

玻璃通孔技术的射频集成应用研究进展

喻甜，陈新，林景裕，钟毅，梁峻阁，顾晓峰，于大全

《电子与封装》

DOI

2025

玻璃基板技术研究进展

赵瑾，于大全，秦飞

《电子与封装》

DOI

2025

混合键合界面接触电阻及界面热阻研究进展

吴艺雄，杜韵辉，陶泽明，钟毅，于大全

《电子与封装》

DOI

2025

Impacts of substrate and growth temperature on the deposition and etching of c-axis oriented AlN piezoelectric thin films

Shaocheng Wu, Wenjiao Pei, Rong-Bin Xu, Yibo Zeng, Jianfang Xu, Baoping Zhang, Daquan Yu

Scripta Materialia

DOI

2025

Influence of AlN-Interlayer and Growth Parameters of Mo Electrode on AlN Piezoelectric Thin Films for FBAR

Shaocheng Wu, Jiazhe Zhang, Yu-Hang Dou, Rong-Bin Xu, Daquan Yu

IEEE International Conference on Nano/Micro Engineered and Molecular Systems

DOI

2025

Single crystal diamond polishing assisted by inductively coupled plasma etching

Jia-Rong Yu, Xinyue Liu, Rong-Bin Xu, Daquan Yu

Diamond and related materials

DOI

2025

Atomic layer deposition of super conformal copper seed layer for ultra-high aspect ratio through-silicon-vias

Ke Li, Xinshuo Zhang, Lei Jin, Li-Si Wei, Qifei Xia, Rong-Bin Xu, Weiyi Lin, Yi Zhong, Daquan Yu

Colloids and Surfaces A: Physicochemical and Engineering Aspects

DOI

2025

The Influence of Different Nanoscale Channel Lengths in Low-Temperature-Grown Lateral MoS2 Memristors.

Danyun Wang, Daquan Yu, Hongyu Chen, Caiyuan Zhao, Xinyi Chen, Miao Lu

ACS Applied Materials and Interfaces

DOI

2025

Scaling effect of nanoscale channel on the resistive switching performance of lateral molybdenum disulfide memristors

Danyun Wang, Daquan Yu, Hongyu Chen, Caiyuan Zhao, Xinyi Chen, Miao Lu

Journal of Alloys and Compounds

DOI

2025

Dielectric metasurface‐assisted terahertz sensing: mechanism, fabrication, and multiscenario applications

Xueer Chen, Shanshan Xin, Qing Liu, Yihan Meng, Daquan Yu, Ming Lun Tseng, Longfang Ye

Nanophotonics

DOI

2024

集成电路互连微纳米尺度硅通孔技术进展

黎科，张鑫硕，夏启飞，钟毅，于大全

《电子与封装》

2024

面向Chiplet集成的三维互连硅桥技术

赵瑾，于大全，秦飞

《电子与封装》

2024

面向大算力应用的芯粒集成技术

王成迁，汤文学，戴飞虎，丁荣峥，于大全

《电子与封装》

2024

Metal Penetration and Grain Boundary in MoS2 Memristors

Han Yan, Ping-Ping Zhuang, Bo Li, Tian Ye, Changjie Zhou, Yu-Shan Chen, Tiejun Li, Weiwei Cai, Daquan Yu, Jing Liu, Weiyi Lin

Advanced Electronic Materials

DOI

2024

Quasi‐2D Phonon Transport in Diamond Nanosheet

Yunting Zhu, Tian Ye, Hailang Wen, Rong-Bin Xu, Yi Zhong, Guangyang Lin, Dongxue Liang, Weiwei Cai, Daquan Yu, Weiyi Lin

Advanced Functional Materials

DOI

2024

Wafer-Level Packaging Technology Of W-Band Antennas Based On Through Glass

Ning Jia, Yan Wei, Wenbiao Ruan, Fangming Xu, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

A Study on the cleaning efficiency of chip-let Micro-structure

Zhaowei Jia, Jian Wang, David H. Wang, Daquan Yu, Junwei Sheng, Chenhua Lu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Implementation of High Q and Low Cost 3D Inductor Embeded in Polyimide

Jiahui Wang, Manyu Wang, Hengxiang Zhang, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2024

Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers

Yi Zhong, Shuchao Bao, Ran He, Xiao‐Fan Jiang, Hengbo Zhang, Wenbiao Ruan, Mingchuan Zhang, Daquan Yu

Journal of Material Science and Technology

DOI

2024

Development of 3-D Wafer Level Packaging for SAW Filters Using Non-photosensitive dry Film Capping

