陈明祥｜华中科技大学｜学者主页

2026

荧光转换激光光源封装用荧光玻璃膜研究进展

余子康，赵九洲，牟运，彭洋，陈明祥

《中国激光》

2026

高亮度激光荧光光源用双面蓝宝石基荧光玻璃膜制备及其光热性能

Hong-Jin Zhang, Jiuzhou Zhao, Zi-Kang Yu, Xiao-Wei Liu, Peng Yang, Mingxiang Chen

Chinese Journal of Luminescence

DOI

2026

超高速直流电沉积制备高质量图形化铜层

李天翔，袁昊，蔡文通，彭洋，王卿，陈明祥

《中国表面工程》

2026

A Universal PiGF@Sapphire@MiG Color Converter with Synergistically Enhanced Opto‐Thermal Performance for Laser‐Driven Applications

Zi-Kang Yu, Mingxiang Chen, Jiu-Zhou Zhao, Hong-Jin Zhang, Sifan Zhuo, Shi-Sheng Lin, Yang Peng, Da-Qin Chen

Advanced Optical Materials

DOI

2026

Novel alumina heat sink structure for enhanced thermal management of phosphor-in-glass film enabling high saturation threshold in high-brightness laser lighting

Haoran Cheng, Yang Wang, Jia-Ao Peng, Lei Nie, Yang Peng, Mingxiang Chen, Lei-Meng Sun, Qing Wang

Optics & Laser Technology

DOI

2026

Omnidirectionally Encapsulated Phosphor‐in‐Glass Film Converter for Laser‐Driven Lighting Source

Hong-Jin Zhang, Jiu-Zhou Zhao, Zi-Kang Yu, Shi-Sheng Lin, Xiaowei Liu, Jiang-Nan Dai, Mingxiang Chen, Yang Peng, Da-Qin Chen

Laser & Photonics Reviews

DOI

2026

Phosphor-converted white LD with high luminous efficacy through sapphire lens based PiGF

Hongjin Zhang, Jiuzhou Zhao, Zikang Yu, Renli Liang, Mingxiang Chen, Yang Peng

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

UV-Induced Surface Aminolysis of Liquid Crystal Polymer for Quasihermetic Packaging

Xin Tang, Ran Lu, Lin Cui, Xianxing Ju, Jiaqi Ni, Yanyan Xu, Qing Wang, Mingxiang Chen

IEEE Transactions on Electron Devices

DOI

2026

Fabrication of Multilayer Circuit on DPC Ceramic Substrate with Polyimide

Zhenyu Lei, Mingxiang Chen, Changqing Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

All-inorganic ceramic packaging based on moisture-resistant and heat-resistant sodium silicate adhesive

Ran Lu, Xin Tang, Yongjie Ding, Mingxiang Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Quasi-Hermetic Sealing Technology for Three-Dimensional Ceramic Substrates Using Adhesive Bonding

Xin Tang, Ran Lu, Lin Cui, Jiaqi Ni, Xianxing Ju, Qing Wang, Mingxiang Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Multi-Scale Research on Microcrack Sources and Propagation Induction Mechanism of TCV Structures in DPC Substrates under Temperature Cyclic Stress Loading

Heran Zhao, ShiZhao Wang, Min Kang, Lihua Cao, He Zhang, Mingxiang Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Synergetic improvement in opto-thermal performance of white laser diode with MgO-in-glass layer

Zikang Yu, Yang Peng, Mingxiang Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Electrospun stretchable BNNS/PVA composite film for efficient thermal management of flexible electronics

Yanyan Xu, Bin Xie, Mingxiang Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2026

Predictive Modeling of TCV-Cu Protrusion Under Thermal Cycling

Heran Zhao, Tao He, Dan Li, Lihua Cao, ShiZhao Wang, Mingxiang Chen

IEEE Transactions on Components Packaging and Manufacturing Technology

DOI

2025

铜-铜键合制备多层陶瓷基板技术研究

雷振宇，陈浩，翟禹光，王莎鸥，陈明祥

《电子与封装》

DOI

2025

面向未来应急消防的柔性智能头盔设计

赵鹤然，严义君，黄维，曹中复，王诗兆，刘笛，蔡玉辉，陈明祥

《无线电工程》

2025

Multi-channel thermal conductive phosphor-in-glass film with a record laser power density threshold for laser lighting