Wenjiao Pei, Rongbin Xu, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

芯片三维互连技术及异质集成研究进展

钟毅，江小帆，喻甜，李威，于大全

《电子与封装》

DOI

2023

面向芯片三维封装的低成本玻璃基深沟电容技术

胡芝慧，钟毅，窦宇航，于大全

《电子与封装》

2023

“先进三维封装与异质集成”专题前言

于大全

《电子与封装》

2023

Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP

Wei Li, Daquan Yu

Electronics

DOI

2023

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Yu Chen, Shaocheng Wu, Yi Zhong, Rongbin Xu, Tian Yu, Jin Zhao, Daquan Yu

Sensors

DOI

2023

Growth behavior and mechanism of atomic layer deposition of Ru for replacing Cu-interconnects

Manyu Wang, Jiahui Wang, Lei Jin, Yu Tian, Daquan Yu

Vacuum

DOI

2023

A Low-Cost On-Chip Substrate Integrated Plasmonic Waveguide Bandpass Filter for Millimeter-Wave Applications

Tian Lai Yu, Weiwen Li, Daquan Yu

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2023

Development of high performance 2.5D packaging using glass interposer with through glass vias

Jin Zhao, Zuohuan Chen, Fei Qin, Daquan Yu

Journal of Materials Science Materials in Electronics

DOI

2023

Completely Filling of Through-Silicon-Vias with High Aspect Ratio by High Cavity Physical Vapor Deposition and Electroplating

Manyu Wang, Ke Li, Shuchao Bao, Zhongliang Liu, Yunting Zhu, Jiahui Wang, Qifei Xia, Shaocheng Wu, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2023

On the optimization of molding warpage for wafer-level glass interposer packaging

Shuchao Bao, Wei Li, Yimin He, Yi Zhong, Long Zhang, Daquan Yu

Journal of Materials Science Materials in Electronics

DOI

2023

High‐Gain of NdIII Complex Doped Optical Waveguide Amplifiers at 1.06 and 1.31 µm Wavelengths Based on Intramolecular Energy Transfer Mechanism (Adv. Mater. 12/2023)

Zhuliang Lin, Yi Man, Ziyue Lv, Baoping Zhang, Hui Xu, Daquan Yu, Xingchen Yang, Yan He, Xiaowu Shi, Leiying Ying, Dan Zhang

Advanced Materials

DOI

2023

High‐Gain of Nd III Complex Doped Optical Waveguide Amplifiers at 1.06 and 1.31 µm Wavelengths Based on Intramolecular Energy Transfer Mechanism

Zhuliang Lin, Yi Man, Ziyue Lv, Baoping Zhang, Hui Xu, Daquan Yu, Xingchen Yang, Yan He, Xiaowu Shi, Leiying Ying, Dan Zhang

Advanced Materials

DOI

2023

Electrical properties of AlGaN/GaN HEMT under different temperatures

Yihang liang, Tian Lai Yu, Daquan Yu

International Conference on Electronic Materials and Information Engineering (EMIE)

DOI

2023

Electrical performance characterization of glass substrate for millimeter-wave applications

Tian Lai Yu, Daquan Yu

Journal of Materials Science Materials in Electronics

DOI

2022

玻璃通孔三维互连镀铜填充技术发展现状

纪执敬，凌惠琴，吴培林，余瑞益，于大全，李明

《电化学(中英文)》

2022

Design and Fabrication of High-Q IPDS for Process Design Kits on Glass Substrate

Haozhe Ma, Zhihui Hu, Qing Zhou, Jiabin Chen, Daquan Yu

China Semiconductor Technology International Conference (CSTIC)

DOI

2022

Laser Lift‐Off Technologies for Ultra‐Thin Emerging Electronics: Mechanisms, Applications, and Progress

Fangcheng Wang, Qiang Liu, Jianwen Xia, Mingqi Huang, Xuefan Wang, Wenxue Dai, Guoping Zhang, Daquan Yu, Jinhui Li, Rong Sun

Advanced Materials Technologies

DOI

2022

Warpage Investigation of Fan-Out Wafer-Level Packaging With Novel Thermosetting Films

Wei Li, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2022

Low - Temperature Die to Glass Wafer Bonding Based on Au-Au Atomic Diffusion

Shuchao Bao, Yi Zhong, Yimin He, Ke Li, Daquan Yu

China Semiconductor Technology International Conference (CSTIC)