Haoran Cheng, Yang Wang, Jiu-Zhou Zhao, Qing Wang, Shi-Sheng Lin, Jia-Xin Liu, Yun Mou, Lei Nie, Mingxiang Chen, Zhen Zhang, Yang Peng, Da-Qin Chen

Chemical Engineering Journal

DOI

2025

Room-temperature fabrication of phosphor-in-geopolymer converter enabling high color quality for laser-driven lighting

Hao-Chun Cheng, Yang Wang, Yang Peng, Hong-Jin Zhang, Yun Mou, Lei Nie, Qing Wang, Mingxiang Chen

Journal of Alloys and Compounds

DOI

2025

Toward High‐Brightness Laser Lighting: Progress and Perspectives on Phosphor‐in‐Glass Films

Zikang Yu, Yun Mou, Yang Peng, Daqin Chen, Mingxiang Chen

Advanced Materials Technologies

DOI

2024

厚膜印刷陶瓷基板的版内电阻一致性改进

焦峰，邹欣，陈明祥

《电子与封装》

2024

三维电镀陶瓷基板激光封焊技术

罗霖，丁勇杰，苏鹏飞，赵九洲，彭洋，陈明祥

《发光学报》

2024

基于Chip-on-TEC的高精度晶体振荡器研究

刘文林，宋玉琢，魏文菲，吕强，徐建，陈明祥，黄大勇

《电子元件与材料》

2024

陶瓷转接板制备技术与应用进展

王卿，王莎鸥，彭洋，刘松坡，陈明祥

《华中科技大学学报(自然科学版)》

2024

A Novel PiGF@Diamond Color Converter with a Record Thermal Conductivity for Laser‐Driven Projection Display

Zikang Yu, Jiuzhou Zhao, Zezhong Yang, Yun Mou, Hongjin Zhang, Ruipeng Xu, Qing Wang, Lingwei Zeng, Lei Lei, Shisheng Lin, Hong Li, Yang Peng, Daqin Chen, Mingxiang Chen

Advanced Materials

DOI

2024

High Luminescence Saturation Y3Al5O12: Ce3+‐Diamond Composite Color Converter for High‐Brightness Laser‐Driven White Lighting

Zikang Yu, Jiayu Li, Jiuzhou Zhao, Hongjin Zhang, Yun Mou, Jiangnan Dai, Mingxiang Chen, Yang Peng

Laser & Photonics Review

DOI

2024

Effective heat dissipation of white laser diodes by welding metallized phosphor-sapphire

Zikang Yu, Jiuzhou Zhao, Yang Peng, Mingxiang Chen

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2023

柔性电子封装技术与应用

赵鹤然，严义君，黄维，李宏军，曹中复，陈明祥，刘笛，蔡玉辉

《中国电子科学研究院学报》

2023

耐高温微系统气密封装技术及高温可靠性研究

刘佳欣，彭洋，胡剑雄，徐建，陈明祥

《中国科学:信息科学》

2023

纳米铜焊膏烧结互连技术研究现状与展望

牟运，彭洋，刘佳欣，陈明祥

《集成技术》

2023

银纳米线柔性加热器在个人热管理中的研究进展

李晨圆，陈明祥，谢斌

《半导体技术》

2023

三维结构石英透镜提高DUV-LED的发光效率

彭洋，陈明祥，QIU J Y，MIN X H

《电子与封装》

2023

High‐Performance Phosphor‐in‐Glass Film on Thermoelectric Generator for Non‐Radiative Energy Recycling in Laser Lighting

Yang Peng, Jiuzhou Zhao, Zikang Yu, Qing Wang, Jiaxin Liu, Mingxiang Chen, Yun Mou

Advanced Materials Technologies

DOI

2022

陶瓷基板表面金属层结合强度测试与失效分析

王永通，王哲，刘京隆，彭洋，陈明祥

《电子元件与材料》

2022

溅射覆铜陶瓷基板表面研磨技术研究

王哲，刘松坡，吕锐，陈红胜，陈明祥

《电子与封装》

2022

电子封装陶瓷基板表面镀金修饰与腐蚀机理

赵鹤然，曹丽华，陈明祥，康敏，吕锐，王卿

《电镀与涂饰》

DOI

2022

荧光转换白光激光二极管荧光玻璃主动散热研究

余子康，黎双，刘佳欣，牟运，彭洋，陈明祥

《华中科技大学学报(自然科学版)》

2022

内嵌陶瓷电路板的PCB基板制备及其LED封装性能

王哲，王永通，刘佳欣，牟运，彭洋，陈明祥

《发光学报》

2021

深紫外LED封装技术现状与展望

彭洋，陈明祥，罗小兵

《发光学报》

2021

Enhanced Light Extraction of DUV LEDs by Using a Quartz Lens With Three-Dimensional Structure

Jinyang Qiu, Yang Peng, Xianhao Min, Xinzhong Wang, Mingxiang Chen

IEEE Photonics Technology Letters

DOI

2020

Reflective Phosphor-in-Glass Color Converter for Laser-Driven White Lighting

Yang Peng, Qinglei Sun, Jiaxin Liu, Yun Mou, Xinzhong Wang, Mingxiang Chen, Xiaobing Luo

IEEE Photonics Technology Letters

DOI

2020

Effect of quartz lens structure on the optical performances of near-ultraviolet light-emitting diodes

Jinyang Qiu, Yang Peng, Xianhao Min, Xinzhong Wang, Mingxiang Chen

Applied Optics

DOI

2019

电子封装陶瓷基板

程浩，陈明祥，罗小兵，彭洋，刘松坡

《现代技术陶瓷》

DOI

2019

Direct Ink Printing of Cavities in DPC Ceramic Substrates With Kaolin Pastes for Hermetic Packaging

Qinglei Sun, Yang Peng, Hao Cheng, Yun Mou, Mingxiang Chen

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

DOI

2019

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

Hao Cheng, Yang Peng, Yun Mou, Qinglei Sun, Mingxiang Chen

Journal of Electronic Packaging

DOI

2018

Glass Ceramic Phosphors: Towards Long‐Lifetime High‐Power White Light‐Emitting‐Diode Applications–A Review

Hang Lin, Tao Hu, Yao Cheng, Mingxiang Chen, Yuan-Sheng Wang

DOI

2018

Gradient refractive index structure of phosphor‐in‐glass coating for packaging of white LED s

Xujia Xu, Hong Li, Yong Zhuo, D. Xiong, Mingxiang Chen

Journal of The American Ceramic Society

DOI

2018

All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

Yang Peng, Yun Mou, Xujia Xu, Hao Cheng, Hong Li, Mingxiang Chen, Xiaobing Luo

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

DOI

2018

Creation of three-dimensional structures by direct ink writing with kaolin suspensions

Qinglei Sun, Zizhou Yang, Hao Cheng, Yang Peng, Yanqin Huang, Mingxiang Chen

Journal of Materials Chemistry C

DOI

2017

Enhanced luminous efficiency of multilayer gradient refractive index phosphor in P2O5-ZnO-B2O3-BaO glass for white light-emitting diode packages

Yong Zhuo, Hong Li, Xujia Xu, Mingxiang Chen, D. Xiong, Yuting Long, Chen Si, Ruixin Li, Zirui Liu

DOI

2017

Tunable chromaticity and enhanced luminous efficacy of white LEDs with phosphor-in-glass coating via multilayer screen-printing