DOI

2021

基于玻璃衬底的三维电感器件的仿真与实现

王磊，惠科晴，薛恺，姜峰，于大全

《固体电子学研究与进展》

DOI

2021

硅通孔三维封装技术

于大全

《电子工业出版社》

2021

声表面波滤波器圆片级互连封装技术研究

陈作桓，于大全，张名川

《中国集成电路》

2021

玻璃通孔技术研究进展

陈力，杨晓锋，于大全

《电子与封装》

DOI

2021

Double-sided Electroplating Process for Through Glass Vias (TGVs) Filling

Ke Li, Heng Wu, Weijian Chen, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2021

3D Wafer Level Packaging for SAW Filter Using Thin Glass Capping with Through Glass Vias

Zuohuan Chen, Jin Zhao, Feng Jiang, Heng Wu, Mingchuan Zhang, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2021

Low Temperature Bonding Polycrystalline Diamond to Si by Using Au Thin-layer for High-power Semiconductor Devices

Yi Zhong, Shuchao Bao, Ke Li, Mingchuan Zhang, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2021

The Formation of Cn-Sn IMC Interconnection by Solid-Liquid Interdiffusion Bonding for 3D Glass Wafer Stacking

Yangquan Su, Kuili Ren, Yiyong Huang, Mingchuan Zhang, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2021

The Redistribution Layer-First Embedded Fan-Out Wafer Level Packaging for 2-D Ultrasonic Transducer Arrays

Yao Lu, Daquan Yu, Lixi Wan, Xiaodong Zhang, Min Xiang, Zhiqiang Zhang, Min Su, Weibao Qiu

IEEE Electron Device Letters

DOI

2021

Investigation of low-cost through glass vias formation on borosilicate glass by picosecond laser-induced selective etching

Li Chen, Daquan Yu

Journal of Materials Science Materials in Electronics

DOI

2021

33.5 A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density

Dongfang Pan, Guolong Li, Fangting Miao, Biao Deng, Junying Wei, Daquan Yu, Ming Liu, Lin Cheng

Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference

DOI

2020

Development of 3D Wafer Level Package for SAW Filters Using Thin Film Lamination

Zuohuan Chen, Mingchuan Zhang, Kai Zhu, Feng Jiang, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2020

A Promising Embedded Silicon Fan-Out Wafer Level Package with Laser Releasable Temporary Bonding Technology

Chengqian Wang, Aibing Zhang, Zhengfeng Li, Shouwei Li, Yang Li, Yong Ji, Xuefei Ming, Daquan Yu

China Semiconductor Technology International Conference (CSTIC)

DOI

2020

Development of Embedded Glass Wafer Fan-Out Package With 2D Antenna Arrays for 77GHz Millimeter-wave Chip

Tian Lai Yu, Xiaodong Zhang, Li Chen, Xiaoli Ren, Zongming Duan, Daquan Yu

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2019

Development of Laser-Induced Deep Etching Process for Through Glass Via

Li Chen, Heng Wu, Mingchuan Zhang, Feng Jiang, Tian Lai Yu, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2019

Process, Design and Simulation for Millimeter Wave Chip Packaging Using Embedded Glass Fan-Out Technology

Tian Lai Yu, Cheng Chen, Feng Jiang, Li Chen, Mingchuan Zhang, Daquan Yu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2018

基于光敏玻璃的垂直互连通孔仿真与电镀工艺研究

林来存，王启东，邱德龙，伍恒，薛恺，于大全，曹立强

《北京理工大学学报》

2016

Design, analysis and test of high-frequency interconnections in 2.5D package with silicon interposer

任晓黎，庞诚，秦征，平野，姜峰，薛恺，刘海燕，于大全

Journal of Semiconductors

2016

Optimal design analysis for thermal performance of high power 2.5D package

刘晓阳，马鹤，于大全，陈文录，吴小龙

Journal of Semiconductors

2015

硅通孔(TSV)转接板微组装技术研究进展

刘晓阳，刘海燕，于大全，吴小龙，陈文录

《电子与封装》

2015

低功耗DDR高速信号的封装布线方案设计及信号完整性分析

秦征，尚文亚，于大全

《现代电子技术》

2015

用于射频集成的高Q硅基电感的优化设计

王惠娟，潘杰，任晓黎，曹立强，于大全，万里兮

《现代电子技术》

2014

应用于TGV的ICP玻璃刻蚀工艺研究

张名川，靖向萌，王京，杨盟，于大全

《真空科学与技术学报》

2014

高深宽比硅通孔的SAPS兆声波清洗技术

薛恺，陈福平，张晓燕，张明川，王晖，于大全

《半导体技术》

2013

Simulation of through via bottom–up copper plating with accelerator for the filling of TSVs