Xujia Xu, Hong Li, Yong Zhuo, Ruixin Li, Pei-Jing Tian, D. Xiong, Mingxiang Chen

DOI

2017

High refractive index coating of phosphor-in-glass for enhanced light extraction efficiency of white LEDs

Xujia Xu, Hong Li, Yong Zhuo, Ruixin Li, Pei-Jing Tian, D. Xiong, Mingxiang Chen

Journal of Materials Science

DOI

2017

A novel copper-coated ceramic substrate prepared by nano thermocompression bonding

Yun Mou, Yang Peng, Hao Cheng, Ziliang Hao, Mingxiang Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2016

大功率LED封装基板技术与发展现状

吴朝晖，程浩，章军，罗素扑，陈明祥

《半导体光电》

2016

功率电子封装用陶瓷基板技术与应用进展

程浩，陈明祥，郝自亮，刘松坡

《电子元件与材料》

2016

Development of RGB phosphor-in-glass for ultraviolet-excited white light-emitting diodes packaging

Ruixin Li, Hong Li, Yang Peng, Hao Cheng, Zhen Chen, Mingxiang Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2016

Enhancement in light extraction of white leds using micro-cone patterned phosphor-in-glass

Simin Wang, Yang Peng, Ruixin Li, Mingxiang Chen, Sheng Liu

China Semiconductor Technology International Conference (CSTIC)

DOI

2015

用于三维封装的多层芯片键合对准技术

陈明祥，吕亚平，刘孝刚，刘胜

《华中科技大学学报(自然科学版)》

2015

用于三维封装的铜-铜低温键合技术进展

李科成，刘孝刚，陈明祥

《电子元件与材料》

2015

Gradient refractive index glass films for LED packaging

Hongru Yang, Mingxiang Chen, Simin Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2015

Phosphor settling induced mechanical degradation of silicone/phosphor composite in light emitting diode packages

Xing Chen, Simin Wang, Mingxiang Chen, Sheng Liu

Journal of Applied Polymer Science

DOI

2015

Gradient refractive index encapsulant layer for enhancing light extraction efficiency of multi-chip LED packaging

Hongru Yang, Mingxiang Chen, Simin Wang

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

复合钇铝石榴石荧光粉微晶玻璃发光性能影响因素分析

李宏，陈思，许旭佳，花宁，陈明祥

《功能材料》

2014

Effects of packaging materials on the lifetime of LED modules under high temperature test

Lei Nie, Wen-Jing Xiang, Mingxiang Chen, Hua-Jing Li, Quan Chen

2014

Research on nano-thermocompression bonding process using nanoporous copper as bonding layer

Kecheng Li, Xiaogang Liu, Mingxiang Chen, Sheng Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

Dealloyed nanoporous Cu films on ceramic substrate for low temperature bonding

Xiaogang Liu, Kecheng Li, Mingxiang Chen, Sheng Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

Preparation and performances of nanoporous copper for low temperature bonding

Kecheng Li, Xiaogang Liu, Mingxiang Chen, Sheng Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2014

Preparation of direct plated copper ceramic spreader using electroless copper as seed layer

Ziliang Hao, Xuebin Zhang, Chen Chen, Mingxiang Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2013

Research on direct plated copper heat spreader and its thermal performances for high power LED packaging

Xuebin Zhang, Mingxiang Chen, Ziliang Hao, Sheng Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2013

Cu-Sn low-temperature stack bonding for 3D packaging

Yaping Lv, Mingxian Cai, Sheng Liu, Mingxiang Chen

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2013

Preparation of phosphor glass via screen printing technology and packaged performance for LEDs

Liang Yang, Mingxiang Chen, Sheng Liu, Shenjun Zhou

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2013

Novel design and reliability assessment of a 3D DRAM stacking based on Cu-Sn micro-bump bonding and TSV interconnection technology

Cao Li, Xuefang Wang, Mingxiang Chen, Shengjun Zhou, Yaping Lv, Sheng Liu

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2013

Fabrication of gel glass containing high rendering phosphor mixture via sol-gel process for LEDs

Liang Yang, Mingxiang Chen, Sheng Liu

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2013

Drop impact simulation and experimental validation on high power light emitting diodes modules

Cao Li, Tao Peng, Xuefang Wang, Mingxiang Chen, Sheng Liu

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2012

Batch welding of aligned carbon nanotube onto metal electrodes

Mingxiang Chen, Xiaohui Song, Sheng Liu, Zhiyin Gan, Qiang Lv

Microsystem Technologies

DOI

2012

Improvement of light extraction efficiency of white LEDs using microstructure array on phosphor silicone layer

Shan Yu, Run Hu, Mingxiang Chen, Sheng Liu

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2011

大功率LED低热阻封装技术进展

陈明祥

《半导体光电》

2011

Expert advisor for integrated virtual manufacturing and reliability for TSV/SiP based modules

Zhaohui Chen, Shengjun Zhou, Zhicheng Lv, Chuan Liu, Xing Chen, Xiao Jia, Ke Zeng, Bin Song, Fulong Zhu, Mingxiang Chen, Xuefang Wang, Honghai Zhang, Sheng Liu

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2011

Study on thermal conductive adhesives for high-power LEDs packaging

Mingxiang Chen, Tianming Xu, Sheng Liu, Ching Ping Wong

DOI

2011

Low temperature thermocompression bonding based on copper nanostructure for 3D packaging

Mingxian Cai, Mingxiang Chen, Sheng Liu

DOI

2011

Development process of phosphor coating with screen printing for white LED packaging

Shan Yu, Liang Yang, Cao Bin, Huai Zheng, Mingxiang Chen, Sheng Liu

DOI

2011

Drop impact test on high power light emitting diodes module

Tao Peng, Xuefang Wang, Mingxiang Chen, Run Chen, Sheng Liu

DOI

2011

Effects of grooves substrate on thermal interface for the LED module

Tao Peng, Mingxiang Chen, Xiaogang Liu, Xiaobing Luo, Sheng Liu

DOI

2011

Bonding of carbon nanotubes onto microelectrodes by localized induction heating

Mingxiang Chen, Xiaohui Song, Qiang Lv, Zhiyin Gan, Sheng Liu

Sensors and Actuators A Physical

DOI

2011

Effective thermal conductivity of silicone/phosphor composites

Qin Zhang, Zhihua Pi, Mingxiang Chen, Xiaobing Luo, Ling Xu, Sheng Liu

Journal of Composite Materials

DOI

2011

Study on microstructures and tensile properties of active solder alloy

Mingxiang Chen, Cong Xiang Peng, Xing Chen, Sheng Liu

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2011

Comparison of LED package reliability under thermal cycling and thermal shock conditions by experimental testing and finite element simulation

Zhaohui Chen, Qin Zhang, Run Chen, Feng Jiao, Mingxiang Chen, Xiaobing Luo, Sheng Liu

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2010

Die bonding of silicon and other materials with active solder

Cong Xiang Peng, Mingxiang Chen, Sheng Liu

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2010

Wafer level bonding using localized radio-frequency induction heating

Mingxiang Chen, Wenming Liu, Yanyan Xi, Changyong Lin, Sheng Liu

Science China Technological Sciences

DOI

2009

Selective induction heating for wafer level bonding and packaging

Mingxiang Chen, Wenming Liu, Yanyan Xi, Changyong Lin, Ching Ping Wong, Sheng Liu