伍恒，唐祯安，王竹，程万，于大全

Journal of Semiconductors

2013

TSV转接板硅通孔的热应力分析

安彤，秦飞，武伟，于大全，万里兮，王珺

《工程力学》

2013

TSV结构的几种SPICE模型仿真

庞诚，王志，于大全

《半导体技术》

2013

New de-embedding structures for extracting the electrical parameters of a through-silicon-via pair

周静，万里兮，李君，王惠娟，戴风伟，Daniel Guidotti，曹立强，于大全

Journal of Semiconductors

2012

TSV结构热机械可靠性研究综述

秦飞，王珺，万里兮，于大全，曹立强，朱文辉

《半导体技术》

2012

High-speed through-silicon via filling method using Cu-cored solder balls

赫然，王惠娟，于大全，周静，戴风伟，宋崇申，孙瑜，万里兮

Journal of Semiconductors

2006

铜含量对Sn-Cu钎料与Cu、Ni基板钎焊界面IMC的影响

何大鹏，于大全，王来，C M L Wu

《中国有色金属学报》

2005

时效Sn-9Zn-3Bi/Cu钎焊接头的电子探针分析

王秀敏，于大全，刘瑞岩，王来

《理化检验-物理分册》

2005

Sn-Zn-Cu/Cu界面反应及剪切强度

王来，马海涛，谢海平，于大全

《大连理工大学学报》

2005

Sn-3.5Ag/Cu界面金属间化合物的生长行为研究

于大全，段莉蕾，赵杰，王来，C.M.L.Wu

《材料科学与工艺》

2004

Sn-Zn-Cu无铅钎料的组织、润湿性和力学性能

谢海平，于大全，马海涛，王来

《中国有色金属学报》

2004

Sn-9Zn-3Bi/Cu钎焊接头在170℃时效过程中的显微结构

段莉蕾，于大全，赵杰，王来

《中国有色金属学报》

2004

电子封装互连无铅钎料及其界面问题研究

于大全

《大连理工大学》

2004

Y2O3增强Sn-3Ag-0.5Cu复合无铅钎料

刘晓英，于大全，马海涛，谢海平，王来

《电子工艺技术》

2003

稀土元素对Sn-9Zn合金润湿性的影响

于大全，赵杰，王来

《中国有色金属学报》

2002

Sn-6Bi-2Ag(Cu,Sb)无铅钎料合金微观组织分析

黄明亮，于大全，王来，王富岗

《中国有色金属学报》

精选作品

期刊论文

玻璃基先进封装关键电镀工艺及其电镀质量控制综述

“玻璃基板及其封装技术”专题前言

三维集成电路通孔金属化技术研究进展

玻璃通孔技术 = Through glass via technology

Wafer-level self-packaged MEMS infrared emitters with high-emissivity black silicon surface

High thermal conductivity electroplating-assisted stitched large-area diamond substrates for high performance electronic devices

Fabrication and Thermo-Mechanical Stress Optimization of High Aspect Ratio TSVs for Advanced 3D Integration

Research on Thermal Simulation and Analysis of High-Power Digital SiP Chips

Fluorine-Free Alkaline Laser-Induced Deep Etching Technology for High Aspect Ratio Through-Glass Vias in 3D Integration

Wafer-Level Packaging of a V-Band Air-Filled 3-dB Directional Coupler Using TGV Technologies

High-Density Heterogeneous Integration of Collective Si Dies and Glass Wafers via Low-Temperature Die-to-Wafer Bonding

Silicon-Based Three-Dimensional Deep Trench Capacitors with Multilayer Dielectric Structures

Process Development and Suppression of Stress and Warpage in embedded Glass Fan-Out Packaging

High Performance Phosphor‐in‐Glass Film on Grating Structure Sapphire Substrate for Laser Lighting

“玻璃通孔技术进展和应用”专题前言

玻璃通孔化学镀金属化研究进展

玻璃通孔技术的射频集成应用研究进展

玻璃基板技术研究进展

混合键合界面接触电阻及界面热阻研究进展

Impacts of substrate and growth temperature on the deposition and etching of c-axis oriented AlN piezoelectric thin films

Influence of AlN-Interlayer and Growth Parameters of Mo Electrode on AlN Piezoelectric Thin Films for FBAR

Single crystal diamond polishing assisted by inductively coupled plasma etching

Atomic layer deposition of super conformal copper seed layer for ultra-high aspect ratio through-silicon-vias

The Influence of Different Nanoscale Channel Lengths in Low-Temperature-Grown Lateral MoS2 Memristors.