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI

2008

Thermo-mechanical analysis of a wafer level packaging by induction heating

Wenming Liu, Mingxiang Chen, Yanyan Xi, Changyong Lin, Sheng Liu

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

DOI

2007

LED感应局部加热封装试验研究

陈明祥，马泽涛，刘胜

《发光学报》

2006

基于微通道致冷的大功率LED阵列封装热分析

袁柳林，刘胜，陈明祥，罗小兵

《半导体光电》

2006

大功率白光LED封装设计与研究进展

陈明祥，罗小兵，马泽涛，刘胜

《半导体光电》

2006

Thermal Analysis of High Power LED Array Packaging with Microchannel Cooler

Liulin Yuan, Sheng Liu, Mingxiang Chen, Xiaobing Luo

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2006

Selective Induction Heating for Microsystem Packaging

Mingxiang Chen, Sheng Liu, Zhiyin Gan

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2006

Rapid and Selective Induction Heating for Sensor Packaging

Mingxiang Chen, Xinjian Yi, Liulin Yuan, Zhiyin Gan, Sheng Liu

International Conference on Electronic Packaging Technology (ICEPT)

DOI

2005

基于正交试验分析的阳极键合强度研究(英文)

陈明祥，易新建，甘志银，刘胜

《功能材料与器件学报》

2004

基于共晶的MEMS芯片键合技术及其应用

陈明祥，易新建，刘胜，甘志银，陈四海

《半导体光电》

2004

Wafer-level scale package of MEMS device by eutectic bonding method

Sihai Chen, Hong Ma, Mingxiang Chen, Tao Xiong, Sheng Liu, Xinjian Yi

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

DOI

2003

Eutectic bonding on large silicon die using deposited gold-tin multilayer composites

Mingxiang Chen, Sihai Chen, Xinjian Yi, Dong Shan, Sheng Liu

DOI

2003

Wafer-Level MEMS Package by Gold-Tin Bonding Method

Sihai Chen, Sheng Liu, Mingxiang Chen, Xiong Tao, Daming Zhang, Honghai Zhang, Xinjian Yi

DOI

精选作品

期刊论文

荧光转换激光光源封装用荧光玻璃膜研究进展

高亮度激光荧光光源用双面蓝宝石基荧光玻璃膜制备及其光热性能

超高速直流电沉积制备高质量图形化铜层

A Universal PiGF@Sapphire@MiG Color Converter with Synergistically Enhanced Opto‐Thermal Performance for Laser‐Driven Applications

Novel alumina heat sink structure for enhanced thermal management of phosphor-in-glass film enabling high saturation threshold in high-brightness laser lighting

Omnidirectionally Encapsulated Phosphor‐in‐Glass Film Converter for Laser‐Driven Lighting Source

Phosphor-converted white LD with high luminous efficacy through sapphire lens based PiGF

UV-Induced Surface Aminolysis of Liquid Crystal Polymer for Quasihermetic Packaging

Fabrication of Multilayer Circuit on DPC Ceramic Substrate with Polyimide

All-inorganic ceramic packaging based on moisture-resistant and heat-resistant sodium silicate adhesive

Quasi-Hermetic Sealing Technology for Three-Dimensional Ceramic Substrates Using Adhesive Bonding

Multi-Scale Research on Microcrack Sources and Propagation Induction Mechanism of TCV Structures in DPC Substrates under Temperature Cyclic Stress Loading

Synergetic improvement in opto-thermal performance of white laser diode with MgO-in-glass layer

Electrospun stretchable BNNS/PVA composite film for efficient thermal management of flexible electronics

Predictive Modeling of TCV-Cu Protrusion Under Thermal Cycling

铜-铜键合制备多层陶瓷基板技术研究

面向未来应急消防的柔性智能头盔设计

Multi-channel thermal conductive phosphor-in-glass film with a record laser power density threshold for laser lighting

Room-temperature fabrication of phosphor-in-geopolymer converter enabling high color quality for laser-driven lighting

Toward High‐Brightness Laser Lighting: Progress and Perspectives on Phosphor‐in‐Glass Films

厚膜印刷陶瓷基板的版内电阻一致性改进

三维电镀陶瓷基板激光封焊技术

基于Chip-on-TEC的高精度晶体振荡器研究

陶瓷转接板制备技术与应用进展

A Novel PiGF@Diamond Color Converter with a Record Thermal Conductivity for Laser‐Driven Projection Display

High Luminescence Saturation Y3Al5O12: Ce3+‐Diamond Composite Color Converter for High‐Brightness Laser‐Driven White Lighting