Scaling effect of nanoscale channel on the resistive switching performance of lateral molybdenum disulfide memristors

Dielectric metasurface‐assisted terahertz sensing: mechanism, fabrication, and multiscenario applications

集成电路互连微纳米尺度硅通孔技术进展

面向Chiplet集成的三维互连硅桥技术

面向大算力应用的芯粒集成技术

Metal Penetration and Grain Boundary in MoS2 Memristors

Quasi‐2D Phonon Transport in Diamond Nanosheet

Wafer-Level Packaging Technology Of W-Band Antennas Based On Through Glass

A Study on the cleaning efficiency of chip-let Micro-structure

Implementation of High Q and Low Cost 3D Inductor Embeded in Polyimide

Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers

Development of 3-D Wafer Level Packaging for SAW Filters Using Non-photosensitive dry Film Capping

芯片三维互连技术及异质集成研究进展

面向芯片三维封装的低成本玻璃基深沟电容技术

“先进三维封装与异质集成”专题前言

Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Growth behavior and mechanism of atomic layer deposition of Ru for replacing Cu-interconnects

A Low-Cost On-Chip Substrate Integrated Plasmonic Waveguide Bandpass Filter for Millimeter-Wave Applications

Development of high performance 2.5D packaging using glass interposer with through glass vias

Completely Filling of Through-Silicon-Vias with High Aspect Ratio by High Cavity Physical Vapor Deposition and Electroplating

On the optimization of molding warpage for wafer-level glass interposer packaging

High‐Gain of NdIII Complex Doped Optical Waveguide Amplifiers at 1.06 and 1.31 µm Wavelengths Based on Intramolecular Energy Transfer Mechanism (Adv. Mater. 12/2023)

High‐Gain of Nd III Complex Doped Optical Waveguide Amplifiers at 1.06 and 1.31 µm Wavelengths Based on Intramolecular Energy Transfer Mechanism

Electrical properties of AlGaN/GaN HEMT under different temperatures

Electrical performance characterization of glass substrate for millimeter-wave applications

玻璃通孔三维互连镀铜填充技术发展现状

Design and Fabrication of High-Q IPDS for Process Design Kits on Glass Substrate

Laser Lift‐Off Technologies for Ultra‐Thin Emerging Electronics: Mechanisms, Applications, and Progress

Warpage Investigation of Fan-Out Wafer-Level Packaging With Novel Thermosetting Films

Low - Temperature Die to Glass Wafer Bonding Based on Au-Au Atomic Diffusion

基于玻璃衬底的三维电感器件的仿真与实现

硅通孔三维封装技术

声表面波滤波器圆片级互连封装技术研究

玻璃通孔技术研究进展

Double-sided Electroplating Process for Through Glass Vias (TGVs) Filling

3D Wafer Level Packaging for SAW Filter Using Thin Glass Capping with Through Glass Vias

Low Temperature Bonding Polycrystalline Diamond to Si by Using Au Thin-layer for High-power Semiconductor Devices

The Formation of Cn-Sn IMC Interconnection by Solid-Liquid Interdiffusion Bonding for 3D Glass Wafer Stacking

The Redistribution Layer-First Embedded Fan-Out Wafer Level Packaging for 2-D Ultrasonic Transducer Arrays

Investigation of low-cost through glass vias formation on borosilicate glass by picosecond laser-induced selective etching

33.5 A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density

Development of 3D Wafer Level Package for SAW Filters Using Thin Film Lamination

A Promising Embedded Silicon Fan-Out Wafer Level Package with Laser Releasable Temporary Bonding Technology

Development of Embedded Glass Wafer Fan-Out Package With 2D Antenna Arrays for 77GHz Millimeter-wave Chip

Development of Laser-Induced Deep Etching Process for Through Glass Via

Process, Design and Simulation for Millimeter Wave Chip Packaging Using Embedded Glass Fan-Out Technology

基于光敏玻璃的垂直互连通孔仿真与电镀工艺研究

Design, analysis and test of high-frequency interconnections in 2.5D package with silicon interposer

Optimal design analysis for thermal performance of high power 2.5D package

硅通孔(TSV)转接板微组装技术研究进展

低功耗DDR高速信号的封装布线方案设计及信号完整性分析

用于射频集成的高Q硅基电感的优化设计

应用于TGV的ICP玻璃刻蚀工艺研究