Effective heat dissipation of white laser diodes by welding metallized phosphor-sapphire

柔性电子封装技术与应用

耐高温微系统气密封装技术及高温可靠性研究

纳米铜焊膏烧结互连技术研究现状与展望

银纳米线柔性加热器在个人热管理中的研究进展

三维结构石英透镜提高DUV-LED的发光效率

High‐Performance Phosphor‐in‐Glass Film on Thermoelectric Generator for Non‐Radiative Energy Recycling in Laser Lighting

陶瓷基板表面金属层结合强度测试与失效分析

溅射覆铜陶瓷基板表面研磨技术研究

电子封装陶瓷基板表面镀金修饰与腐蚀机理

荧光转换白光激光二极管荧光玻璃主动散热研究

内嵌陶瓷电路板的PCB基板制备及其LED封装性能

深紫外LED封装技术现状与展望

Enhanced Light Extraction of DUV LEDs by Using a Quartz Lens With Three-Dimensional Structure

Reflective Phosphor-in-Glass Color Converter for Laser-Driven White Lighting

Effect of quartz lens structure on the optical performances of near-ultraviolet light-emitting diodes

电子封装陶瓷基板

Direct Ink Printing of Cavities in DPC Ceramic Substrates With Kaolin Pastes for Hermetic Packaging

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

Glass Ceramic Phosphors: Towards Long‐Lifetime High‐Power White Light‐Emitting‐Diode Applications–A Review

Gradient refractive index structure of phosphor‐in‐glass coating for packaging of white LED s

All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

Creation of three-dimensional structures by direct ink writing with kaolin suspensions

Enhanced luminous efficiency of multilayer gradient refractive index phosphor in P2O5-ZnO-B2O3-BaO glass for white light-emitting diode packages

Tunable chromaticity and enhanced luminous efficacy of white LEDs with phosphor-in-glass coating via multilayer screen-printing

High refractive index coating of phosphor-in-glass for enhanced light extraction efficiency of white LEDs

A novel copper-coated ceramic substrate prepared by nano thermocompression bonding

大功率LED封装基板技术与发展现状

功率电子封装用陶瓷基板技术与应用进展

Development of RGB phosphor-in-glass for ultraviolet-excited white light-emitting diodes packaging

Enhancement in light extraction of white leds using micro-cone patterned phosphor-in-glass

用于三维封装的多层芯片键合对准技术

用于三维封装的铜-铜低温键合技术进展

Gradient refractive index glass films for LED packaging

Phosphor settling induced mechanical degradation of silicone/phosphor composite in light emitting diode packages

Gradient refractive index encapsulant layer for enhancing light extraction efficiency of multi-chip LED packaging

复合钇铝石榴石荧光粉微晶玻璃发光性能影响因素分析

Effects of packaging materials on the lifetime of LED modules under high temperature test

Research on nano-thermocompression bonding process using nanoporous copper as bonding layer

Dealloyed nanoporous Cu films on ceramic substrate for low temperature bonding

Preparation and performances of nanoporous copper for low temperature bonding

Preparation of direct plated copper ceramic spreader using electroless copper as seed layer

Research on direct plated copper heat spreader and its thermal performances for high power LED packaging

Cu-Sn low-temperature stack bonding for 3D packaging

Preparation of phosphor glass via screen printing technology and packaged performance for LEDs

Novel design and reliability assessment of a 3D DRAM stacking based on Cu-Sn micro-bump bonding and TSV interconnection technology

Fabrication of gel glass containing high rendering phosphor mixture via sol-gel process for LEDs

Drop impact simulation and experimental validation on high power light emitting diodes modules

Batch welding of aligned carbon nanotube onto metal electrodes

Improvement of light extraction efficiency of white LEDs using microstructure array on phosphor silicone layer

大功率LED低热阻封装技术进展

Expert advisor for integrated virtual manufacturing and reliability for TSV/SiP based modules